JPH01245995A - Brazing filler metal for brazing titanium or titanium alloy material - Google Patents
Brazing filler metal for brazing titanium or titanium alloy materialInfo
- Publication number
- JPH01245995A JPH01245995A JP7400488A JP7400488A JPH01245995A JP H01245995 A JPH01245995 A JP H01245995A JP 7400488 A JP7400488 A JP 7400488A JP 7400488 A JP7400488 A JP 7400488A JP H01245995 A JPH01245995 A JP H01245995A
- Authority
- JP
- Japan
- Prior art keywords
- titanium
- brazing
- filler metal
- alloy material
- brazing filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010936 titanium Substances 0.000 title claims abstract description 40
- 229910052719 titanium Inorganic materials 0.000 title claims abstract description 40
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 title claims abstract description 39
- 238000005219 brazing Methods 0.000 title claims abstract description 26
- 239000000945 filler Substances 0.000 title claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 13
- 239000002184 metal Substances 0.000 title claims abstract description 13
- 229910001069 Ti alloy Inorganic materials 0.000 title claims abstract description 6
- 239000000956 alloy Substances 0.000 title claims abstract description 6
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 13
- 229910052709 silver Inorganic materials 0.000 claims abstract description 10
- 239000012535 impurity Substances 0.000 claims abstract description 7
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000000463 material Substances 0.000 abstract description 33
- 230000004907 flux Effects 0.000 abstract description 6
- 238000005476 soldering Methods 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000003517 fume Substances 0.000 description 3
- 229910002056 binary alloy Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 229910004353 Ti-Cu Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000005548 dental material Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000012567 medical material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 150000003608 titanium Chemical class 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials For Medical Uses (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、チタンまたはチタン合金材(以下単にチタン
材と言う)のろう接用ろう材に関し、特には、チタン類
の歯科技工品をろう接する際に使用するろう材に関する
。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a brazing material for brazing titanium or titanium alloy materials (hereinafter simply referred to as titanium materials), and in particular, to a brazing material for brazing titanium dental materials. Regarding the brazing filler metal used when making contact.
チタン材は、その優れた特性のため航空機や、原子力等
を始め種々の工業分野で利用が進められている。Due to its excellent properties, titanium material is being used in various industrial fields including aircraft and nuclear power.
一方近年になって、このチタン材が耐蝕性や、機械的強
度に優れ且つ比重が小さい等の特性を存する他、生体と
の親和性や、生体に無害な特性をも併せ持つことが知ら
れるようになって、医療用材料としての利用も進められ
ている。そして、中でも歯科技工品(歯冠、義歯床等)
にチタン材を利用することが積極的に進められている。On the other hand, in recent years, it has become known that this titanium material has properties such as corrosion resistance, excellent mechanical strength, and low specific gravity, and also has properties that are compatible with living organisms and are harmless to living organisms. As a result, its use as a medical material is also progressing. Among other things, dental technology (dental crowns, denture bases, etc.)
The use of titanium materials is being actively promoted.
ところが、チタン材は、高温では活性が高く容易に酸化
するため、歯科技工品の製造のように、ろう接を行う場
合は、真空中あるいは不活性ガス雰囲気中でろう接をし
なければならず、このことが、チタン製歯科技工品の製
造に大きな支障となっていた。このようなことから、本
発明者等は、先にチタン製歯科技工品のろう接に実用し
得る赤外線ろう接器を開発し、出願(実願昭62−14
8702号)した。However, titanium materials are highly active and easily oxidize at high temperatures, so when soldering is performed, such as in the manufacture of dental technology, it must be done in a vacuum or in an inert gas atmosphere. This has been a major hindrance to the manufacture of titanium dental instruments. For these reasons, the present inventors first developed an infrared soldering device that could be put to practical use in soldering titanium dental instruments, and filed an application (Utility Application No.
No. 8702).
