SU1449294A1 - Flux for soldering heterogeneous metals - Google Patents

Abstract

This invention relates to the field of soldering, in particular to flux compositions for soldering dissimilar metals. The purpose of the invention is to increase the activity of the flux. It contains, May. %; potassium chloride 31-34; lithium chloride 16-20; sodium chloride 21-25; zinc chloride 7-9; yithium fluoride 8-11; complex tetravalent lead fluoride 5-7; Chlortantalate sodium 2-4. The complex tetravalent fluoride fluoride used in the flux: sodium boron during the soldering, atomic chlorine and fluorine are separated, and pyroxides are oxidized on the metal surface in the halides dissolved by the flux.:. The flux allows improving the quality of soldered joints, reducing the time of tinning before soldering due to an increase in its activity. 4 tab. (L

Description

The invention relates to bees, in particular to flux compositions for soldering dissimilar metals.

The purpose of acquisition is to increase the activity of the flux.

The goal is achieved by the fact that the flux containing potassium chloride, lithium chloride, sodium chloride, chloride, lithium fluoride, additionally contains complex potassium fluoride of tetravalent lead, chlorotanate sodium, with the following content of components, wt. potassium; loric 31-34; lithium chloride 16-20; sodium chloride 21-25; zinc chloride 7-9; lithium fluoride 8-11; complex to lily fluoride /, tetravalent sugar 5-7; sodium chlorotantalate 2-4.

This flux dp increases it; IK-tyrosnity contains sodium portantalate sodium and complex tetravalent lead fluoride.

The complex potassium 1 oriental tetravalent decomposes at the soldering temperature with the release of active vests by the reaction

g with K ,, HCPlFgj - HF + 3KF + PbF, 4 F ,,

The decomposition of the complex potassium oxide (fluoride, four-quapant, lead begins at. When this occurs, fluoride ox, c), od, .d {: at the time of installation, as an active ingredient: oh form and reacting with oxides on the surface of metals. The implant is also found in a very active atomic co1; then, and also reacts with / kichami, -. al media .i, their fgoridy, rastgur yushi- es in: flux. Fluorine reacts with oxygen, preventing the acidification of the surface of the metal. Fluorist spine has a rather high melting point of 855 ° C, so it increases the flux viscosity, preventing the flux from flowing from the soldering point at elevated temperatures.

Thus, the complex potassium fluoride of tetravalent lead, when soldered with low-melting solders, helps purify the surface; metal from oxides, converting them to fluorides that dissolve in the flux, protects the metal from oxidation, and when soldering with refractory solder, increases the covering power of the flux. Besides.

formed by its decomposition, lead fluoride easily enters into exchange reactions with most metals, since lead is a low-active metal. Three flats (free lead is added to cover the surface of the molded part. Thus, complex potassium Fluoride of tetravalent lead, together with zinc chloride, facilitates the process of tinning.

When the content of tetravalent syngas complex potassium fluoride is less than 5%, its effect on the properties

flux is not enough. When its content is more than 7%, the temperature of the melt increases. flyworm.

Lnop4 sodium antalate is a non-Ci oi; KHM compound that decomposes as

 with the atomic, very active chlorine. Chlorine helps to remove oxides from the metal surface, tantalum, precipitates on the surface of metals, improves their tinning,

Chlorotantalag sodium lowers the temperature of lamination of the flux, creates in the zone iaiku a protective atmosphere of tantalp chloride and chlorine vapors. Chlortan-tal.: T nitrim v about spreadability

of the flux at the height of the part, intensity - T 1 |;: 10... increase of exchange reactions between the metal and the flux. When go; --M) zhani ;. Sodium phosphate lactant is less than 1% less active, and when it contains1 and more than 4%, no further improvement in NWO-STB flux is observed.

Examples of flux performance are presented in Table. one.

Use the gauge on samples

but copper M1, nlkhet NP2, steel

li XiofilOl,. it ana VT1-0, aluminum size.- 100x100x4 mm, as well as on the lu.jx vi-f cast iron C4-12-28, bronze i; r AL-9-4, magnet niobium BH1 100x60x10 mm in size.

