SK11512003A3 - Mikrolegovaná bezkyslíková zliatina medi a jej použitie - Google Patents

Mikrolegovaná bezkyslíková zliatina medi a jej použitie Download PDF

Info

Publication number
SK11512003A3
SK11512003A3 SK1151-2003A SK11512003A SK11512003A3 SK 11512003 A3 SK11512003 A3 SK 11512003A3 SK 11512003 A SK11512003 A SK 11512003A SK 11512003 A3 SK11512003 A3 SK 11512003A3
Authority
SK
Slovakia
Prior art keywords
copper alloy
oxygen
ppm
alloy according
free copper
Prior art date
Application number
SK1151-2003A
Other languages
English (en)
Slovak (sk)
Inventor
Timo Salonen
Antti Kilpinen
Original Assignee
Outokumpu Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Outokumpu Oyj filed Critical Outokumpu Oyj
Publication of SK11512003A3 publication Critical patent/SK11512003A3/sk

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Arc Welding In General (AREA)
  • Conductive Materials (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
SK1151-2003A 2001-03-09 2002-03-08 Mikrolegovaná bezkyslíková zliatina medi a jej použitie SK11512003A3 (sk)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20010473A FI113061B (fi) 2001-03-09 2001-03-09 Kupariseos
PCT/FI2002/000184 WO2002072901A1 (en) 2001-03-09 2002-03-08 Micro-alloyed oxygen-free copper alloy and its use

Publications (1)

Publication Number Publication Date
SK11512003A3 true SK11512003A3 (sk) 2004-04-06

Family

ID=8560689

Family Applications (1)

Application Number Title Priority Date Filing Date
SK1151-2003A SK11512003A3 (sk) 2001-03-09 2002-03-08 Mikrolegovaná bezkyslíková zliatina medi a jej použitie

Country Status (11)

Country Link
US (1) US20040096353A1 (ja)
EP (1) EP1373588A1 (ja)
JP (1) JP2004538362A (ja)
CN (1) CN1496416A (ja)
BR (1) BR0207879A (ja)
CZ (1) CZ20032372A3 (ja)
FI (1) FI113061B (ja)
HU (1) HUP0303470A3 (ja)
PL (1) PL363969A1 (ja)
SK (1) SK11512003A3 (ja)
WO (1) WO2002072901A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009024132A2 (de) * 2007-08-21 2009-02-26 Prymetall Gmbh & Co. Kg Kabel mit koaxialen aufbau zur übertragung von hochfrequenzsignalen sowie verfahren zur herstellung eines derartigen kabels
ITUA20163211A1 (it) * 2016-05-06 2017-11-06 De Angeli Prod S R L Conduttore elettrico per avvolgimenti elettrici, specialmente per cavo trasposto continuo
DK3622094T3 (da) 2017-05-10 2021-09-27 Haldor Topsoe As Fremgangsmåde til reduktion af oxygenindholdet i metallisk kobber
CN111549254A (zh) * 2020-04-29 2020-08-18 铜陵有色金属集团股份有限公司金威铜业分公司 一种无氧铜基微合金及其制备方法和应用

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI40237B (ja) * 1966-05-04 1968-07-31 Outokumpu Oy
US4059437A (en) * 1975-07-02 1977-11-22 Phelps Dodge Industries, Inc. Oxygen-free copper product and process
US4233067A (en) * 1978-01-19 1980-11-11 Sumitomo Electric Industries, Ltd. Soft copper alloy conductors
US4311522A (en) * 1980-04-09 1982-01-19 Amax Inc. Copper alloys with small amounts of manganese and selenium
JP2726939B2 (ja) * 1989-03-06 1998-03-11 日鉱金属 株式会社 加工性，耐熱性の優れた高導電性銅合金

Also Published As

Publication number Publication date
WO2002072901A1 (en) 2002-09-19
FI20010473A (fi) 2002-09-10
CN1496416A (zh) 2004-05-12
HUP0303470A2 (hu) 2004-01-28
US20040096353A1 (en) 2004-05-20
BR0207879A (pt) 2004-03-02
EP1373588A1 (en) 2004-01-02
CZ20032372A3 (cs) 2003-12-17
FI113061B (fi) 2004-02-27
PL363969A1 (en) 2004-11-29
FI20010473A0 (fi) 2001-03-09
JP2004538362A (ja) 2004-12-24
HUP0303470A3 (en) 2005-10-28

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