ところで、上述の赤外線ろう接部を用い、市販されてい
る一般工業用のチタンろう接用ろう材とフラックスとを
使用して、チタン材同士をろう接したところ、ろう材や
フラックスから発生したヒユーム等が赤外線ろう接部の
内周面に付着し良好なろう接作業がなし得なかった上、
ろう材中にA。By the way, when titanium materials were brazed together using the above-mentioned infrared soldering part and a commercially available general industrial titanium brazing filler metal and flux, fumes were generated from the brazing filler metal and flux. etc. adhered to the inner peripheral surface of the infrared soldering part, making it impossible to perform a good soldering work.
A in the brazing filler metal.
やPd以外に、例えば、CuやZnやSn等が含まれて
いて、これらの成分がヒユームになったり、あるいは接
合部界面にTi−Cu等の化合物を生成して接合部の強
度をさげたりする不具合が観られた。In addition to Pd and Pd, for example, it contains Cu, Zn, Sn, etc., and these components may become fumes or generate compounds such as Ti-Cu at the interface of the joint, reducing the strength of the joint. A problem was observed.
そこで、本発明は、以上の問題点に讃み、フラックスを
使用せずにろう接し得ると共に、CuやZnやSn等の
成分を極力含有しない八g−Pdからなる二元系あるい
はAg−^u−Pdからなる三元系を基本成分とし、加
えて、ろう接による重ね継手部のせん断強度が30Kg
f/m+*”以上が得られ、且つ、チタン材に対し良好
な流ろう性を存する他、生体に無害であると共に、チタ
ン材と略同色のチタン材のろう接用ろう材を開発提供す
ることを目的とするものである。Therefore, the present invention addresses the above-mentioned problems and provides a binary system consisting of 8g-Pd or Ag-^ which can be soldered without using flux and does not contain components such as Cu, Zn, and Sn as much as possible. The basic component is a ternary system consisting of u-Pd, and in addition, the shear strength of the lap joint by brazing is 30 kg.
To develop and provide a brazing filler metal for titanium materials that can obtain f/m+*" or more, has good flow properties for titanium materials, is harmless to living organisms, and has approximately the same color as titanium materials. The purpose is to
上記の目的を達成するために、本発明のチタン材のろう
接用ろう材の一つは、Pd : 30〜4ht%、Ag
: 60〜70wt%および不可避的不純物とからな
るものである。In order to achieve the above object, one of the brazing fillers for titanium materials of the present invention is Pd: 30-4ht%, Ag
: 60 to 70 wt% and unavoidable impurities.
そして、他の一つは、Pd : 20〜40wL%、A
u 二10wt%以下、Ag : 60〜70w L%
および不可避的不純物とからなるものである。And the other one is Pd: 20-40wL%, A
u2 10wt% or less, Ag: 60~70w L%
and unavoidable impurities.
以上の本発明に係わるチタン材のろう接用ろう材は、チ
タン材に対し良好な流ろう性を有し、チタン材と略同色
、且つ、生体に対し無害である。The brazing filler metal for titanium material according to the present invention has good flow properties with respect to titanium material, has substantially the same color as titanium material, and is harmless to living organisms.
4た、ろう接に当たっては、フラックスを使用せずにろ
う接し得ると共に、高強度のろう接部が得られる。4. In soldering, it is possible to perform soldering without using flux, and a high-strength soldered part can be obtained.
次に、各成分の特定理由を説明する。Next, the reason for specifying each component will be explained.
PdとAgとの二元系の場合、Agが60w t%未満
では、 Pdとの組み合わせにおいて、Pdの添加量を
40wt%超添加しても安定して高強度なろう接部が得
られず、また、agが70w t%超では、Pdとの組
み合ゎせにおいて、Pdの添加量を30w t%未満添
加しても安定して高強度なろう接部が得られ無い上、A
gあるいはPdの量が多くなるとチタン材に対する流ろ
う性は殆ど変わらないが、チタン材との略同色系が薄れ
るので、Pd : 30〜40−1%およびAg :
60〜7〇wt%とした。In the case of a binary system of Pd and Ag, if Ag is less than 60 wt%, a stable and high-strength brazed joint cannot be obtained in combination with Pd even if the amount of Pd added exceeds 40 wt%. Furthermore, if ag exceeds 70wt%, even if the addition amount of Pd is less than 30wt% in combination with Pd, a stable and high-strength brazed joint cannot be obtained, and A
When the amount of g or Pd increases, the flowability with respect to titanium material hardly changes, but the almost same color system with titanium material becomes weaker, so Pd: 30 to 40-1% and Ag:
It was set at 60 to 70 wt%.
また、PdとAuとAgとの三元系の場合、Agが60
−1%未満では、PdとAuとの組み合わせにおいて、
Pdの添加量を40w t%超および/またはAuの添
加量を10wt%超添加しても安定して高強度なろう接
部が得られず、また、八gが70wt%超では、Pdと
Auとの組み合わせにおいて、Pdの添加量を20w
t%未満と^Uの添加量を10wt%超添加しても安定
して高強度なろう接部が得られ無い上、AgあるいはP
dの量が多くなるとチタン材に対する流ろう性は殆ど変
わらないが、チタン材との略同色系が薄れるので、Pd
: 20〜40wt%、Au : 10wt%以下お
よびAg:60〜70wt%とした。In addition, in the case of a ternary system of Pd, Au, and Ag, Ag is 60
- Below 1%, in the combination of Pd and Au,
Even if the addition amount of Pd exceeds 40wt% and/or the addition amount of Au exceeds 10wt%, a stable and high-strength brazed joint cannot be obtained. In combination with Au, the amount of Pd added is 20w.
Even if the additive amount of U is less than 10 wt%, a stable and high-strength brazed joint cannot be obtained, and Ag or P
As the amount of d increases, the flowability to titanium material will hardly change, but the almost same color system with titanium material will fade, so Pd
: 20 to 40 wt%, Au: 10 wt% or less, and Ag: 60 to 70 wt%.
尚、本発明における不可避的不純物とは、ろう材の製造
上含有することが避けられない成分をさすが、これらと
て、ろう接待のヒユームや生体への影響等から、極力含
有量を減少させる方が望ましい。Incidentally, in the present invention, unavoidable impurities refer to components that are unavoidable in the production of brazing filler metals, but it is recommended that the content of these impurities be reduced as much as possible due to the fumes of wax entertainment and the effects on living organisms. is desirable.
以下に、本発明の実施例について説明する。 Examples of the present invention will be described below.
原料を種々配合して真空溶解し、得た鋳片をシート状に
圧延して厚さ0.2mn+の下表に示するう材を得た。Various raw materials were blended and vacuum melted, and the obtained slab was rolled into a sheet to obtain a filler material having a thickness of 0.2 mm+ as shown in the table below.
これらのろう材を用いて、幅10wm X長さ7011
11×厚さ2III11のチタン板同士をアルゴン雰囲
気中で置きろう型式でろう接し、これらろう接したもの
のろう接部のせん断強度を調査した。この調査の結果お
よびろう接状況は、同表に併せて示す通りである。Using these brazing materials, width 10wm x length 7011
Titanium plates measuring 11×thickness 2III11 were placed in an argon atmosphere and brazed together using a brazing method, and the shear strength of the soldered portions of these soldered pieces was investigated. The results of this investigation and the soldering conditions are shown in the same table.
(余 白)
表において、阻1〜6までは本発明例であって、ろう横
強度は30Kgf/mm”以上を存し、流ろう性が良く
、色調はチタン材と略同色であった。(Margin) In the table, Samples 1 to 6 are examples of the present invention, which had a solder transverse strength of 30 Kgf/mm'' or more, good flowability, and a color tone that was approximately the same as that of the titanium material.
また、表において、Nα7〜15までは比較例であって
、Nα7および8は、Agを主成分としたもので、ろう
横強度は比較的高い値が得られたが、色調がチタン材と
はやや異質のものであった。In addition, in the table, Nα7 to Nα15 are comparative examples, and Nα7 and Nα8 have Ag as the main component, and a relatively high value of solder lateral strength was obtained, but the color tone is different from that of titanium material. It was somewhat foreign.
