政、發明說明··Policy and Invention Explanation ··
【明所屬技冬奸領域I 發明所屬之技術領域 本舍明係有關於用以處理液晶顯示裝置等所使用之玻 璃基板之基板處理裝置及基板處理方法。 I：先前技術】 習知技術 於LCD(Liquid Crystal Display)等之製造步驟中，為了 在LCD用玻璃基板上形成iT〇(incjiUm Tin Oxide)之薄膜或 電極圖案，係利用與使用在製造半導體裝置上同樣的微影 成像技術。微影成像技術係將光阻劑塗布於玻璃基板，且 使其曝光，並進行顯像。在塗上光阻劑後且在曝光前，或 在曝光後顯像前對基板進行加熱，該等加熱處理係為了使 光阻劑中之溶劑蒸發，且減輕因曝光所產生之駐波效果導 致光阻圖案變形的情況發生。 塗布光阻劑之步驟係利用例如塗布裝置將光阻劑塗布 於基板上。在塗上光阻劑後，利用減壓乾燥裝置進行使已 塗上光阻劑之基板乾燥的處理。於該乾燥處理後，藉由邊 緣去除裝置除去附著於基板邊緣部之多餘的光阻劑。 該等塗布裝置或減壓乾燥裝置、加熱裝置等具有用以 從外部之搬送機ϋ人接收基板，且將基板傳送至該搬送機 器人之升降桿。 另，與本發明相關之習知技術文獻係揭示於例如專利 文獻1。 專利文獻 曰本專利公開公報特開2000 — 124127號（特別是段落 [〇〇89]〜段落[0091]、第16圖等）。 由於前述升降桿從下方支持基板，故有例如升降桿的 的痕跡轉寫至基板之製品領域的問題，一般推定會發生該 轉寫係由於近年來利用高感度型光阻液的關係。 特別是由於最近的玻璃基板逐漸大型化，且因其本身 的重里會向下彎曲，故從下方支持之升降桿的數量有增加 勺傾向因此，用以升降驅動升降桿之氣壓缸等零件的數 量也會增加。 在製造液晶裝置或半導體的領域中，必須極力減少粒 生於此上述氣壓缸之驅動機構係使用較可能產 生粒子的氣壓缸等。因此，為了減少好，必須極力減少 氣壓紅等驅動機構的數量…減少氣壓缸等之驅動量也 有助於減少粒子。 有4皿於上述情況，本發明之目的在於可極力抑制粒子 的產生且防止升降桿等支持構件轉寫至基板之製品領 基板處理裝置及基板處理方法。 【智^明内溶^】 發明概要 /、T狀％邳關之暴板恿理 trrr係設置成可升降，且至少保持基板之邊緣^ 弟1驅動和係用以驅動前述保持部之升降動作；第 構件，係用以支持前述基板之第丨領域；第2支持構件，^ 。^持與則述基板之前述第丨領域不同之第2領域；及第2 " 係適§地切換前述第1支持構件與前述第2支持構 升p久使忒第1支持構件與第2支持構件相對於前述保持部 、本务明中，所謂適當地切換意指依照第1基板與第2 基板的不同來切換之意。例如，可依照作業員預先輸入之 土板勺不同（第i基板或2基板的種類）來切換。又，例如，亦 可設置例如感測器等用以讀取前述基板之種類的機構，並 根據所讀取之結果來切換。 於本發明中，藉由第1驅動部來升降驅動保持部，且適 當地切換第i支持構件與第2支持構件’並使該第以持構件 與第2支持構件㈣於前述㈣部進行升_動。於本發明 中’若第1領域及第2領域為基板之製品領域以外的領域， 即，非製品領域’則可防止第1或第2支持構件轉寫至製品 領域。又’於本發财，由於使第1及第2支持構件相對於 保持部進行升降驅動，故可相對減少該等由第2驅動部所產 生之驅動量，而可極力抑制粒子的產生。 於本發明之-形態中，基板處理裝置包含：處理室， 係用以收容前述基板且進行預定處理；減壓機構，係使前 述處理至減控制機構，係依照前述減壓機構之減壓度 來控制前述第1支持構件或第2支持構件之升降驅動。例 如，當收容於處理室之基板較大型時，隨著腔室内的減壓 度變大’即’隨著壓力變小，基板有向下彎、曲的傾向。此 時’基板的+央部妹接於例如未支持基糾支持構件之 虞。一旦發生抵接的情形，則有該支持構件的轉寫痕跡殘 留於製品領域的問題。為了防止該狀態發生，本發明係依 …、減壓度來控制未支持基板之第1支持構件或第2支持構件 的升降驅動。 於本發明之一形態中，前述第2驅動部係設為與前述保 持部之升降動作一體地動作者。於本發明中，藉由利用第i 驅動部使保持部升降，可使第2驅動部升降。藉此，可減少 第2驅動部所進行之第丨或第2支持構件的升降驅動量。 興本發明相關之基板處理裝 一一 σ •昂^又付稱什，係 用=支持前述基板之第丨領域；第丨推壓構件，係從下方推 壓則述第1支持構件’使前述第丨支持構件從前述板突出； 第2支持構件，係配置成與前述第丨支持構件隔著第丨間隔， 且用以支持與前述基板之前述第丨領域不同之第2領域；以 推壓構件，係從下方推壓前述第2支持構件，使前述第2支 持構件從前述板突出；連結構件，係崎與前述第丨間隔不 同之第2間隔連結前述第丨推壓構件與第2推壓構件； =件述連結構件朝就方向移動，並使前述第冰壓 件與前ΙΓ1支持構件適當地相向，且使前述第2推壓構 /、攻弟2支持構件適當地相向。 、 精由驅動部使連結第1及第2推壓槿杜夕 動，祕適#地祕且升降_仏切構件盘 寺構件。驅動部愈多’粒子則會愈多。於本發 了猎由1個贼細立β办、牡—你 換動作。:Γ= 構件與第2支持構件的切 稽此，可極力抑制粒子的產生。又，於本發明中， ^00421423 若第1領域及第2領域為基板之製品領域以外的領域即， 非製品領域，則可防止第！或第2支持構件轉寫至製品領域。 與本發明相關之基板處理方法係基板處理裝置之處理 方法，該基板處理裝置包含：板，係用以載置基板，以處 5理該基板，·第】支持構件，係用以支持前述基板之第！領域； 弟！推Μ件，係從下方減前述第〗支持構件，使前述扪 支持構件從前述板突出；第2支持構件，係配置成與前述第 】支持構件隔著第1卩為’且心切與前述基板之前述第】 ίο 15 領域不同之第2領域；第2減構件，係從下方減前逃第2 支持構件，使前述第2支持構件從前述板突出；及連 2係隔著與前述第〗間隔不同之第2間隔連結前述第 i轉與第2推賴件，前述基板處理方法包括下列步驟：使 則述連結構件移動，並使前述第〗推㈣ :件相向;及使前述連結構件移動’並使前述第2推= 與前述第2支持構件相向。 構件 於本兔明中’藉由例如丨個驅動裝置使連 =件之連結構件移動，藉此適當地切換且她= 動裝置==件。於本發明中’可藉一 末進仃第1支持構件與第2支持構件的切換 此:可極力抑制粒子的產生。又，於本發明中，若藉 二第2領域為基板之製品領域以外的領域， = 域，、則可防止第!或第2支持構件轉寫至製品領域。一員 圖式簡單說明 第1圖係顯示與本發明—實施形態相關塗布顯像處理 20 200421423 裝置的整體構造之平面圖。 第2圖係第1圖所示之塗布顯像處理裝置的正視圖。 第3圖係第1圖所示之塗布顯像處理裝置的後視圖。 第4圖係顯示與本發明一實施形態相關之減壓乾燥單 5 元的透視圖。 第5圖係第4圖所示之減壓乾燥單元的截面圖。 第6圖係第4圖所示之減壓乾燥單元的截面圖。 第7圖係顯示2面基板之製品領域的平面圖。 第8圖係顯示3面基板之製品領域的平面圖。 10 第9圖係顯示處理2面基板之減壓乾燥單元的動作。 第10圖係顯示處理3面基板之減壓乾燥單元的動作。 第11圖係顯示處理5面基板之減壓乾燥單元的截面圖。 第12圖係與本發明其他實施形態相關之處理單元的板 之平面圖。 15 第13圖係顯示第12圖所示之處理單元的截面圖。 第14圖係顯示設於光阻劑處理區塊之搬送機器人的平 面圖。[Technical Field of Ming Dynasty I. Technical Field of the Invention The present invention relates to a substrate processing apparatus and a substrate processing method for processing a glass substrate used in a liquid crystal display device and the like. I: Prior technology] In the manufacturing process of LCD (Liquid Crystal Display) and other conventional technologies, in order to form a thin film or electrode pattern of iT0 (incjiUm Tin Oxide) on a glass substrate for LCD, it is used and used in the manufacture of semiconductor devices. The same lithography technique. Lithographic imaging technology involves applying a photoresist to a glass substrate, exposing it, and developing it. The substrate is heated after the photoresist is applied, before exposure, or before development after exposure. These heat treatments are to evaporate the solvent in the photoresist and reduce the standing wave effect caused by exposure. The photoresist pattern is deformed. The step of applying the photoresist is, for example, applying the photoresist to the substrate using a coating device. After the photoresist is applied, the substrate on which the photoresist is applied is dried using a reduced-pressure drying device. After the drying process, the excess photoresist adhering to the edge portion of the substrate is removed by an edge removing device. These coating apparatuses, decompression drying apparatuses, heating apparatuses, etc. have lifting rods for receiving substrates from an external transporter and transporting the substrates to the robot. A conventional technology document related to the present invention is disclosed in, for example, Patent Document 1. Patent Literature Japanese Patent Laid-Open Publication No. 2000-124127 (especially paragraphs [0089] to [0091], FIG. 16 and the like). Since the lifting rod supports the substrate from below, there is a problem in which, for example, the traces of the lifting rod are transferred to the product field of the substrate. It is generally estimated that this transfer occurs due to the use of a high-sensitivity photoresist in recent years. In particular, as the recent glass substrates have gradually increased in size, and because their own weight will bend downwards, the number of lift rods supported from below tends to increase. Therefore, the number of parts such as pneumatic cylinders used to lift and lift the lift rods is increased. Will increase. In the field of manufacturing a liquid crystal device or a semiconductor, it is necessary to minimize the drive mechanism of particles generated in the above-mentioned pneumatic cylinder. A pneumatic cylinder or the like which is more likely to generate particles is used. Therefore, in order to reduce it, the number of driving mechanisms such as pneumatic red must be reduced as much as possible ... Reducing the driving volume of pneumatic cylinders and the like also helps to reduce particles. There are four dishes in the above case, and the object of the present invention is to suppress the generation of particles as much as possible and prevent the supporting members such as the lifting rod from being transferred to the product collar substrate processing apparatus and substrate processing method. [智 ^ 明 内 融 ^] Summary of the invention /, T-shaped% guanguan's storm plate trrr is set to be able to lift, and at least to maintain the edge of the substrate ^ 1 drive and is used to drive the lifting action of the aforementioned holding part The second component is used to support the first field of the substrate; the second support component is ^. ^ The second area which is different from the aforementioned first area of the substrate; and the second " system is to switch between the first support member and the second support structure as described above. With respect to the holding member and the description of the present invention, the support member means that the appropriate switching means switching according to the difference between the first substrate and the second substrate. For example, it can be switched according to the soil spoon (type of the i-th or second substrate) input by the operator in advance. Further, for example, a mechanism for reading the type of the substrate, such as a sensor, may be provided, and switching may be performed according to the read result. In the present invention, the driving holding section is raised and lowered by the first driving section, and the i-th support member and the second support member are appropriately switched, and the first holding member and the second support member are raised in the aforementioned cymbal section to be raised. _move. In the present invention, 'if the first field and the second field are fields other than the product field of the substrate, that is, the non-product field', it is possible to prevent the first or second support member from being transferred to the product field. In addition, since the first and second support members are driven up and down with respect to the holding portion, the amount of driving generated by the second driving portion can be relatively reduced, and the generation of particles can be suppressed as much as possible. In the aspect of the present invention, the substrate processing apparatus includes a processing chamber for accommodating the substrate and performing a predetermined process; a decompression mechanism for bringing the aforementioned processing to a decompression control mechanism and a degree of decompression according to the decompression mechanism. To control the lifting drive of the first support member or the second support member. For example, when the substrate accommodated in the processing chamber is large, the substrate tends to bend downward and bend as the pressure in the chamber becomes larger, that is, as the pressure becomes smaller. At this time, the + substrate of the substrate may be connected to, for example, a base supporting member which is not supported. If the abutment occurs, there is a problem that the transfer marks of the supporting member remain in the product field. In order to prevent this state from occurring, the present invention controls the raising and lowering driving of the first support member or the second support member that does not support the substrate according to the degree of decompression. In one aspect of the present invention, the second driving unit is configured to operate integrally with the lifting operation of the holding unit. In the present invention, the second driving section can be raised and lowered by raising and lowering the holding section with the i-th driving section. As a result, the amount of lifting driving of the second or second supporting member by the second driving section can be reduced. For the substrate processing related to the present invention, a σ • Ang ^ is also called, it is used to support the first 丨 field of the substrate; the 丨 pushing member, the first supporting member is described from below to make the aforementioned The first support member protrudes from the aforementioned plate; the second support member is configured to be spaced apart from the aforementioned first support member by a first interval and is used to support a second domain different from the aforementioned first domain of the substrate; The member pushes the second support member from below to make the second support member protrude from the plate; the connecting member connects the second pushing member and the second pushing member at a second interval different from the second interval. Pressing member; = the connecting member moves in the right direction, and the aforementioned ice pressing member and the front ΓΓ1 supporting member are appropriately opposed to each other, and the aforementioned second pressing mechanism and attacker 2 supporting member are appropriately opposed to each other. The driving unit makes the connection of the first and the second to push the hibiscus hibiscus. The more driving parts, the more particles there are. Yu Benfa hunted by a thief to set up β, Mu-you change action. : Γ = Examination of the member and the second support member minimizes the generation of particles. Furthermore, in the present invention, if the first and second fields are areas other than the product field of substrates, that is, non-product fields, the first field can be prevented! Or the second supporting member is transferred to the product field. The substrate processing method related to the present invention is a processing method of a substrate processing apparatus. The substrate processing apparatus includes a board for placing a substrate for processing the substrate, and a support member for supporting the aforementioned substrate. Number one! Field; brother! The pusher is to reduce the aforementioned support member from below, so that the support member protrudes from the board; the second support member is configured to be separated from the support member through the first support member and is tangent to the substrate The aforementioned section] ίο 15 The second section that is different from the field; the second reduction member is a second support member that is subtracted from below to escape the second support member so that the second support member protrudes from the board; and the second series is separated from the first section by The second interval with a different interval connects the i-th turn and the second pusher, and the substrate processing method includes the following steps: moving the connecting member, and moving the first pushing member toward each other; and moving the connecting member 'Make the second push = face the second support member. Component In this rabbit's Ming ’, the linking component of the link is moved by, for example, a driving device, so that it is properly switched and she = the moving device == the link. In the present invention, the switching between the first support member and the second support member can be advanced by one. This: The generation of particles can be suppressed as much as possible. Furthermore, in the present invention, if the second and second fields are used as fields other than the product field of the substrate, it is possible to prevent the second or second support member from being transferred to the product field. A Brief Description of the Drawings Fig. 1 is a plan view showing the overall structure of the coating and developing process related to the embodiment of the present invention 20 200421423. Fig. 2 is a front view of the coating development processing apparatus shown in Fig. 1. FIG. 3 is a rear view of the coating development processing apparatus shown in FIG. 1. FIG. Fig. 4 is a perspective view showing a reduced-pressure drying unit according to an embodiment of the present invention. FIG. 5 is a cross-sectional view of the reduced-pressure drying unit shown in FIG. 4. Fig. 6 is a cross-sectional view of the reduced-pressure drying unit shown in Fig. 4. Fig. 7 is a plan view showing a product field of a two-sided substrate. Fig. 8 is a plan view showing a product field of a three-sided substrate. 10 Figure 9 shows the operation of a vacuum drying unit that processes a two-sided substrate. Fig. 10 shows the operation of a reduced-pressure drying unit for processing three-sided substrates. Fig. 11 is a cross-sectional view showing a reduced-pressure drying unit for processing a 5-sided substrate. Fig. 12 is a plan view of a plate of a processing unit according to another embodiment of the present invention. 15 Figure 13 is a cross-sectional view showing the processing unit shown in Figure 12. Fig. 14 is a plan view showing a transfer robot provided in a photoresist processing block.
L實施方式J 發明之實施形態 20 以下，根據圖式說明本發明實施形態。 第1圖係顯示本發明所適用之LCD基板之塗布顯像處 理裝置的平面圖，第2圖係其正視圖，第3圖係其後視圖。 該塗布顯像處理裝置1包含：匣盒站2，係用以載置用 來收容多數玻璃基板G之匣盒C ;處理部3，係具有用以在 10 200421423 基板G施加包含光阻劑塗布及顯像之一連串處理的多數處 理單元；及介面部4，係用以於與曝光裝置32之間進行基板 G之傳送，又，匣盒站2及介面部4分別配置於處理部3兩端。 匣盒站2具有用以在匣盒c與處理部3之間進行LCD基 5板之搬送的搬送機構10。而且，於匣盒站2中進行匣盒C之 搬入搬出。又，搬送機構10具有可在沿著匣盒之配列方向 設置之搬送路12上移動之搬送臂部11，藉由該搬送臂部11 可在匣盒C與處理部3之間進行基板〇之搬送。 於處理部3設有沿著與匣盒站2中匣盒c之配列方向（γ 1〇方向）垂直之方向（X方向）設置之主搬送部3a與沿著該主搬 送部3a並設有包含光阻劑塗布處理單元(CT)之各處理單元 之上游部3b及並設有包含顯像處理單元(DEV)之各處理單 元及下游部3c。 於主搬送部3a設有沿著X方向設置之搬送路31及構成 15為可沿著該搬送路31移動且朝X方向搬送玻璃基板G之搬 送梭23。該搬送梭23係例如藉由支持桿來保持基板g以搬送 之。又，於主搬送部3a之介面部4側端部設有用以在處理部 3與介面部4之間進行基板G之傳送之垂直搬送單元7。 於上游部3b中，在匣盒站2側端部從匣盒站2側起設有 20用以除去基板G上之有機物的激分子UV處理單元（e — Uv)19及利用擦洗刷對基板G施加洗淨處理之洗刷洗淨處 理單元(SCR)20。 於洗刷洗淨處理單元（SCR)20旁邊配置有多段地積層 有用以對玻璃基板G進行熱處理之單元的熱處理系統區塊 11 200421423 24及25。由於在該等熱處理系統區塊24與25之間配置垂直 搬送單元5，且搬送臂部5a可朝Z方向及水平方向移動，並 且可朝0方向旋動，故可進入兩區塊24及25之各熱處理系 統單元進行基板G之搬送。另，前述處理部3中之垂直搬送 5單元7亦與該垂直搬送單元5具有相同構造。 如第2圖所示，於熱處理系統區塊24由下依序積層有2 段用以對基板G施加光阻劑塗布前之加熱處理的烘焙單元 (BAKE)及藉由HMDS氣體施加疏水化處理之黏著單元 (AD)。另一方面，於熱處理系統區塊25由下依序積層有2 1〇段用以對基板G施加冷卻處理之冷卻單元（C Ο L)及黏著單 凡(AD)。 與熱處理系統區塊25相鄰而沿著X方向設有光阻劑處 理區塊15。該光阻劑處理區塊15係設有下列單元而構成 者：光阻劑塗布處理單元(CT)，係將光阻劑塗布於基板G ; 15減壓乾燥單元(VD)，係藉由減壓使前述所塗布之光阻劑乾Embodiment L Embodiment 20 of the Invention Embodiments of the present invention will be described below with reference to the drawings. Fig. 1 is a plan view showing a coating development processing device for an LCD substrate to which the present invention is applied, Fig. 2 is a front view thereof, and Fig. 3 is a rear view thereof. The coating development processing device 1 includes a cassette box station 2 for mounting a cassette box C for accommodating a plurality of glass substrates G, and a processing section 3 for applying a photoresist-containing coating on the substrate G of 2004200423. Most processing units that process a series of processing and development; and interface part 4, which is used to transfer the substrate G to and from the exposure device 32, and the box station 2 and the interface part 4 are respectively arranged at both ends of the processing part 3. . The cassette station 2 has a transfer mechanism 10 for transferring the LCD substrate 5 between the cassette c and the processing unit 3. The cassette C is carried in and out at the cassette station 2. In addition, the transfer mechanism 10 includes a transfer arm portion 11 that can move on a transfer path 12 provided along the arrangement direction of the cassettes, and the transfer arm portion 11 can carry out a substrate between the cassette C and the processing portion 3. Transport. The processing section 3 is provided with a main conveyance section 3a provided along a direction (X direction) perpendicular to the arrangement direction (γ 10 direction) of the cassettes c in the cassette station 2 and provided along the main conveyance section 3a. An upstream portion 3b of each processing unit including a photoresist coating processing unit (CT) and a processing unit including a development processing unit (DEV) and a downstream portion 3c are also provided. The main conveyance section 3a is provided with a conveyance path 31 provided along the X direction, and a conveyance shuttle 23 configured to move along the conveyance path 31 and to convey the glass substrate G in the X direction. This transfer shuttle 23 holds the substrate g by a support rod, for example, and transfers it. Further, a vertical transfer unit 7 for transferring the substrate G between the processing unit 3 and the mesas portion 4 is provided on the side end portion of the mesas portion 4 of the main transfer portion 3a. In the upstream portion 3b, 20 excimer UV processing units (e-Uv) 19 for removing organic matter on the substrate G are provided at the end of the box station 2 side from the box station 2 and the substrate is scrubbed with a scrub brush. G. A scrubbing and washing processing unit (SCR) 20 to which a washing process is applied. Next to the scrubbing and washing processing unit (SCR) 20, a plurality of layers of lamination are arranged. The heat treatment system blocks 11 200421423 24 and 25 have a unit for heat treating the glass substrate G. Since the vertical transfer unit 5 is arranged between the heat treatment system blocks 24 and 25, and the transfer arm 5a can move in the Z direction and the horizontal direction, and can rotate in the 0 direction, it can enter the two blocks 24 and 25 Each heat treatment system unit carries the substrate G. The vertical transfer unit 5 in the processing unit 3 also has the same structure as the vertical transfer unit 5. As shown in Fig. 2, in the heat treatment system block 24, there are 2 layers of baking units (BAKE) for heating treatment before applying photoresist to the substrate G, and hydrophobization treatment by HMDS gas. Adhesive Unit (AD). On the other hand, in the heat treatment system block 25, there are 21 cooling sections (C0 L) and an adhesion unit (AD) for applying a cooling treatment to the substrate G in order from the bottom. Adjacent to the heat treatment system block 25, a photoresist processing block 15 is provided along the X direction. The photoresist processing block 15 is provided with the following units: a photoresist coating processing unit (CT), which coats the photoresist on the substrate G; 15 a reduced pressure drying unit (VD), which is made by reducing Press to dry the applied photoresist
