SG98399A1 - Mold assembly and method for encapsulating semiconductor device - Google Patents

Mold assembly and method for encapsulating semiconductor device

Info

Publication number
SG98399A1
SG98399A1 SG200002876A SG200002876A SG98399A1 SG 98399 A1 SG98399 A1 SG 98399A1 SG 200002876 A SG200002876 A SG 200002876A SG 200002876 A SG200002876 A SG 200002876A SG 98399 A1 SG98399 A1 SG 98399A1
Authority
SG
Singapore
Prior art keywords
semiconductor device
mold assembly
encapsulating semiconductor
encapsulating
mold
Prior art date
Application number
SG200002876A
Other languages
English (en)
Inventor
Tsuruta Hisayuki
Original Assignee
Nec Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Electronics Corp filed Critical Nec Electronics Corp
Publication of SG98399A1 publication Critical patent/SG98399A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
SG200002876A 1999-05-27 2000-05-25 Mold assembly and method for encapsulating semiconductor device SG98399A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14767399A JP3450223B2 (ja) 1999-05-27 1999-05-27 半導体装置封入用金型、及び、半導体装置封入方法

Publications (1)

Publication Number Publication Date
SG98399A1 true SG98399A1 (en) 2003-09-19

Family

ID=15435701

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200002876A SG98399A1 (en) 1999-05-27 2000-05-25 Mold assembly and method for encapsulating semiconductor device

Country Status (4)

Country Link
US (2) US6554598B1 (ja)
JP (1) JP3450223B2 (ja)
KR (1) KR100389569B1 (ja)
SG (1) SG98399A1 (ja)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030024116A1 (en) * 2001-08-06 2003-02-06 Gerhard Engeser Method of establishing an electrical connection
US6969918B1 (en) * 2001-08-30 2005-11-29 Micron Technology, Inc. System for fabricating semiconductor components using mold cavities having runners configured to minimize venting
JP4200758B2 (ja) * 2002-12-26 2008-12-24 株式会社日立ハイテクノロジーズ パネルの樹脂塗布方法、ディスプレイ用パネルの製造方法及び樹脂塗布装置
JP4607429B2 (ja) * 2003-03-25 2011-01-05 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
JP3941945B2 (ja) * 2003-04-16 2007-07-11 ミネベア株式会社 レゾルバの巻線保護用樹脂モールド方法
US7241414B2 (en) * 2004-06-25 2007-07-10 Asm Technology Singapore Pte Ltd. Method and apparatus for molding a semiconductor device
JP4443334B2 (ja) * 2004-07-16 2010-03-31 Ｔｏｗａ株式会社 半導体素子の樹脂封止成形方法
KR100693269B1 (ko) * 2005-09-09 2007-03-13 세크론 주식회사 반도체 제조용 프레스 금형장치
JP4084844B2 (ja) * 2005-09-27 2008-04-30 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び装置
JP2007095804A (ja) * 2005-09-27 2007-04-12 Towa Corp 電子部品の樹脂封止成形方法及び装置
JP4855026B2 (ja) * 2005-09-27 2012-01-18 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び装置
US7771181B2 (en) * 2005-11-14 2010-08-10 3M Innovative Properties Company Gasket molding system for membrane electrode assemblies
US20070298268A1 (en) * 2006-06-27 2007-12-27 Gelcore Llc Encapsulated optoelectronic device
CN101531041B (zh) * 2008-03-12 2012-03-14 深圳富泰宏精密工业有限公司 模具结构
JP5208099B2 (ja) * 2009-12-11 2013-06-12 日立オートモティブシステムズ株式会社 流量センサとその製造方法、及び流量センサモジュール
US20130328220A1 (en) * 2012-06-12 2013-12-12 KyungHoon Lee Integrated circuit packaging system with film assist and method of manufacture thereof
JP5971270B2 (ja) * 2014-02-27 2016-08-17 トヨタ自動車株式会社 半導体装置の製造方法および製造装置
CN111609773A (zh) * 2020-05-29 2020-09-01 西安庆华民用爆破器材股份有限公司 一种电子雷管自动蘸药用分体式模具

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1034699A (ja) * 1996-07-23 1998-02-10 Apic Yamada Kk Ｓｏｎパッケージの樹脂封止方法及び樹脂封止装置
EP0890425A1 (en) * 1997-07-11 1999-01-13 Apic Yamada Corporation Method of resin molding and resin molding machine
JPH1134066A (ja) * 1997-07-16 1999-02-09 Apic Yamada Kk リリースフィルムを用いる樹脂モールド装置及び樹脂モールド方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69501632T2 (de) * 1994-11-21 1998-07-23 Apic Yamada Corp Harzformmaschine mit Trennfolie
NL9500238A (nl) * 1995-02-09 1996-09-02 Fico Bv Omhulinrichting met compensatie-element.
US5609889A (en) * 1995-05-26 1997-03-11 Hestia Technologies, Inc. Apparatus for encapsulating electronic packages
US6048483A (en) * 1996-07-23 2000-04-11 Apic Yamada Corporation Resin sealing method for chip-size packages
US5656549A (en) * 1996-08-19 1997-08-12 Motorola, Inc. Method of packaging a semiconductor device
US5766535A (en) * 1997-06-04 1998-06-16 Integrated Packaging Assembly Corporation Pressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuits
JPH1140593A (ja) * 1997-07-16 1999-02-12 Towa Kk 電子部品の樹脂封止成形方法及び金型

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1034699A (ja) * 1996-07-23 1998-02-10 Apic Yamada Kk Ｓｏｎパッケージの樹脂封止方法及び樹脂封止装置
EP0890425A1 (en) * 1997-07-11 1999-01-13 Apic Yamada Corporation Method of resin molding and resin molding machine
JPH1134066A (ja) * 1997-07-16 1999-02-09 Apic Yamada Kk リリースフィルムを用いる樹脂モールド装置及び樹脂モールド方法

Also Published As

Publication number Publication date
KR20010049421A (ko) 2001-06-15
JP3450223B2 (ja) 2003-09-22
KR100389569B1 (ko) 2003-06-27
JP2000334782A (ja) 2000-12-05
US20030122279A1 (en) 2003-07-03
US6554598B1 (en) 2003-04-29

Similar Documents

Publication Publication Date Title
GB2353404B (en) Semiconductor device and method for manufacturing the same
EP1146555A4 (en) SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
SG98399A1 (en) Mold assembly and method for encapsulating semiconductor device
EP1122769A4 (en) SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
SG85171A1 (en) Method of manufacturing semiconductor device
SG74115A1 (en) Semiconductor device and its manufacturing method
HK1053012A1 (en) Semiconductor device and forming method thereof
GB2345791B (en) Semiconductor device and fabrication method therefor
GB2336030B (en) A semiconductor device and a method for fabricating thereof
GB2344464B (en) Semiconductor device and manufacturing method thereof
EP1187183A4 (en) MANUFACTURE OF A SEMICONDUCTOR PART AND ASSOCIATED MANUFACTURING STRIP
SG77707A1 (en) Semiconductor device and method for manufacturing the same
SG68051A1 (en) Lead frame the manufacturing method semiconductor device and the manufacturing method
SG98005A1 (en) Semiconductor device and process therefor
GB9927693D0 (en) Semiconductor device production method
SG78391A1 (en) Semiconductor device manufacturing method
GB2347266B (en) Semiconductor device and fabrication process therefor
EP1030375A4 (en) SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
HK1047655A1 (zh) 半導體及其製造方法
EP1170784A4 (en) SEMICONDUCTOR DEVICE AND ASSOCIATED PRODUCTION METHOD
EP1191582A4 (en) PRODUCTION METHOD FOR A SEMICONDUCTOR ARRANGEMENT
GB2336243B (en) Method for manufacturing semiconductor device
GB2326280B (en) Method for fabricating semiconductor device
GB2362757B (en) Method and apparatus for manufacturing semiconductor device
GB2348540B (en) Manufacturing method of semiconductor device