SG97127A1 - A scalable multi-pad design for improved cmp process - Google Patents

A scalable multi-pad design for improved cmp process

Info

Publication number
SG97127A1
SG97127A1 SG9901589A SG1999001589A SG97127A1 SG 97127 A1 SG97127 A1 SG 97127A1 SG 9901589 A SG9901589 A SG 9901589A SG 1999001589 A SG1999001589 A SG 1999001589A SG 97127 A1 SG97127 A1 SG 97127A1
Authority
SG
Singapore
Prior art keywords
pad
polishing
slurry
cmp process
pad design
Prior art date
Application number
SG9901589A
Other languages
English (en)
Inventor
Liu Erzhuang
Pan Yang
Original Assignee
Chartered Semiconductor Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chartered Semiconductor Mfg filed Critical Chartered Semiconductor Mfg
Publication of SG97127A1 publication Critical patent/SG97127A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG9901589A 1998-11-16 1999-03-31 A scalable multi-pad design for improved cmp process SG97127A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/192,522 US6296550B1 (en) 1998-11-16 1998-11-16 Scalable multi-pad design for improved CMP process

Publications (1)

Publication Number Publication Date
SG97127A1 true SG97127A1 (en) 2003-07-18

Family

ID=22710022

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9901589A SG97127A1 (en) 1998-11-16 1999-03-31 A scalable multi-pad design for improved cmp process

Country Status (5)

Country Link
US (1) US6296550B1 (de)
EP (1) EP1000705B1 (de)
AT (1) ATE350194T1 (de)
DE (1) DE69934652T2 (de)
SG (1) SG97127A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6719615B1 (en) 2000-10-10 2004-04-13 Beaver Creek Concepts Inc Versatile wafer refining
US6435948B1 (en) 2000-10-10 2002-08-20 Beaver Creek Concepts Inc Magnetic finishing apparatus
US6413153B1 (en) * 1999-04-26 2002-07-02 Beaver Creek Concepts Inc Finishing element including discrete finishing members
US6435941B1 (en) * 2000-05-12 2002-08-20 Appllied Materials, Inc. Apparatus and method for chemical mechanical planarization
US7377836B1 (en) 2000-10-10 2008-05-27 Beaver Creek Concepts Inc Versatile wafer refining
US6561881B2 (en) * 2001-03-15 2003-05-13 Oriol Inc. System and method for chemical mechanical polishing using multiple small polishing pads
US20030045208A1 (en) * 2001-09-06 2003-03-06 Neidrich Jason M. System and method for chemical mechanical polishing using retractable polishing pads
US8357286B1 (en) * 2007-10-29 2013-01-22 Semcon Tech, Llc Versatile workpiece refining
GB2477557A (en) * 2010-02-08 2011-08-10 Qioptiq Ltd Aspheric optical surface polishing tool with individually movable polishing pads
DE102012201516A1 (de) * 2012-02-02 2013-08-08 Siltronic Ag Verfahren zum Polieren einer Halbleiterscheibe
KR20140144959A (ko) * 2013-06-12 2014-12-22 삼성전자주식회사 연마 패드 제조 장치 및 이를 제조하는 방법
US20150111478A1 (en) * 2013-10-23 2015-04-23 Applied Materials, Inc. Polishing system with local area rate control
KR102333209B1 (ko) 2015-04-28 2021-12-01 삼성디스플레이 주식회사 기판 연마 장치
CN109155249B (zh) * 2016-03-25 2023-06-23 应用材料公司 局部区域研磨系统以及用于研磨系统的研磨垫组件
CN109075054B (zh) * 2016-03-25 2023-06-09 应用材料公司 具有局部区域速率控制及振荡模式的研磨系统

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2264177A (en) * 1939-07-26 1941-11-25 Pittsburgh Plate Glass Co Control mechanism for surfacing apparatus
US2399924A (en) * 1945-02-17 1946-05-07 Hayward Roger Device for grinding and polishing surfaces
JPH06252113A (ja) * 1993-02-26 1994-09-09 Matsushita Electric Ind Co Ltd 半導体基板の平坦化方法
US5836807A (en) * 1994-08-08 1998-11-17 Leach; Michael A. Method and structure for polishing a wafer during manufacture of integrated circuits
US5934979A (en) * 1993-11-16 1999-08-10 Applied Materials, Inc. Chemical mechanical polishing apparatus using multiple polishing pads

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5230184A (en) 1991-07-05 1993-07-27 Motorola, Inc. Distributed polishing head
US5329734A (en) 1993-04-30 1994-07-19 Motorola, Inc. Polishing pads used to chemical-mechanical polish a semiconductor substrate
US5575707A (en) 1994-10-11 1996-11-19 Ontrak Systems, Inc. Polishing pad cluster for polishing a semiconductor wafer
JP3329644B2 (ja) 1995-07-21 2002-09-30 株式会社東芝 研磨パッド、研磨装置及び研磨方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2264177A (en) * 1939-07-26 1941-11-25 Pittsburgh Plate Glass Co Control mechanism for surfacing apparatus
US2399924A (en) * 1945-02-17 1946-05-07 Hayward Roger Device for grinding and polishing surfaces
JPH06252113A (ja) * 1993-02-26 1994-09-09 Matsushita Electric Ind Co Ltd 半導体基板の平坦化方法
US5934979A (en) * 1993-11-16 1999-08-10 Applied Materials, Inc. Chemical mechanical polishing apparatus using multiple polishing pads
US5836807A (en) * 1994-08-08 1998-11-17 Leach; Michael A. Method and structure for polishing a wafer during manufacture of integrated circuits

Also Published As

Publication number Publication date
EP1000705A3 (de) 2003-02-05
EP1000705A2 (de) 2000-05-17
EP1000705B1 (de) 2007-01-03
DE69934652T2 (de) 2007-05-03
ATE350194T1 (de) 2007-01-15
US6296550B1 (en) 2001-10-02
DE69934652D1 (de) 2007-02-15

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