& ’及邊緣去除單元(ER)，係除去與本發明相關之基板G 的邊緣部之光阻劑。於光阻劑處理區塊15設有如第14圖所 不可沿著引導軌道100朝X方向移動且用以保持並搬送基板 之搬送機器人80。該搬送機器人80設有2個用以在光阻劑塗 2〇布處理單几灯)與減壓錢單元(vd)之間搬送基板及用以 在減壓乾燥單元(VD)與邊緣去除單元㈣之間搬送基板之 搬送機器人。 與光阻劑處理區塊15相鄰而配設有多段構造之熱處理 系、、先區塊26 ’於該熱處理系統區塊％積層有3段用以對基板 12 200421423 G進行光阻劑塗布後之加熱處理的預焙單元(prebAKE)。 於下游部3c中，如第3圖所示，在介面部4側端部設有 熱處理系統區塊29,於此由下依序積層有冷卻單元(C0L)、 2段用以進行曝光後顯像處理前之加熱處理之曝光後焙單 5 元(PEBAKE)。 與熱處理系統區塊29相鄰而沿著X方向設有用以進行 顯像處理之顯像處理單元(DEV)。於該顯像處理單元(DEV) 旁邊設置熱處理系統區塊28及27，於該等熱處理系統區塊 28與27之間設有與前述垂直搬送單元5具有相同構造，且可 10進入兩區塊28及27中之各熱處理系統單元之垂直搬送單元 6。又，與顯像處理單元(DEV)相鄰而設有i線處理單元(i — UV)33。 於熱處理系統區塊28由下依序積層有冷卻單元 (COL)、2段用以對基板G進行顯像後之加熱處理的後焙單 15元(POBAKE)。另一方面，熱處理系統區塊27亦同樣由下依 序積層有冷卻單元(COL)、2段後焙單元(POBAKE)。 於介面部4中，在正面側設有字幕編輯器及周邊曝光單 元(Yitler/EE)22，且與垂直搬送單元7相鄰而設有擴延冷卻 單元(EXTCOL)35，並於背面側配置有緩衝匣盒34，並且配 2〇置有用以在該等字幕編輯器及周邊曝光單元(Yitler/EE)22 和擴延冷卻單元(EXTCOL)35和緩衝匣盒34與所鄰接之曝 光裝置32之間進行基板G之傳送之垂直搬送單元8。該垂直 搬送單元8亦與前述垂直搬送單元5具有相同構造。 針對如上所述而構成之塗布顯像處理裝置1之處理步 13 200421423& 'and the edge removal unit (ER) are a photoresist for removing the edge portion of the substrate G related to the present invention. The photoresist processing block 15 is provided with a transfer robot 80 that cannot move in the X direction along the guide rail 100 as shown in FIG. 14 and is used to hold and transfer the substrate. The transfer robot 80 is provided with two substrates for processing a photoresist-coated 20-cloth processing sheet and a decompression unit (vd) and a decompression drying unit (VD) and an edge removal unit. A robot that transports substrates between ㈣. A heat treatment system equipped with a multi-stage structure adjacent to the photoresist treatment block 15 is provided, and the first block 26 'is laminated in the heat treatment system block%. There are 3 stages for photoresist coating on the substrate 12 200421423 G. PrebAKE unit for heat treatment. In the downstream portion 3c, as shown in FIG. 3, a heat treatment system block 29 is provided at the end of the mesial surface 4 side. Here, a cooling unit (C0L) is sequentially stacked from the bottom, and two sections are used for post-exposure display. Post-exposure baking of 5 yuan (PEBAKE) after heat treatment like image processing. Adjacent to the heat treatment system block 29, a development processing unit (DEV) for developing processing is provided along the X direction. The heat treatment system blocks 28 and 27 are arranged beside the development processing unit (DEV). Between the heat treatment system blocks 28 and 27, the same structure as the aforementioned vertical transfer unit 5 is provided, and 10 blocks can be entered into the two blocks. Vertical transfer unit 6 of each heat treatment system unit in 28 and 27. An i-line processing unit (i-UV) 33 is provided adjacent to the development processing unit (DEV). In the heat treatment system block 28, a cooling unit (COL) and two sections of post-baking order (POBAKE) for heating processing after developing the substrate G are laminated in order from the bottom. On the other hand, in the heat treatment system block 27, a cooling unit (COL) and a two-stage post-baking unit (POBAKE) are also laminated in this order from the bottom. A caption editor and a peripheral exposure unit (Yitler / EE) 22 are provided on the front side of the interface portion 4, and an extension cooling unit (EXTCOL) 35 is provided adjacent to the vertical conveying unit 7, and is arranged on the back side There is a buffer box 34, and it is equipped with 20 units for the subtitle editor and the peripheral exposure unit (Yitler / EE) 22 and extended cooling unit (EXTCOL) 35 and the buffer box 34 and the adjacent exposure device 32. The vertical transfer unit 8 that transfers the substrate G therebetween. The vertical transfer unit 8 also has the same structure as the vertical transfer unit 5 described above. Processing steps for the coating development processing apparatus 1 configured as described above 13 200421423
驟作說明。首先，匣盒c内之基板G搬送至處理部3之上游 部3b。於上游部3b中，在激分子uv處理單元(e —UV)19中 進行表面改質·有機物去除處理，接著，於洗刷洗淨處理 單元(SCR)中，一面大致水平地搬送基板G，一面進行洗淨 5處理及乾燥處理。接著，在熱處理系統區塊24之最下段部， 藉由垂直搬送單元之搬送臂部5a取出基板G，且於該熱處理 系統區塊24之烘焙單元(BAKE)進行加熱處理，並為了提高 玻璃基板G與光阻膜之緊密性，於黏著單元（AD)進行將 HMDS氣體喷至基板G之處理。然後，進行由熱處理系統區 10 塊25之冷卻單元(COL)所進行之冷卻處理。 接著，基板G從搬送臂部5a傳送至搬送梭23，然後，搬 送至光阻劑塗布處理單元(CT)，且在進行光阻劑塗布處理 後，依序在減壓乾燥處理單元(VD)進行減壓乾燥處理，並 在邊緣去除單元(ER)進行基板邊緣之光阻劑去除處理。 15 接著，基板0從搬送梭23傳送至垂直搬送單元7之搬送Describe briefly. First, the substrate G in the cassette c is transferred to the upstream portion 3b of the processing portion 3. In the upstream portion 3b, surface modification and organic matter removal processing is performed in the excimer UV processing unit (e-UV) 19, and then, in the scrubbing and washing processing unit (SCR), the substrate G is transported substantially horizontally while the substrate G is transferred horizontally. The washing 5 process and the drying process are performed. Next, in the lowermost portion of the heat treatment system block 24, the substrate G is taken out by the transfer arm portion 5a of the vertical transfer unit, and the baking unit (BAKE) in the heat treatment system block 24 is subjected to heat treatment, and in order to improve the glass substrate The tightness between G and the photoresist film is processed by spraying HMDS gas to the substrate G in the adhesion unit (AD). Then, the cooling treatment by the cooling unit (COL) of the heat treatment system block 10 25 is performed. Next, the substrate G is transferred from the transfer arm portion 5a to the transfer shuttle 23, and then transferred to the photoresist coating processing unit (CT). After the photoresist coating processing is performed, the substrate is sequentially dried in a reduced pressure drying processing unit (VD). A drying process is performed under reduced pressure, and a photoresist removal process is performed on the edge of the substrate in an edge removal unit (ER). 15 Next, the substrate 0 is transferred from the transfer shuttle 23 to the vertical transfer unit 7
