TW200403716A - Alignment apparatus, alignment method, and manufacturing method of semiconductor device - Google Patents

Alignment apparatus, alignment method, and manufacturing method of semiconductor device Download PDF

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Publication number
TW200403716A
TW200403716A TW92110146A TW92110146A TW200403716A TW 200403716 A TW200403716 A TW 200403716A TW 92110146 A TW92110146 A TW 92110146A TW 92110146 A TW92110146 A TW 92110146A TW 200403716 A TW200403716 A TW 200403716A
Authority
TW
Taiwan
Prior art keywords
alignment
optical axis
wafer
optical
item
Prior art date
Application number
TW92110146A
Other languages
English (en)
Chinese (zh)
Inventor
Shinichi Mizuno
Hiroki Hane
Kaoru Koike
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of TW200403716A publication Critical patent/TW200403716A/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049—Technique, e.g. interferometric
    • G03F9/7053—Non-optical, e.g. mechanical, capacitive, using an electron beam, acoustic or thermal waves

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW92110146A 2002-05-01 2003-04-30 Alignment apparatus, alignment method, and manufacturing method of semiconductor device TW200403716A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002129508A JP2003324057A (ja) 2002-05-01 2002-05-01 アライメント装置およびアライメント方法

Publications (1)

Publication Number Publication Date
TW200403716A true TW200403716A (en) 2004-03-01

Family

ID=29397306

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92110146A TW200403716A (en) 2002-05-01 2003-04-30 Alignment apparatus, alignment method, and manufacturing method of semiconductor device

Country Status (3)

Country Link
JP (1) JP2003324057A (ja)
TW (1) TW200403716A (ja)
WO (1) WO2003094212A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110320757A (zh) * 2018-03-30 2019-10-11 华润微电子（重庆）有限公司 晶圆曝光机
TWI807178B (zh) * 2019-04-18 2023-07-01 日商佳能股份有限公司 基板處理設備、物品製造方法、基板處理方法、基板處理系統、管理設備、以及程式

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7573580B2 (en) 2003-11-17 2009-08-11 Asml Holding N.V. Optical position measuring system and method using a low coherence light source
JP2005262260A (ja) * 2004-03-17 2005-09-29 Takeji Arai レーザ加工装置及びレーザ加工制御プログラム
TW201317373A (zh) * 2011-10-31 2013-05-01 Au Optronics Corp 蒸鍍設備以及蒸鍍方法
JP2013175684A (ja) * 2012-02-27 2013-09-05 Canon Inc 検出器、インプリント装置及び物品を製造する方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53121472A (en) * 1977-03-31 1978-10-23 Toshiba Corp Exposure unit
JPS60119722A (ja) * 1983-12-01 1985-06-27 Hitachi Ltd 半導体露光装置用ウエハパタ−ン検出方法及びその装置
JPS6489328A (en) * 1987-09-29 1989-04-03 Matsushita Electric Ind Co Ltd Aligner
JP2551049B2 (ja) * 1987-11-10 1996-11-06 株式会社ニコン アライメント装置
JP2871104B2 (ja) * 1989-12-21 1999-03-17 株式会社東芝 相対位置合せ方法及び装置、並びにアライメント光学装置
JP2775988B2 (ja) * 1990-05-01 1998-07-16 キヤノン株式会社 位置検出装置
JPH06224101A (ja) * 1993-01-26 1994-08-12 Fujitsu Ltd 二重焦点レンズ及び位置合せ装置
US5831272A (en) * 1997-10-21 1998-11-03 Utsumi; Takao Low energy electron beam lithography

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110320757A (zh) * 2018-03-30 2019-10-11 华润微电子（重庆）有限公司 晶圆曝光机
TWI807178B (zh) * 2019-04-18 2023-07-01 日商佳能股份有限公司 基板處理設備、物品製造方法、基板處理方法、基板處理系統、管理設備、以及程式

Also Published As

Publication number Publication date
WO2003094212A1 (fr) 2003-11-13
JP2003324057A (ja) 2003-11-14

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