TW200501383A - Semiconductor device, semiconductor body and method of manufacturing thereof - Google Patents

Semiconductor device, semiconductor body and method of manufacturing thereof

Info

Publication number
TW200501383A
TW200501383A TW093105717A TW93105717A TW200501383A TW 200501383 A TW200501383 A TW 200501383A TW 093105717 A TW093105717 A TW 093105717A TW 93105717 A TW93105717 A TW 93105717A TW 200501383 A TW200501383 A TW 200501383A
Authority
TW
Taiwan
Prior art keywords
connection
semiconductor body
connection regions
regions
semiconductor
Prior art date
Application number
TW093105717A
Other languages
English (en)
Inventor
Ouden Josephus Adrianus Augustinus Den
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of TW200501383A publication Critical patent/TW200501383A/zh

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    • HELECTRICITY
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    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • H01L24/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49503Lead-frames or other flat leads characterised by the die pad
    • H01L23/4951Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW093105717A 2003-03-07 2004-03-04 Semiconductor device, semiconductor body and method of manufacturing thereof TW200501383A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP03100568 2003-03-07

Publications (1)

Publication Number Publication Date
TW200501383A true TW200501383A (en) 2005-01-01

Family

ID=32946923

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093105717A TW200501383A (en) 2003-03-07 2004-03-04 Semiconductor device, semiconductor body and method of manufacturing thereof

Country Status (8)

Country Link
US (1) US7196409B2 (zh)
EP (1) EP1604401B1 (zh)
JP (1) JP2006520102A (zh)
CN (1) CN100401510C (zh)
AT (1) ATE388488T1 (zh)
DE (1) DE602004012235T2 (zh)
TW (1) TW200501383A (zh)
WO (1) WO2004079822A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI411051B (zh) * 2009-12-02 2013-10-01 Mstar Semiconductor Inc 封裝層疊方法與結構及其電路板系統

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WO2004079822A1 (en) 2004-09-16
US20060202327A1 (en) 2006-09-14
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CN1757110A (zh) 2006-04-05
DE602004012235D1 (de) 2008-04-17
ATE388488T1 (de) 2008-03-15
CN100401510C (zh) 2008-07-09
EP1604401A1 (en) 2005-12-14
EP1604401B1 (en) 2008-03-05
DE602004012235T2 (de) 2009-03-19

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