臂部’且在熱處理系統區塊26之預焙單元(pREBAKE)進行 加熱處理後，在熱處理系統區塊29之冷卻軍元(c〇L)進行冷 卻處理。接著，基板G在擴延冷卻單元(EXTC〇L)35進行冷 卻處理，同時在曝光裝置進行曝光處理。 2〇 歸，絲G透㈣趨料元如之搬送臂部搬送至 熱處理系統區塊29之曝光烘焙單元(Pebake)，且當在此進 行加熱處理後，在冷卻單元(C〇L)進行冷卻處理。然後，基 板G藉由錢搬送單元7之搬送f部在顯像處理單以丽) 中-面大致水平地搬送，-面進行顯像處理、沖洗處理及 14 乾燥處理。 接著’基板G從熱處理系統區塊28之最下段藉由垂直搬 运早兀6之搬送臂部&傳送，且在熱處理系統區塊Μ或η之 後L單it(PQBAKE)進行力π熱處理，並在冷卻單元(c〇L)進 5订冷部處理。然後，基板G傳送至搬送機構1〇且收容於昆盒 Ο 第4圖係與本發明一實施形態相關之減壓乾燥單元 (VD)的透視圖。第5圖係在其X方向觀看之截面圖，第6圖 係在Y方向觀看之截面圖。 1〇 _壓乾燥單以奶)具有用以收容玻璃基板G且上部 呈開口狀態之下部腔室36及可與該下部腔室36脫離與連接 之上部腔室46。上部腔室46之脫離與連接動作係藉由未圖 不之驅動裝置來進行。於下部腔室36之上部周圍安裝有裝 上上部腔室46時用以使内部密閉之密封環45。於下部腔室 15 36之底部形成有例如凹部36a。減壓乾燥單元(VD)具有用以 保持基板之機台40及用以支持固定機台4〇之支持板％，且 支持板收納於例如凹部36a。 在下部腔至36的4角設有用以減低腔室内部的壓力之 排氣口37，該等排氣口37透過排氣管56與渦輪分子泵等真 20空泵54相連接。於機台4〇周圍安裝有擋板51，為了容易理 解，在第4圖中並未顯示該擋板51。又，於機台仙周圍設有 用以將惰性氣體導入腔室内之導入口41。又，例如於下部 腔室36下部如第5圖所示設有用以測量腔室内的壓力之感 測器64。 ]5 200421423 於機台40之邊緣部安裝有用以支持基板之邊緣部的桿 39。於機台40及支持板38分別形成有多數長穴4加及38&。 該等長穴40a及38a係設置成分別相向且貫通。於長穴4〇a及 38a中收容有用以支持基板之多數支持桿7如、7〇b、70c， 5且該等支持桿70a、7〇b、70c分別安裝於板構件42a、42b、 43a、43b、44a、44b上。板構件42a、42b、43a、43b、44a、 4 4 b係分別藉由棒構件8 7從下方支持。棒構件8 7係設置成插 通設於下部腔室36底部之穴部36c。板構件42a、42b係透過 棒構件87安裝於下部板構件81，板構件43&、431>係透過棒 10構件87安裝於下部板構件83，板構件44a、44b係透過棒構 件87安裝於下部板構件82。下部板構件81、82、83係設置 成可藉由例如支持桿用氣壓缸47、49、48分別獨立升降。 氣壓缸47、48、49藉由連結構件58一體地連結，該連 結構件58係設置成可藉由例如機台用氣壓缸％自由升降。 15連結構件58透過支持體61安裝於前述支持板38，支持體61 係插通下部腔室36之穴部36b。藉由驅動機台用氣壓缸55， 使與連結構件58相連結之支持桿用氣壓缸47、48、49及機 口 40及女裝於板構件42a、42b、43a、43b、44a、44b之支 持桿70a、70b、70c—體地升降。 2〇 另，為了使腔室内保持氣密，於穴部36b、36c分別安 裝有密封構件62、63。 藉由如上所述分割為板構件42a與42b(43a與43b、44a 與44b)，可提高各板構件之剛性，即，可防止基板〇較大型 日寸，若一體地形成例如板構件42a與42b則會減低剛性，而 16 支持#70a之各高度等的精度之情況發生。 制化氣心47、48係藉由第1氣敎控制器51來控 市I、驅動。支持捍用氣壓缸 控制其驅動ϋ,厂纟猎由弟2減缸控制器52來 53來押制：_5係藉由機台用氣壓缸控制器 總體師制主控制^係進行減隸燥單元_的 5 4。又 且根據感測器6 4之檢測信號來控制真空泵 氣驗^^器50根據來自輸入部57的輸入信號來控制 10 來進I。輸人部57為例如作業員用手動 進仃，理内容之輸入操作的操作面板等。 作。接著况明如上所述而構成之減㈣燥單元(VD)的動 例如’作業員藉由輸人部57輪人減録燥單元(VD)之 工作程序。例如’可在以批為單位輪人塗布顯像處理裝置】 整體的工作程序時，輸入減壓乾燥單元(VD)的工作程序。 15作業員例如以朗基板的種類等作為卫作程序之一來輪 入。玻璃基板的種_成為例如第7圖或第8圖所示之玻璃 基板G卜G2上的製品之領域a數量的不同而有所分別。第7 圖❻示例如2刀割之基板，第8圖顯示例如3分割之基板。 上部腔室46從下部腔室36離開，且藉由機台用氣壓缸 20 55之驅動使機台40上升，並從搬送機器人接收基板⑺此 時，若為2分割之基板，則如第9圖所示，在第2氣壓叙控制 器52的控制之下，驅動支持桿用氣壓紅分割之基板⑴ 係如第7圖所示，其非製品領域(斜線部分）在周圍與中央 部。因此，此時’主控制器5〇藉由驅動中央的氣壓缸的以 17 、于7〇b末支持2分割之基板gi的非製品領域。 2另一方面，若為3分割之基板，則如第10圖所示，在第 4^4_51_制之下’驅動支持桿用氣塵缸47、 5 8々° 3分割之基板G2的非製品領域在第8_示之斜線部分 、、、或因此，此日守，主控制器50藉由驅動氣壓缸47、48 以支持桿7〇a、7〇c來支持3分割之基板Μ的非製品領域。 在如上所述地保持基板後，藉由驅動機台用氣壓缸％ 吏機口 40下降，使上部腔室46安裝於下部腔室乂而使腔室 内在閉。然後，待腔室内減壓至預定壓力，進行基板之乾 10燥處理。 在乾燥處理後，上部腔室46從下部腔室離開，且藉由 機台用氣壓缸55之驅動使機台4〇上升，並將基板傳送至未 圖示之搬送機器人。 如上所述’於本實施形態中，由於依照基板的種類來 15切換氣壓缸47、48與49，故可防止支持桿70的痕跡轉寫至 基板之製品領域。又，於本實施形態中，由於以機台4〇為 基準來升降驅動支持桿70，故可相對減少氣壓缸47、48、 49的驅動量，而可極力抑制粒子的產生。 又，於本實施形態中，在例如3分割之基板G2之減壓乾 2〇 燥的處理中，亦可進行下述動作。 例如，隨著腔室内的減壓度變大，即，隨著壓力變小， 基板有向下彎曲的傾向。當基板為3分割之基板時，基板的 中央部有抵接於例如未支持基板之支持桿70b之虞。此例在 沒有機台40等而僅藉由桿來支持基板時可以看到。一旦支 18 200421423 持桿70b抵接於基板，則該# ^ 、 豕支持桿7〇b的轉寫痕跡會殘留在 基板之製品領域。但，若1½装 |思者腔室内的壓力變小，而降低 未支持基板之支持桿7〇b的位署, 曰]位置，則不會發生抵接的情況。 又，如弟11圖所示，當其此 田暴板為5分割時，可設置其他支 ίο 15 持桿用氣壓㈣。此時，氣壓砂可使支持桿观升降，以 支持例如5分割之製品領域中，3片與2片之間十基板長 向5分之2的位置。藉由該構造，可因獻分割、3分割、祕 割之基板的不㈤適當地變更支持桿，而可防止支持桿的轉 寫。又，以橫向並排進行7分割時亦與5分割相同，可將支 持才干配置於基板長向7分之3的位置來支持該基板。3分割時 亦可將支持桿僅配置於相對於基板之中心線為非對稱之基 板長向其中一側3分之1的位置。如此一來，當橫向並排之 衣品的分割數為奇數時，亦可不在所有製品領域之間配置 支持桿，而至少在相對於基板之中心線為部分非對稱且在 氣品領域以外的位置直線狀地配置支持桿Ρ伴隨於此，由 於可動部的數量會減少，故可簡化裝置，因而提高裝置的 可养性。又，當橫向旅排之製品分割數為偶數時，可至少 配复於基板之中心線上，則同樣可減少支持桿的數量。 2〇 接著，針對本發明其他實施形態作說明。第12圖係顯 不與該形態相關之熱處理系統單元中的板之平面圖，第13 圖係其戴面圖，例如町使用於前述預焙單元(PREBAKE)、 〜部單元(COL)等熱處理系統單元或黏著單元(AD)。 板65係用以載置基板，且為例如熱板或冷板等。於該 板65形成有多數長穴65a。於長穴65a内收容有支持桿 19 200421423 170a、170b、l70c，該等支持桿17〇a、17%、服的下部 85、86、87分別在板65下方藉由推壓構件71、72、73來推 壓。推壓構件7m73之間隔係設成對應於支持桿i7〇a與 1欺之_。當㈣構件取73與支持桿隱及i7〇c之各 5下部85及87相向時，推壓構件72係偏移而配置成不與支持 桿170b之下部86相向。在該配置關係下，推壓構件7丨、π、 73藉由連結構件69來連結且加以固定。 該連結構件69與滑動用氣壓缸67相連接，該氣壓缸^ 係構成為可使該連結構件朝水平方向滑動。滑動用氣壓缸 H)师定於板構件66，該板構件66構成為與板構件用氣壓紅 68相連接，且可升降。 15 20 第12圖所示之桿84係用以支持基板之邊緣部該等桿 84可固定於板65，村構心藉由其他軸機構崎升= 驅動。當桿84升降驅動時，可與支持桿ma、丨鳥、n 同時作為基板之傳送機構來使用。又，此時，桿84可與支C 持桿170a、HOb、17〇c同時作為鄰近桿來使用。當桿8:固 定於板65時，可與支持桿™a、mb、_㈣僅作 近桿來使用。 _ 於如上所述而構成之單元中’因應例如2分割或3 之基板使滑動用氣壓㈣滑動，且藉由氣壓缸68使支肿 升降。當處理例如3分割之基板時，從第13圖所示之狀態: 來，係在驅動氣壓缸68使支持桿17〇a、17〇c上升以支心 板之非製品領域的狀態下進行處理。另一方面，者严、 割之基板時，從第13圖所示之狀態看來，係驅動滑動用二 20 壓缸67，使中央的推㈣件72與支持桿170b的下部86相 向’ 一旦相向’财雜㈣件賤MW使支持桿滿 上升以支持基板之非製品領域的狀態下進行處理。 根據本實施形態，可藉由1個氣壓紅67來切換支持桿 170a及me與支持桿隱。藉此，可極力抑制粒子的產生。 又，於本實施形態中，可防止支持桿的痕跡轉寫至製品領 本七月並不限於上述實施形態，亦可進行各種變形。 例士在熱處理系統區塊24、25、26 u、29之各軍 1〇元中可適用減壓乾燥單元⑽中所使用之支持桿的驅動機 構或者不限於此，亦可適用於設於用以搬送基板之搬送 裝置的基板傳逐用台。即，若為進行基板之傳送的裝置， 則:適用本發明。又，相反地，第12圖、第13圖所示之支 持桿的驅動機構亦可編入其他處理單元。又，第⑽、第 15 1圖所不之裝置亦可因應基板製品領域的數量增加的情形 而增加推壓構件的數量。 發明之效果 20The arm portion 'is subjected to heat treatment in a pre-baking unit (pREBAKE) of the heat treatment system block 26, and then subjected to cooling treatment in a cooling army (c0L) of the heat treatment system block 29. Next, the substrate G is cooled in an extension cooling unit (EXTCOL) 35, and at the same time, exposed in an exposure device. After returning to 20%, the silk G will be transferred to the exposure arm of the heat treatment system block 29 (Pebake), and when it is heated, it will be cooled in the cooling unit (C0L). deal with. Then, the substrate G is conveyed by the transfer unit 7 of the money transfer unit 7 in the development process sheet, which is approximately horizontal, and the development process, rinsing process, and drying process are performed on the side. Next, the 'substrate G' is transferred from the lowermost section of the heat treatment system block 28 by the vertical transfer arm & of the early stage 6, and after the heat treatment system block M or η, L single it (PQBAKE) is subjected to a force π heat treatment, and In the cooling unit (c0L), five cold sections are processed. Then, the substrate G is transferred to the transfer mechanism 10 and stored in a kun box. FIG. 4 is a perspective view of a vacuum drying unit (VD) related to an embodiment of the present invention. Fig. 5 is a sectional view viewed in the X direction, and Fig. 6 is a sectional view viewed in the Y direction. 10. The press-drying sheet (milk) has a lower chamber 36 for accommodating the glass substrate G and an open upper part, and an upper chamber 46 which can be detached from and connected to the lower chamber 36. The disengaging and connecting operation of the upper chamber 46 is performed by a driving device (not shown). A seal ring 45 is provided around the upper portion of the lower chamber 36 to seal the inside when the upper chamber 46 is attached. A concave portion 36a is formed in the bottom of the lower chamber 15 to 36, for example. The reduced-pressure drying unit (VD) includes a table 40 for holding a substrate and a support plate% for supporting the fixed table 40, and the support plate is housed in, for example, the recess 36a. Exhaust ports 37 are provided at the four corners of the lower chamber to 36 to reduce the pressure inside the chamber. These exhaust ports 37 are connected to a true air pump 54 such as a turbo molecular pump through an exhaust pipe 56. A baffle 51 is installed around the machine table 40. For easy understanding, the baffle 51 is not shown in FIG. 4. An introduction port 41 for introducing an inert gas into the chamber is provided around the machine. Further, for example, a sensor 64 for measuring the pressure in the chamber is provided at the lower part of the lower chamber 36 as shown in Fig. 5. ] 5 200421423 A rod 39 for supporting the edge portion of the base plate is attached to the edge portion of the machine 40. A plurality of long holes 4 plus and 38 & are formed on the machine 40 and the support plate 38, respectively. The long holes 40a and 38a are arranged so as to face each other and pass through. A plurality of support rods 7 such as 70b, 70c, and 5 for supporting the substrate are accommodated in the long holes 40a and 38a, and the support rods 70a, 70b, and 70c are respectively mounted on the plate members 42a, 42b, and 43a. , 43b, 44a, 44b. The plate members 42a, 42b, 43a, 43b, 44a, and 4b are supported from below by rod members 87, respectively. The rod member 87 is provided so as to be inserted into a cavity portion 36c provided at the bottom of the lower chamber 36. The plate members 42a, 42b are attached to the lower plate member 81 through the rod member 87, the plate members 43 &, 431 > are attached to the lower plate member 83 through the rod 10, and the plate members 44a, 44b are attached to the lower portion through the rod member 87.板 件 82。 82 members. The lower plate members 81, 82, and 83 are provided so that they can be independently raised and lowered by, for example, pneumatic cylinders 47, 49, and 48 for support rods. The pneumatic cylinders 47, 48, 49 are integrally connected by a connecting member 58 which is provided so as to be freely movable up and down by a pneumatic cylinder for a machine, for example. The 15 connecting member 58 is attached to the support plate 38 through the support body 61, and the support body 61 is inserted into the cavity portion 36b of the lower chamber 36. By driving the pneumatic cylinder 55 for the machine, the pneumatic cylinders 47, 48, 49 and the mouth 40 of the support rods connected to the connecting member 58 and the women's clothing are applied to the plate members 42a, 42b, 43a, 43b, 44a, 44b. The support rods 70a, 70b, 70c are raised and lowered physically. 2〇 In order to maintain airtightness in the chamber, sealing members 62 and 63 are installed in the cavity portions 36b and 36c, respectively. By dividing into the plate members 42a and 42b (43a and 43b, 44a, and 44b) as described above, the rigidity of each plate member can be improved, that is, the substrate can be prevented from becoming larger. If the plate members 42a and 42b are integrally formed, for example, 42b reduces rigidity, and 16 supports accuracy such as height of # 70a. The controlled air cores 47 and 48 are controlled by the first air core controller 51 and driven. Supports the use of pneumatic cylinders to control its drive. The factory is hunted by Brother 2 to reduce the cylinder controller 52 to 53 to restrain: _5 is the machine's master control system using the pneumatic cylinder controller to control the system. _ Of 5 4. In addition, the vacuum pump is controlled according to the detection signal of the sensor 64, and the gas detector 50 controls 10 to enter I according to the input signal from the input section 57. The input unit 57 is, for example, an operation panel for manual input by an operator and operation for inputting management contents. Make. Next, the operation of the VD reduction unit (VD) constituted as described above will be described. For example, 'the coating and development processing device can be rotated in batches.] When the overall working procedure is entered, the working procedure of the reduced pressure drying unit (VD) is input. 15 Operators take turns such as the type of Lang substrate as one of the satellite programs. The types of glass substrates vary depending on the number of areas a of the products on the glass substrates G2 and G2 shown in Figs. 7 and 8, for example. Figure 7 shows an example of a 2-knife substrate, and Figure 8 shows a 3-division substrate, for example. The upper chamber 46 is separated from the lower chamber 36, and the machine 40 is lifted by the machine using the pneumatic cylinders 20 and 55 to receive the substrate from the transfer robot. At this time, if it is a two-piece substrate, it is the same as the 9th As shown in the figure, under the control of the second air pressure controller 52, the substrate of the driving support rod divided by air pressure red is shown in FIG. 7, and its non-product area (slashed line) is around and at the center. Therefore, at this time, the 'main controller 50' drives the central pneumatic cylinder to support the non-product area of the two-part substrate gi at 17, and at the end of 70b. 2 On the other hand, if it is a 3-divided substrate, as shown in Fig. 10, under the 4 ^ 4_51_ system, the air-cylinder 47 for the support rod 47, 5 8々 ° of the 3-divided substrate G2 is not driven. The product field is in the oblique line shown in 8_, or, therefore, on this day, the main controller 50 supports the three-division substrate M by driving the pneumatic cylinders 47 and 48 to support the levers 70a and 70c. Non-product area. After the substrate is held as described above, the upper chamber 46 is lowered by driving the pneumatic cylinder 40 and the upper chamber 46 is mounted on the lower chamber 乂 to close the inside of the chamber. Then, the chamber is decompressed to a predetermined pressure, and the substrate is dried. After the drying process, the upper chamber 46 is separated from the lower chamber, and the machine 40 is lifted by the pneumatic cylinder 55 driven by the machine, and the substrate is transferred to a transfer robot (not shown). As described above, in this embodiment, since the pneumatic cylinders 47, 48, and 49 are switched according to the type of the substrate, it is possible to prevent the traces of the support rod 70 from being transferred to the product field of the substrate. Further, in this embodiment, since the support lever 70 is driven up and down based on the machine 40, the driving amount of the pneumatic cylinders 47, 48, and 49 can be relatively reduced, and the generation of particles can be suppressed as much as possible. In the present embodiment, for example, the following operations can also be performed in the process of decompressing and drying the substrate G2 of three divisions under reduced pressure and drying. For example, as the degree of decompression in the chamber becomes larger, that is, as the pressure becomes smaller, the substrate tends to bend downward. When the substrate is a three-divided substrate, the central portion of the substrate may come into contact with, for example, a support rod 70b that does not support the substrate. This example can be seen when there is no machine 40 or the like and only the substrate is supported by the lever. Once the supporting rod 70b abuts on the substrate, the transfer marks of the # ^, 豕 support rod 70b will remain in the product field of the substrate. However, if the pressure in the chamber of the thinker becomes smaller and the position of the support rod 70b that does not support the substrate is lowered, the abutment will not occur. In addition, as shown in Figure 11, when the field storm board is divided into 5 parts, other support rods can be provided. At this time, the pneumatic sand can raise and lower the supporting rod view to support, for example, a position of two-fifths of the ten-board length between three and two in the field of five-part products. With this structure, it is possible to appropriately change the support rod due to the inconvenience of the divided, 3-divided, and secreted substrate, and to prevent the support rod from being rewritten. In addition, when the 7-segment side-by-side arrangement is performed in the same manner as the 5-segment division, the supporting ability can be arranged at a position of 3/7 of the substrate length to support the substrate. In the case of 3 divisions, it is also possible to arrange the support bar only at a position which is one third of the length of the substrate which is asymmetric with respect to the center line of the substrate. In this way, when the number of horizontally side-by-side clothing products is odd, support rods may not be arranged between all product areas, but at least partially asymmetric with respect to the centerline of the substrate and outside the gas product area The linear arrangement of the support rods P accompanies this, and since the number of movable parts is reduced, the device can be simplified, thereby improving the maintainability of the device. In addition, when the number of divided products of the horizontal travel row is even, it can be arranged at least on the center line of the substrate, and the number of support rods can also be reduced. 20 Next, other embodiments of the present invention will be described. Figure 12 is a plan view of a plate in a heat treatment system unit that is not related to this form, and Figure 13 is a wearing view of the plate. For example, it is used in heat treatment systems such as the pre-baked unit (prebake) and ~ col unit (COL). Unit or Adhesive Unit (AD). The plate 65 is used to place a substrate, and is, for example, a hot plate or a cold plate. A plurality of long holes 65a are formed in the plate 65. Support rods 19 200421423 170a, 170b, and l70c are contained in the long hole 65a. The support rods 17a, 17%, and the lower portions 85, 86, and 87 of the server are respectively pushed under the plate 65 by pressing members 71, 72, 73 to push. The interval of the pressing member 7m73 is set to correspond to the support rods i7〇a and -1. When the cymbal member 73 is opposed to the lower portions 85 and 87 of the support rod recess 5 and the i7oc, the pressing member 72 is offset so as not to face the lower portion 86 of the support rod 170b. In this arrangement relationship, the pressing members 7 丨, π, and 73 are connected and fixed by the connection member 69. The connecting member 69 is connected to a sliding pneumatic cylinder 67, and the pneumatic cylinder is configured to slide the connecting member in a horizontal direction. The pneumatic cylinder for sliding H) is fixed to a plate member 66 which is configured to be connected to the plate member with a gas pressure red 68 and can be raised and lowered. 15 20 The rods 84 shown in Figure 12 are used to support the edges of the substrate. The rods 84 can be fixed to the plate 65, and the center of the structure is swelled by other shaft mechanisms = driven. When the lever 84 is driven up and down, it can be used as a substrate transfer mechanism at the same time as the support levers ma, bird, and n. At this time, the rod 84 can be used as an adjacent rod simultaneously with the C-supporting rods 170a, HOb, and 170c. When the lever 8: is fixed to the plate 65, it can be used as a close lever with the support levers ™ a, mb, and ㈣㈣. _ In the unit configured as described above, ′ slides the air pressure ㈣ for sliding according to, for example, a two-divided or three substrate, and the branch is raised and lowered by the pneumatic cylinder 68. When processing, for example, a three-part substrate, from the state shown in FIG. 13: The processing is performed in a non-product area where the pneumatic cylinder 68 is driven to raise the support rods 17a and 17c to support the core plate. . On the other hand, when the substrate is severed and cut, from the state shown in FIG. 13, the 20-cylinder 67 for sliding is driven so that the central pusher 72 faces the lower part 86 of the support rod 170b. Opportunities for the miscellaneous and miscellaneous items have caused the support bar to rise to support the substrate in a non-product area. According to this embodiment, the support