TW200504229A - Copper alloy with high strength and high conductivity - Google Patents

Copper alloy with high strength and high conductivity

Info

Publication number
TW200504229A
TW200504229A TW093119003A TW93119003A TW200504229A TW 200504229 A TW200504229 A TW 200504229A TW 093119003 A TW093119003 A TW 093119003A TW 93119003 A TW93119003 A TW 93119003A TW 200504229 A TW200504229 A TW 200504229A
Authority
TW
Taiwan
Prior art keywords
copper alloy
high strength
high conductivity
strength
conductivity
Prior art date
Application number
TW093119003A
Other languages
English (en)
Other versions
TWI263685B (en
Inventor
Kazuhiko Kan
Kazuhiko Fukamachi
Original Assignee
Nikko Metal Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikko Metal Mfg Co Ltd filed Critical Nikko Metal Mfg Co Ltd
Publication of TW200504229A publication Critical patent/TW200504229A/zh
Application granted granted Critical
Publication of TWI263685B publication Critical patent/TWI263685B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/01—Alloys based on copper with aluminium as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C2200/00—Crystalline structure
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C2202/00—Physical properties
TW093119003A 2003-07-09 2004-06-29 Copper alloy with high strength and high conductivity TWI263685B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003272240A JP4087307B2 (ja) 2003-07-09 2003-07-09 延性に優れた高力高導電性銅合金

Publications (2)

Publication Number Publication Date
TW200504229A true TW200504229A (en) 2005-02-01
TWI263685B TWI263685B (en) 2006-10-11

Family

ID=34209858

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093119003A TWI263685B (en) 2003-07-09 2004-06-29 Copper alloy with high strength and high conductivity

Country Status (4)

Country Link
JP (1) JP4087307B2 (zh)
KR (1) KR100592205B1 (zh)
CN (1) CN100363518C (zh)
TW (1) TWI263685B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI480394B (zh) * 2010-02-24 2015-04-11 Mitsubishi Shindo Kk Cu-Mg-P copper alloy strip and its manufacturing method
TWI571518B (zh) * 2011-08-29 2017-02-21 Furukawa Electric Co Ltd Copper alloy material and manufacturing method thereof

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1803829B1 (en) 2004-08-17 2013-05-22 Kabushiki Kaisha Kobe Seiko Sho Copper alloy plate for electric and electronic parts having bendability
CN101899587B (zh) 2006-07-21 2012-07-04 株式会社神户制钢所 电气电子零件用铜合金板
KR101227315B1 (ko) 2007-08-07 2013-01-28 가부시키가이샤 고베 세이코쇼 구리 합금판
WO2009022484A1 (ja) * 2007-08-14 2009-02-19 Sumitomo Electric Industries, Ltd. 超電導テープおよび超電導テープの製造方法
JP2008088558A (ja) * 2007-10-17 2008-04-17 Nikko Kinzoku Kk 延性に優れた高力高導電性銅合金
JP4630323B2 (ja) 2007-10-23 2011-02-09 株式会社コベルコ マテリアル銅管 破壊強度に優れた熱交換器用銅合金管
JP4968533B2 (ja) * 2007-11-30 2012-07-04 日立電線株式会社 電気・電子部品用銅合金材
CN101981212A (zh) * 2008-03-31 2011-02-23 Jx日矿日石金属株式会社 用于导电性弹性材料的Cu-Ni-Si系合金
US8876990B2 (en) 2009-08-20 2014-11-04 Massachusetts Institute Of Technology Thermo-mechanical process to enhance the quality of grain boundary networks
CN101818283B (zh) * 2010-02-25 2011-12-14 长沙中工新材料有限公司 一种大功率调频调速异步牵引电机用铜合金导条和端环及其制备方法
CN103502485B (zh) * 2011-03-31 2015-11-25 国立大学法人东北大学 铜合金及铜合金的制备方法
JP5869288B2 (ja) * 2011-10-14 2016-02-24 三菱伸銅株式会社 曲げ加工性に優れた異方性の少ない異形断面銅合金板及びその製造方法
JP5802150B2 (ja) 2012-02-24 2015-10-28 株式会社神戸製鋼所 銅合金
JP6736869B2 (ja) * 2015-11-09 2020-08-05 三菱マテリアル株式会社 銅合金素材
CN107046768B (zh) * 2016-02-05 2019-12-31 Ｊｘ金属株式会社 柔性印刷基板用铜箔、使用它的覆铜层叠体、柔性印刷基板和电子器件
CN107828985A (zh) * 2017-11-30 2018-03-23 江西理工大学 Cu‑Cr‑Zr‑Ni‑Al铜合金、线材及其制备方法
JP6900137B1 (ja) * 2020-01-14 2021-07-07 古河電気工業株式会社 銅合金板材およびその製造方法、ならびに電気・電子部品用部材
CN111621666B (zh) * 2020-06-22 2021-05-07 陕西斯瑞新材料股份有限公司 一种Cu-Cr系列合金板带的轧制方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07122108B2 (ja) * 1991-08-21 1995-12-25 日鉱金属株式会社 曲げ性及び応力緩和特性に優る電子機器用高力高導電性銅合金
KR0175968B1 (ko) * 1994-03-22 1999-02-18 코오노 히로노리 전자기기용 고강도고도전성 구리합금
KR100513943B1 (ko) * 2001-03-27 2005-09-09 닛꼬 긴조꾸 가꼬 가부시키가이샤 구리 및 구리합금과 그 제조방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI480394B (zh) * 2010-02-24 2015-04-11 Mitsubishi Shindo Kk Cu-Mg-P copper alloy strip and its manufacturing method
TWI571518B (zh) * 2011-08-29 2017-02-21 Furukawa Electric Co Ltd Copper alloy material and manufacturing method thereof

Also Published As

Publication number Publication date
TWI263685B (en) 2006-10-11
KR20050007139A (ko) 2005-01-17
KR100592205B1 (ko) 2006-06-26
CN100363518C (zh) 2008-01-23
JP2005029857A (ja) 2005-02-03
CN1598021A (zh) 2005-03-23
JP4087307B2 (ja) 2008-05-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees