BR0207879A - Liga de cobre isenta de oxigênio, micro-ligada e seu respectivo uso - Google Patents

Liga de cobre isenta de oxigênio, micro-ligada e seu respectivo uso

Info

Publication number
BR0207879A
BR0207879A BR0207879-1A BR0207879A BR0207879A BR 0207879 A BR0207879 A BR 0207879A BR 0207879 A BR0207879 A BR 0207879A BR 0207879 A BR0207879 A BR 0207879A
Authority
BR
Brazil
Prior art keywords
copper alloy
oxygen
free
micro
alloyed copper
Prior art date
Application number
BR0207879-1A
Other languages
English (en)
Portuguese (pt)
Inventor
Timo Salonen
Antti Kilpinen
Original Assignee
Outokumpu Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Outokumpu Oy filed Critical Outokumpu Oy
Publication of BR0207879A publication Critical patent/BR0207879A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Arc Welding In General (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
BR0207879-1A 2001-03-09 2002-03-08 Liga de cobre isenta de oxigênio, micro-ligada e seu respectivo uso BR0207879A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20010473A FI113061B (fi) 2001-03-09 2001-03-09 Kupariseos
PCT/FI2002/000184 WO2002072901A1 (en) 2001-03-09 2002-03-08 Micro-alloyed oxygen-free copper alloy and its use

Publications (1)

Publication Number Publication Date
BR0207879A true BR0207879A (pt) 2004-03-02

Family

ID=8560689

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0207879-1A BR0207879A (pt) 2001-03-09 2002-03-08 Liga de cobre isenta de oxigênio, micro-ligada e seu respectivo uso

Country Status (11)

Country Link
US (1) US20040096353A1 (ja)
EP (1) EP1373588A1 (ja)
JP (1) JP2004538362A (ja)
CN (1) CN1496416A (ja)
BR (1) BR0207879A (ja)
CZ (1) CZ20032372A3 (ja)
FI (1) FI113061B (ja)
HU (1) HUP0303470A3 (ja)
PL (1) PL363969A1 (ja)
SK (1) SK11512003A3 (ja)
WO (1) WO2002072901A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009024132A2 (de) * 2007-08-21 2009-02-26 Prymetall Gmbh & Co. Kg Kabel mit koaxialen aufbau zur übertragung von hochfrequenzsignalen sowie verfahren zur herstellung eines derartigen kabels
ITUA20163211A1 (it) * 2016-05-06 2017-11-06 De Angeli Prod S R L Conduttore elettrico per avvolgimenti elettrici, specialmente per cavo trasposto continuo
EP3622094B1 (en) 2017-05-10 2021-07-28 Haldor Topsøe A/S A process for reducing the content of oxygen in metallic copper
CN111549254A (zh) * 2020-04-29 2020-08-18 铜陵有色金属集团股份有限公司金威铜业分公司 一种无氧铜基微合金及其制备方法和应用

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI40237B (ja) * 1966-05-04 1968-07-31 Outokumpu Oy
US4059437A (en) * 1975-07-02 1977-11-22 Phelps Dodge Industries, Inc. Oxygen-free copper product and process
US4233067A (en) * 1978-01-19 1980-11-11 Sumitomo Electric Industries, Ltd. Soft copper alloy conductors
US4311522A (en) * 1980-04-09 1982-01-19 Amax Inc. Copper alloys with small amounts of manganese and selenium
JP2726939B2 (ja) * 1989-03-06 1998-03-11 日鉱金属 株式会社 加工性，耐熱性の優れた高導電性銅合金

Also Published As

Publication number Publication date
CZ20032372A3 (cs) 2003-12-17
CN1496416A (zh) 2004-05-12
PL363969A1 (en) 2004-11-29
WO2002072901A1 (en) 2002-09-19
FI20010473A0 (fi) 2001-03-09
JP2004538362A (ja) 2004-12-24
HUP0303470A2 (hu) 2004-01-28
EP1373588A1 (en) 2004-01-02
SK11512003A3 (sk) 2004-04-06
US20040096353A1 (en) 2004-05-20
FI20010473A (fi) 2002-09-10
FI113061B (fi) 2004-02-27
HUP0303470A3 (en) 2005-10-28

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Legal Events

Date Code Title Description
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 6A, 7A ANUIDADE(S).

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2029 DE 24/11/2009.