Testing is performed when brazing with light alloy solder, containing,%: tin 55 zinc 25 to cadmium 20. Samples are placed in a furnace heated to

400 ° C and maintained for

20 minutes. Preliminarily, a test flux is applied to the samples in an amount of 2 g and solder in the amount of 0.5 g. MDmogt solder flow area.

The prc test of magnesium, niobium, and titanium is heated to protect argon, which protects samples from oxidation. The test results are shown in Table. 2

Probe testing of the known and proposed fluxes when soldering above the mentioned materials with solder PSr 50 cd.

Samples were isolated in a pzch and maintained at 820 ° C for 20 minutes. Heating of niobium and titanium is carried out with argon feed. The test results are shown in Table. 3, In view of the fusibility of aluminum, magnesium and bronze, the tests are made using PCRFDD solder when heated to. In all cases, 2 g of the tested flux and 0.5 g of the solder were applied to the sample surface.

In tab. 4 shows the results of testing magnesium, aluminum, and bronze.

Heating of samples from an argon in an argon.

As can be seen from the table. 2-4, the suggested flux has advantages in comparison with the known flux.

invented

and

 Formulas

The flux for soldering dissimilar metals, potassium chloride, lithium chloride, sodium chloride, calcium chloride, lithium fluoride, characterized in that, in order to increase its activity, it additionally contains complex potassium fluoride of tetravalent lead, sodium tantalate with sodium The following is the content of the components, Mac.Z:

Potassium chloride Lithium chloride Sodium chloride Zinc chloride Lithium fluoride Complex potassium fluoride of cuproxide lead Chlorotantalate sodium 1g

Ko fponyty

T

Spreadsheets

Component content, May. %, composed

Claims (3)

Claim 5 Flux for soldering dissimilar metals, containing potassium chloride, lithium chloride, sodium chloride, zinc chloride, lithium fluoride, characterized in that, for the purpose 10 to increase its activity, it additionally contains complex potassium tetravalent fluoride of lead, sodium chlortantalate in the following components, wt. X: Potassium chloride31-34 Lithium Chloride 16-20 Sodium chloride21-25 Zinc chloride 7-9 Lithium Fluoride 8-11 Lead complex potassium fluoride 5-7 Sodium Chlortantalate 2-4 Table 1 Components _d - -------------- - ---- Content of the component, May. in the composition 2 3 ⁴ 1 5 Potassium chloride 39 34 33 31 26 Lithium chloride 14 16 18 20 24 Sodium Chloride 27 25 23 21 18 Zinc chloride 4 7 8 9 12 Lithium fluoride 12 eleven 9 8 7 Lead complex potassium fluoride 3 5 6 7 8 Sodium Chlortantalate 1 2 3 4 5 T a b faces 2 Sample material Solder spreading area, im ² Composition 1 Composition 2 Composition 3 Composition 4 Composition 5 Famous Copper M1 108 122 143 137 116 74 Nickel NP2 94 103 119 123 97 62 Steel 12X18H1OT 102 116 129 151 120 71 Continuation of table .2 Sample material Solder spreading area, mm ² Composition 1 Composition 2 Composition '3 Composition 4 Composition 5 Famous Titanium VT 1-0 70 86 98 91 74 52 Aluminum AD1 103 111 121 123 110 86 Cast iron S412-28 112 144 152 158 132 76 Bronze Br AZH-9-4 118 139 142 147 120 70 Magnesium 73 77 78 78 71 66 Niobium BH1 74 79 89 92 76 58 1-------- T a blitz a 3 Sample material Solder spreading area, mm ^g Composition 1 Composition] Composition Composition 4 Composition 5 Famous Copper M1 121 134 162 159 127 116 Nickel NP2 107 126 127 125 112 104 Steel 12X18H10T 118 1 39 152 <41 129 112 Titanium VT 1-0 84 109 124 121 102 78 Cast iron C4-12-28 118 127 169 142 122 98 Niobium BM1 106 127 134 125 120 88 T a b faces 4 Sample material Area solder spreading, mm ² Composition 1 Composition 2 Composition 3 Composition 4 Composition 5 Famous Aluminum AD1 111 123 124 121 117 101 Bronze Br AZH-9-4 128 134 162 151 130 115 Magnesium 88 95 101 98 91 74