TW200423474A - Paste circuit, paste circuit sheet and manufacturing method of paste circuit - Google Patents
Paste circuit, paste circuit sheet and manufacturing method of paste circuit Download PDFInfo
- Publication number
- TW200423474A TW200423474A TW093101658A TW93101658A TW200423474A TW 200423474 A TW200423474 A TW 200423474A TW 093101658 A TW093101658 A TW 093101658A TW 93101658 A TW93101658 A TW 93101658A TW 200423474 A TW200423474 A TW 200423474A
- Authority
- TW
- Taiwan
- Prior art keywords
- sheet
- adhesive
- wiring portion
- adhesive layer
- layer
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 31
- 239000012790 adhesive layer Substances 0.000 claims abstract description 98
- 239000010410 layer Substances 0.000 claims abstract description 67
- 239000000463 material Substances 0.000 claims abstract description 47
- 239000000853 adhesive Substances 0.000 claims description 108
- 230000001070 adhesive effect Effects 0.000 claims description 107
- 239000000758 substrate Substances 0.000 claims description 68
- 230000001681 protective effect Effects 0.000 claims description 45
- 239000004020 conductor Substances 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 18
- 238000004080 punching Methods 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 2
- 239000002023 wood Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 abstract description 47
- 238000010030 laminating Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 12
- 239000005357 flat glass Substances 0.000 description 9
- 238000005520 cutting process Methods 0.000 description 7
- 238000009434 installation Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000003522 acrylic cement Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005056 compaction Methods 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 241000872198 Serjania polyphylla Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000009490 roller compaction Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Classifications
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47L—DOMESTIC WASHING OR CLEANING; SUCTION CLEANERS IN GENERAL
- A47L15/00—Washing or rinsing machines for crockery or tableware
- A47L15/02—Washing or rinsing machines for crockery or tableware with circulation and agitation of the cleaning liquid in the cleaning chamber containing a stationary basket
- A47L15/13—Washing or rinsing machines for crockery or tableware with circulation and agitation of the cleaning liquid in the cleaning chamber containing a stationary basket using sonic or ultrasonic waves
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47L—DOMESTIC WASHING OR CLEANING; SUCTION CLEANERS IN GENERAL
- A47L2601/00—Washing methods characterised by the use of a particular treatment
- A47L2601/17—Sonic or ultrasonic waves
Landscapes
- Support Of Aerials (AREA)
- Details Of Aerials (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003111728 | 2003-04-16 | ||
| JP2003299959A JP3746500B2 (ja) | 2003-04-16 | 2003-08-25 | 貼付回路シート及び貼付回路シートの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200423474A true TW200423474A (en) | 2004-11-01 |
| TWI318478B TWI318478B (enExample) | 2009-12-11 |
Family
ID=33513212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093101658A TW200423474A (en) | 2003-04-16 | 2004-01-20 | Paste circuit, paste circuit sheet and manufacturing method of paste circuit |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3746500B2 (enExample) |
| KR (1) | KR100635178B1 (enExample) |
| TW (1) | TW200423474A (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4021911B2 (ja) * | 2004-05-19 | 2007-12-12 | 原田工業株式会社 | フィルムアンテナ |
| JP4260782B2 (ja) * | 2005-07-19 | 2009-04-30 | 株式会社慶洋エンジニアリング | 貼付回路及び貼付回路シート |
| JP2007274528A (ja) * | 2006-03-31 | 2007-10-18 | Sumitomo Metal Mining Co Ltd | フィルムアンテナ |
| JP5052573B2 (ja) * | 2009-08-24 | 2012-10-17 | 株式会社慶洋エンジニアリング | フィルムアンテナの製造方法 |
| JP2014220392A (ja) * | 2013-05-08 | 2014-11-20 | 住友電気工業株式会社 | 配線シートの製造方法、及び配線シート貼着構造体の製造方法 |
| KR102875825B1 (ko) * | 2021-12-15 | 2025-10-22 | 동우 화인켐 주식회사 | 도전 패턴, 이를 포함하는 안테나 소자 및 이를 포함하는 화상 표시 장치 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11305665A (ja) | 1998-04-27 | 1999-11-05 | Sunrise:Kk | ステッカー |
-
2003
- 2003-08-25 JP JP2003299959A patent/JP3746500B2/ja not_active Expired - Fee Related
-
2004
- 2004-01-20 TW TW093101658A patent/TW200423474A/zh not_active IP Right Cessation
- 2004-03-30 KR KR1020040021682A patent/KR100635178B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TWI318478B (enExample) | 2009-12-11 |
| JP3746500B2 (ja) | 2006-02-15 |
| KR100635178B1 (ko) | 2006-10-16 |
| JP2004336698A (ja) | 2004-11-25 |
| KR20040090417A (ko) | 2004-10-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |