SG83216A1 - Process for producing polishing composition - Google Patents

Process for producing polishing composition

Info

Publication number
SG83216A1
SG83216A1 SG200003879A SG200003879A SG83216A1 SG 83216 A1 SG83216 A1 SG 83216A1 SG 200003879 A SG200003879 A SG 200003879A SG 200003879 A SG200003879 A SG 200003879A SG 83216 A1 SG83216 A1 SG 83216A1
Authority
SG
Singapore
Prior art keywords
polishing composition
producing polishing
producing
composition
polishing
Prior art date
Application number
SG200003879A
Other languages
English (en)
Inventor
Tamai Kazusei
Ina Katsuyoshi
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of SG83216A1 publication Critical patent/SG83216A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/50—Mixing liquids with solids
    • B01F23/51—Methods thereof
    • B01F23/511—Methods thereof characterised by the composition of the liquids or solids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/50—Mixing liquids with solids
    • B01F23/56—Mixing liquids with solids by introducing solids in liquids, e.g. dispersing or dissolving
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F2101/00—Mixing characterised by the nature of the mixed materials or by the application field
    • B01F2101/27—Mixing ingredients for grinding, polishing or lapping materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Silicon Compounds (AREA)
  • Weting (AREA)
SG200003879A 1999-07-15 2000-07-11 Process for producing polishing composition SG83216A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20218199A JP3721497B2 (ja) 1999-07-15 1999-07-15 研磨用組成物の製造方法

Publications (1)

Publication Number Publication Date
SG83216A1 true SG83216A1 (en) 2001-09-18

Family

ID=16453313

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200003879A SG83216A1 (en) 1999-07-15 2000-07-11 Process for producing polishing composition

Country Status (5)

Country Link
US (1) US6248144B1 (ko)
JP (1) JP3721497B2 (ko)
KR (1) KR100696150B1 (ko)
SG (1) SG83216A1 (ko)
TW (1) TWI283262B (ko)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4500380B2 (ja) * 1999-08-11 2010-07-14 株式会社トクヤマ ヒュームドシリカスラリーの製造方法
US20030094593A1 (en) * 2001-06-14 2003-05-22 Hellring Stuart D. Silica and a silica-based slurry
DE10152993A1 (de) * 2001-10-26 2003-05-08 Bayer Ag Zusammensetzung für das chemisch-mechanische Polieren von Metall- und Metall/Dielektrikastrukturen mit hoher Selektivität
KR100497608B1 (ko) * 2002-08-05 2005-07-01 삼성전자주식회사 슬러리 조성물 및 이의 제조 방법과 이를 사용한 연마 방법
JP4426192B2 (ja) * 2003-02-14 2010-03-03 ニッタ・ハース株式会社 研磨用組成物の製造方法
DE10317066A1 (de) * 2003-04-14 2004-11-11 Degussa Ag Verfahren zur Herstellung von Metalloxid- und Metalloidoxid-Dispersionen
US20050189322A1 (en) * 2004-02-27 2005-09-01 Lane Sarah J. Compositions and methods for chemical mechanical polishing silica and silicon nitride
JP5164129B2 (ja) * 2004-03-29 2013-03-13 ニッタ・ハース株式会社 半導体研磨用組成物
JP2005286047A (ja) * 2004-03-29 2005-10-13 Nitta Haas Inc 半導体研磨用組成物
JP2005286048A (ja) * 2004-03-29 2005-10-13 Nitta Haas Inc 半導体研磨用組成物
US20050214191A1 (en) * 2004-03-29 2005-09-29 Mueller Brian L Abrasives and compositions for chemical mechanical planarization of tungsten and titanium
US20050211952A1 (en) * 2004-03-29 2005-09-29 Timothy Mace Compositions and methods for chemical mechanical planarization of tungsten and titanium
JP2005286046A (ja) * 2004-03-29 2005-10-13 Nitta Haas Inc 半導体研磨用組成物
GB0407198D0 (en) 2004-03-30 2004-05-05 British Telecomm Joint fault detection
KR20120031242A (ko) * 2004-05-04 2012-03-30 캐보트 코포레이션 원하는 응집체 입자 직경을 갖는 응집체 금속 산화물 입자 분산액의 제조 방법
TWI364450B (en) * 2004-08-09 2012-05-21 Kao Corp Polishing composition
JP2006136996A (ja) * 2004-10-12 2006-06-01 Kao Corp 研磨液組成物の製造方法
US20060089093A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089094A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089095A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20070209288A1 (en) * 2005-03-28 2007-09-13 Yoshiharu Ohta Semiconductor Polishing Composition
JP4955253B2 (ja) * 2005-06-02 2012-06-20 日本化学工業株式会社 デバイスウエハエッジ研磨用研磨組成物、その製造方法、及び研磨加工方法
KR101214060B1 (ko) 2005-09-26 2012-12-20 플레이너 솔루션즈 엘엘씨 화학적 기계적 연마 용도로 사용되기 위한 초고순도의 콜로이드 실리카
DE102006002545A1 (de) * 2006-01-18 2007-07-19 Ewald Dörken Ag Siliziumbasiertes Korrosionsschutzmittel
JP5059369B2 (ja) * 2006-10-10 2012-10-24 株式会社トクヤマ アルカリ性シリカ分散液及びその製造方法
DE102006059315A1 (de) * 2006-12-15 2008-06-19 Evonik Degussa Gmbh Verfahren zur Herstellung von pyrogen hergestellten Siliciumdioxid-Dispersionen
US7931714B2 (en) * 2007-10-08 2011-04-26 Uwiz Technology Co., Ltd. Composition useful to chemical mechanical planarization of metal
CN102027101A (zh) * 2008-04-24 2011-04-20 Ppt研究公司 稳定的水性浆料悬浮体
JP5441362B2 (ja) * 2008-05-30 2014-03-12 富士フイルム株式会社 研磨液及び研磨方法
DE102008041466A1 (de) * 2008-08-22 2010-02-25 Wacker Chemie Ag Wäßrige Dispersionen hydrophober Kieselsäuren
JP5325572B2 (ja) * 2008-12-26 2013-10-23 ニッタ・ハース株式会社 研磨組成物
KR101673692B1 (ko) 2014-11-07 2016-11-07 현대자동차주식회사 건식 실리카 입자를 포함하는 상변이 현탁 유체 조성물 및 이의 제조방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5116535A (en) * 1989-03-21 1992-05-26 Cabot Corporation Aqueous colloidal dispersion of fumed silica without a stabilizer
US5246624A (en) * 1989-03-21 1993-09-21 Cabot Corporation Aqueous colloidal dispersion of fumed silica, acid and stabilizer
US5904159A (en) * 1995-11-10 1999-05-18 Tokuyama Corporation Polishing slurries and a process for the production thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4006392A1 (de) * 1989-03-21 1990-09-27 Cabot Corp Waessrige colloidale dispersion aus in der gasphase hergestelltem siliciumdioxid, aus einer saeure und aus einem stabilisator, sowie ein verfahren zu ihrer hertellung
JP3060420B2 (ja) 1991-09-14 2000-07-10 オークマ株式会社 Ａｔｃ速度制御方法
JP3437900B2 (ja) * 1995-11-10 2003-08-18 株式会社トクヤマ 研磨剤
JP3050112B2 (ja) 1995-12-14 2000-06-12 日本電気株式会社 半導体装置の製造方法
SG54606A1 (en) 1996-12-05 1998-11-16 Fujimi Inc Polishing composition
KR100574259B1 (ko) * 1999-03-31 2006-04-27 가부시끼가이샤 도꾸야마 연마제 및 연마 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5116535A (en) * 1989-03-21 1992-05-26 Cabot Corporation Aqueous colloidal dispersion of fumed silica without a stabilizer
US5246624A (en) * 1989-03-21 1993-09-21 Cabot Corporation Aqueous colloidal dispersion of fumed silica, acid and stabilizer
US5904159A (en) * 1995-11-10 1999-05-18 Tokuyama Corporation Polishing slurries and a process for the production thereof

Also Published As

Publication number Publication date
US6248144B1 (en) 2001-06-19
JP3721497B2 (ja) 2005-11-30
JP2001026771A (ja) 2001-01-30
TWI283262B (en) 2007-07-01
KR100696150B1 (ko) 2007-03-20
KR20010039715A (ko) 2001-05-15

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