TW200506518A - Photosensitive resin composition for black resist and light-shielding film made by using such phototsensitive resin composition for black resisit - Google Patents

Photosensitive resin composition for black resist and light-shielding film made by using such phototsensitive resin composition for black resisit

Info

Publication number
TW200506518A
TW200506518A TW093114893A TW93114893A TW200506518A TW 200506518 A TW200506518 A TW 200506518A TW 093114893 A TW093114893 A TW 093114893A TW 93114893 A TW93114893 A TW 93114893A TW 200506518 A TW200506518 A TW 200506518A
Authority
TW
Taiwan
Prior art keywords
resin composition
black
light
photosensitive resin
monomer
Prior art date
Application number
TW093114893A
Other languages
Chinese (zh)
Other versions
TWI318723B (en
Inventor
Manabu Higashi
Masanori Kono
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Publication of TW200506518A publication Critical patent/TW200506518A/en
Application granted granted Critical
Publication of TWI318723B publication Critical patent/TWI318723B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Optical Filters (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)

Abstract

This invention provides a photosensitive resin composition for black resist, which is suitable for thick film with all excellence in pattern size stability, development margin, pattern adherence, and sharpness of pattern edge configuration. The photosensitive resin composition for black resist comprises the following components as essential components: (A) compounds containing unsaturated group, which is obtained by reacting the reactant of epoxies derivate from biophenols and (meth)acrylic acid with polyacid anhydride; (B) Basic soluble resin having Mw 7000 to 120000, acid value 70 to 150 (KOGH mg/g), which is copolymers by polymerizing ethylene unsaturated monomer having N-substituted maleimide and carboxyl group, and monomer mixtures having other ethylene unsaturated monomer; (C) photo-polymerization monomer having ethylene unsaturation; (D) photo-polymerization initiator; (E) black organic pigment, mixing organic pigment or light-shielding disperse pigment made by light-shielding material.
TW093114893A 2003-06-05 2004-05-26 Photosensitive resin composition for black resist and light-shielding film made by using such photosensitive resin composition for black resisit TWI318723B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003160954A JP4290483B2 (en) 2003-06-05 2003-06-05 Photosensitive resin composition for black resist and light-shielding film formed using the same

Publications (2)

Publication Number Publication Date
TW200506518A true TW200506518A (en) 2005-02-16
TWI318723B TWI318723B (en) 2009-12-21

Family

ID=34053578

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093114893A TWI318723B (en) 2003-06-05 2004-05-26 Photosensitive resin composition for black resist and light-shielding film made by using such photosensitive resin composition for black resisit

Country Status (3)

Country Link
JP (1) JP4290483B2 (en)
KR (1) KR101051398B1 (en)
TW (1) TWI318723B (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200625002A (en) * 2005-01-12 2006-07-16 Chi Mei Corp Photosensitive resin composition for color filter
JP2006251495A (en) * 2005-03-11 2006-09-21 Adeka Corp Alkali developable photosensitive resin composition
JP4508924B2 (en) * 2005-03-29 2010-07-21 新日鐵化学株式会社 Photosensitive resin composition and color filter using the same
JP5044893B2 (en) * 2005-03-31 2012-10-10 凸版印刷株式会社 Color filter
JP5070682B2 (en) * 2005-04-08 2012-11-14 大日本印刷株式会社 Color filter for IPS
JP2007071994A (en) * 2005-09-05 2007-03-22 Tokyo Ohka Kogyo Co Ltd Black photosensitive resin composition
KR100655047B1 (en) * 2005-12-30 2006-12-06 제일모직주식회사 Photosensitive resin composition and black matrix thereof
KR100740550B1 (en) * 2006-02-10 2007-07-18 주식회사 코오롱 Composition for resin black matrix
JP5073342B2 (en) * 2006-03-31 2012-11-14 新日鐵化学株式会社 Photosensitive resin composition and color filter using the same
JP4745110B2 (en) * 2006-04-19 2011-08-10 東京応化工業株式会社 Photosensitive composition and color filter formed with the photosensitive composition
JP4949809B2 (en) * 2006-11-14 2012-06-13 東京応化工業株式会社 Colored photosensitive resin composition
JP4890314B2 (en) * 2007-03-29 2012-03-07 新日鐵化学株式会社 Photosensitive resin composition for black resist
JP5270113B2 (en) * 2007-06-06 2013-08-21 新日鉄住金化学株式会社 Photosensitive resin composition for black resist, light shielding film and color filter using the same
CN101548203B (en) * 2007-06-11 2012-03-07 三菱化学株式会社 Photosensitive color resin composition for color filter, color filter, liquid crystal display, and organic el display
KR101237613B1 (en) * 2008-02-18 2013-02-26 주식회사 엘지화학 Alkali soluble epoxy resin composition improved stability and photosensitive resin composition comprising the same
JP5180765B2 (en) * 2008-10-02 2013-04-10 新日鉄住金化学株式会社 Alkali-developable photosensitive resin composition, display element partition and display element formed using the same
KR101225955B1 (en) 2008-12-22 2013-01-24 제일모직주식회사 Ink jet resin composition
KR101068622B1 (en) * 2009-12-22 2011-09-28 주식회사 엘지화학 The high lightshielding blackmatrix composition having improved adhesion properties
KR101445906B1 (en) * 2011-02-01 2014-10-01 주식회사 엘지화학 Alkali developable resins and photosensitive resin composition comprising the same
JP2013134263A (en) * 2011-12-22 2013-07-08 Tokyo Ohka Kogyo Co Ltd Photosensitive resin composition for black column spacer, black column spacer, display device, and method for forming black column spacer
JP2014209172A (en) * 2013-03-25 2014-11-06 太陽インキ製造株式会社 Photosensitive resin composition, cured coating film of the same, and printed wiring board
JP6307237B2 (en) * 2013-09-30 2018-04-04 新日鉄住金化学株式会社 Black photosensitive resin composition and cured film thereof, and color filter and touch panel having the cured film
KR102344138B1 (en) * 2014-03-31 2021-12-28 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 Photosensitive resin composition for light shielding film, light shielding film using the same, and color filter including that film
JP5916939B2 (en) * 2015-12-24 2016-05-11 東京応化工業株式会社 Method for forming black column spacer
WO2018211890A1 (en) 2017-05-19 2018-11-22 ナガセケムテックス株式会社 Alkali soluble resin
KR102565582B1 (en) * 2017-06-12 2023-08-11 롬엔드하스전자재료코리아유한회사 Colored photosensitive resin composition and light shielding spacer prepared therefrom

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002040225A (en) * 2000-07-27 2002-02-06 Jsr Corp Radiation sensitive composition for color liquid crystal display device and color liquid crystal display device
JP2002121258A (en) * 2000-08-10 2002-04-23 Dainippon Ink & Chem Inc Method for producing energy ray-curable resin and energy ray-curable resin composition for resist
JP4404330B2 (en) * 2001-01-09 2010-01-27 東京応化工業株式会社 Photopolymerizable composition and method for producing color filter using the composition
JP2003066597A (en) * 2001-08-29 2003-03-05 Sumitomo Chem Co Ltd Black photosensitive resin composition for forming black matrix

Also Published As

Publication number Publication date
JP2004361736A (en) 2004-12-24
KR20040105575A (en) 2004-12-16
TWI318723B (en) 2009-12-21
KR101051398B1 (en) 2011-07-22
JP4290483B2 (en) 2009-07-08

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