lever 170a and me and the support lever can be switched by one pressure red 67. Thereby, generation of particles can be suppressed as much as possible. In addition, in this embodiment, it is possible to prevent the traces of the support rod from being transferred to the product collar. July is not limited to the above embodiment, and various modifications may be made. In the heat treatment system blocks 24, 25, 26, and 29, the army can apply the drive mechanism of the support rod used in the vacuum drying unit ⑽ or it is not limited to this, and it can also be applied to the A substrate transfer stage using a substrate transfer device. That is, the present invention is applicable to a device for transferring substrates. Conversely, the drive mechanism of the support rods shown in Figs. 12 and 13 may be incorporated into other processing units. In addition, the devices shown in Figs. 1 and 151 can also increase the number of pressing members in response to an increase in the number of substrate products. Effects of the invention 20
<防二所述’根據本發明，可極力抑制粒子的產生 Ρ♦桿等支持構件轉寫至基板之製品領域。 式簡草說明】 裝置的整：1:=::-實施形態相關塗布_ 圖係第旧所示之塗布顯像處理I置的土視圖。 3圖係第1圖所示之塗布顯像處理裝置的後視圖。 21 200421423 第4圖係顯示與本發明一實施形態相關之減壓乾燥單 元的透視圖。 第5圖係第4圖所示之減壓乾燥單元的截面圖。 第6圖係第4圖所示之減壓乾燥單元的截面圖。 5 第7圖係顯示2面基板之製品領域的平面圖。 第8圖係顯示3面基板之製品領域的平面圖。 第9圖係顯示處理2面基板之減壓乾燥單元的動作。 第10圖係顯示處理3面基板之減壓乾燥單元的動作。 第11圖係顯示處理5面基板之減壓乾燥單元的截面圖。 10 第12圖係與本發明其他實施形態相關之處理單元的板 之平面圖。 第13圖係顯示第12圖所示之處理單元的截面圖。 第14圖係顯示設於光阻劑處理區塊之搬送機器人的平 圖式之主要元件代表符號表】 面圖。< The second aspect of the invention ' According to the present invention, the generation of particles can be suppressed as much as possible. The supporting member such as a rod can be transferred to the substrate product field. Brief description of the formula] The whole device: 1: = ::-implementation-related coating _ Figure is a soil view of the coating and coating process shown in the oldest. FIG. 3 is a rear view of the coating development processing apparatus shown in FIG. 1. 21 200421423 Fig. 4 is a perspective view showing a reduced-pressure drying unit according to an embodiment of the present invention. FIG. 5 is a cross-sectional view of the reduced-pressure drying unit shown in FIG. 4. Fig. 6 is a cross-sectional view of the reduced-pressure drying unit shown in Fig. 4. 5 FIG. 7 is a plan view showing a product field of a two-sided substrate. Fig. 8 is a plan view showing a product field of a three-sided substrate. FIG. 9 shows the operation of a reduced-pressure drying unit that processes a two-sided substrate. Fig. 10 shows the operation of a reduced-pressure drying unit for processing three-sided substrates. Fig. 11 is a cross-sectional view showing a reduced-pressure drying unit for processing a 5-sided substrate. 10 FIG. 12 is a plan view of a plate of a processing unit according to another embodiment of the present invention. Fig. 13 is a sectional view showing the processing unit shown in Fig. 12. Fig. 14 is a plan view showing a table of main components of a transfer robot provided in a photoresist processing block].
is L 1.. .塗布顯像處理裝置 2.. .匣盒站 3.. .處理部 3a...主搬送部 3b...上游部 3c...下游部 4.. .介面部 5.. .垂直搬送單元 5a...搬送臂部 6.. .垂直搬送單元 6a...搬送臂部 7、8·.·垂直搬送單元 10.. .搬送機構 11…搬送臂部 12.. .搬送路 15…光阻劑處理區塊 19.. .激分子UV處理單元 20…洗刷洗淨處理單元 22 200421423 22.. .字幕編輯器及周邊曝光 〇〇 —-早兀 23.. .搬送 24、25、26、27、28、29·.·熱 處理系統區塊 31.. .搬送路 32…曝光裝置 33.. .1.處理單元 34…緩衝匣盒 35.. .擴延冷卻單元 36…下部腔室 36a.··凹部 36b、36c...穴部 37.. .排氣口 38.. .支持板 38a、40a...長穴 39···桿 40…機台 41···導入口 42a、42b、43 a、43 b、44a、44b … 板構件 45.. .密封環 46…上部腔室 47、48、49…支持桿用氣壓缸 50.. .主控制器 51·"板 51…第1氣壓缸控制器 52.. .第2氣壓缸控制器 53.. .機台用氣壓缸控制器 54.. .真空泵 55.. .機台用氣壓缸 56.. .排氣管 57.. .輸入部 58…連結構件 59…支持桿用氣壓缸 61.. .支持體 62、63...密封構件 64.. .感測器 65."板 66.. .板構件 67.. .滑動用氣壓缸 68.. .板構件用氣壓缸 69…連結構件 70a、70b、70c··.支持桿 71、72、73…推壓構件 80…搬送機器人 81、82、83…下部板構件 84.. .桿 23 200421423 85、86、87···下部 87.. .棒構件 100.. .引導軌道 170a、170b、170c.. G...基板 C...匣盒 A···製品領域 AD...黏著單元 COL...冷卻單元 PREBAKE…預焙單元 BAKE…烘焙單元 .支持桿 POBAKE…後焙單元 CT...光阻劑塗布處理單元 VD...減壓乾燥單元 ER...邊緣去除單元 DEV...顯像處理單元 24is L 1 .. Coating development processing device 2. Cassette station 3. Processing section 3a ... Main conveying section 3b ... Upstream section 3c ... Downstream section 4. Interface surface 5 .. vertical transfer unit 5a ... transfer arm 6. vertical transfer unit 6a ... transfer arm 7, 8 ... vertical transfer unit 10 .... transfer mechanism 11 ... transfer arm 12. .Transportation path 15 ... Photoresist processing block 19 ... Excimer UV processing unit 20 ... Scrubbing and cleaning processing unit 22 200421423 22 .. Subtitle editor and peripheral exposure 〇〇- Early wood 23 .. 24, 25, 26, 27, 28, 29 ··· Heat treatment system block 31 ... Conveying path 32 .. Exposure device 33 ... 1. Processing unit 34 .. Buffer box 35 .. Extension cooling unit 36. ... lower cavity 36a ... recesses 36b, 36c ... cavity 37 ... exhaust port 38 ... support plate 38a, 40a ... long cavity 39 ... lever 40 ... machine 41 ... · Introduction ports 42a, 42b, 43a, 43b, 44a, 44b ... Plate members 45 ... Seal ring 46 ... Upper chambers 47, 48, 49 ... Support cylinder 50 ... Main controller 51 · " Board 51 ... 1st pneumatic cylinder controller 52.. 2nd pneumatic cylinder controller 53.. 54 .. Vacuum pump 55 .. Pneumatic cylinder for machine 56 .. Exhaust pipe 57 .. Input part 58 .. Connecting member 59 .. Pneumatic cylinder 61 for support rods 61 .. Supports 62, 63 .. Sealing member 64 .. Sensor 65. Plate 66. Plate member 67. Pneumatic cylinder for sliding 68. Pneumatic cylinder 69 for plate member .. Connecting members 70a, 70b, 70c ... Support rods 71, 72, 73 ... Pushing members 80 ... Transfer robots 81, 82, 83 ... Lower plate members 84 ... Rod 23 200421423 85, 86, 87 ... Lower portion 87 ... Rod member 100 ... Guide rails 170a, 170b, 170c .. G ... Substrate C ... Box A ... Product area AD ... Adhesive unit COL ... Cooling unit PREBAKE ... Pre-baking unit BAKE ... Baking unit. Support bar POBAKE ... Post-baking unit CT ... Photoresist coating processing unit VD ... Decompression drying unit ER ... Edge removal unit DEV ... Development processing unit 24