Na 9.10.11および13は、Ag量を本発明の
上限よりかなり多くして、残量をPdとAuとで変化さ
せたものであるが、ろう横強度が低く、しかも色調がチ
タン材とはやや異質のものであった。Na 9.10.11 and 13 have a Ag content considerably higher than the upper limit of the present invention, and the remaining amounts are varied with Pd and Au, but the solder lateral strength is low and the color tone is similar to titanium material. It was somewhat different.
Nα12は、Ag量を本発明内に抑え、残量を、Pdを
低くしてAuを多くしたもので、色調はチタン材と略同
色であったが、ろう横強度が低くいものであった。In Nα12, the amount of Ag was kept within the range of the present invention, the remaining amount of Pd was lowered, and the amount of Au was increased, and the color tone was approximately the same as that of the titanium material, but the soldering strength was low.
k14は、Ag量とPdJiとを本発明の下限に抑え、
残量をAuとしたものであるが、ろう横強度が低く、し
かも色調がチタン材とはやや異質のものであった。k14 suppresses the amount of Ag and PdJi to the lower limit of the present invention,
Although the remaining amount was Au, the solder lateral strength was low and the color tone was somewhat different from that of titanium material.
k15は、Ag量を本発明の下限よりかなり少なくして
、残量をPdとAuとしたものであるが、ろう横強度が
低く、しかも色調がチタン材とはやや異質のものの上、
流ろう性がやや悪いものとなった。k15 has a Ag content much lower than the lower limit of the present invention, and the remaining amounts are Pd and Au, but it has low solder lateral strength, and its color tone is slightly different from that of titanium material.
The flowability became somewhat poor.
本発明は、上述のように、Pd−Agからなる二元系あ
るいはPd−Au−Agからなる三元系のチタン材のろ
う接部ろう材であるから、チタン材に対し良好な流ろう
性を有し、チタン材と略同色、且つ、生体に対し無害で
ある。また、ろう接に当たっては、フラックスを使用せ
ずにろう接し得ると共に、高強度のろう接部が得られる
利点を有するものである。As mentioned above, the present invention is a brazing filler metal for a binary titanium material consisting of Pd-Ag or a ternary system consisting of Pd-Au-Ag, so it has good flowability for titanium materials. It has approximately the same color as titanium material and is harmless to living organisms. Moreover, in soldering, it has the advantage that it can be soldered without using flux and that a high-strength soldered part can be obtained.
特許出願人 株式会社コベルコ科研 代理人 弁理士 金 丸 章 −Patent applicant: Kobelco Research Institute, Inc. Agent Patent Attorney Akira Kanemaru -
Claims (2)
金材のろう接用ろう材(1) Brazing filler metal for titanium or titanium alloy material consisting of Pd: 30-40 wt%, Ag: 60-70 wt% and inevitable impurities.
金材のろう接用ろう材(2) Brazing filler metal for titanium or titanium alloy material consisting of Pd: 20 to 40 wt% Au: 10 wt% or less Ag: 60 to 70 wt% and inevitable impurities
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7400488A JPH01245995A (en) | 1988-03-28 | 1988-03-28 | Brazing filler metal for brazing titanium or titanium alloy material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7400488A JPH01245995A (en) | 1988-03-28 | 1988-03-28 | Brazing filler metal for brazing titanium or titanium alloy material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01245995A true JPH01245995A (en) | 1989-10-02 |
Family
ID=13534496
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7400488A Pending JPH01245995A (en) | 1988-03-28 | 1988-03-28 | Brazing filler metal for brazing titanium or titanium alloy material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01245995A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100480934B1 (en) * | 2002-12-05 | 2005-04-07 | 주식회사 바이오머테리얼즈코리아 | Ti-Ag ALLOY FOR USE OF BIO-MATERIALS HAVING EXCELLENT STRENGTH AND CORROSION RESISTANCE |
-
1988
- 1988-03-28 JP JP7400488A patent/JPH01245995A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100480934B1 (en) * | 2002-12-05 | 2005-04-07 | 주식회사 바이오머테리얼즈코리아 | Ti-Ag ALLOY FOR USE OF BIO-MATERIALS HAVING EXCELLENT STRENGTH AND CORROSION RESISTANCE |
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