SG79296A1 - Chemical mechanical abrasive composition for use in semiconductor processing - Google Patents

Chemical mechanical abrasive composition for use in semiconductor processing

Info

Publication number
SG79296A1
SG79296A1 SG9906337A SG1999006337A SG79296A1 SG 79296 A1 SG79296 A1 SG 79296A1 SG 9906337 A SG9906337 A SG 9906337A SG 1999006337 A SG1999006337 A SG 1999006337A SG 79296 A1 SG79296 A1 SG 79296A1
Authority
SG
Singapore
Prior art keywords
chemical mechanical
semiconductor processing
abrasive composition
mechanical abrasive
composition
Prior art date
Application number
SG9906337A
Other languages
English (en)
Inventor
Tsung Ho Lee
Kang-Hua Lee
Tsui-Ping Yeh
Original Assignee
Eternal Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eternal Chemical Co Ltd filed Critical Eternal Chemical Co Ltd
Publication of SG79296A1 publication Critical patent/SG79296A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG9906337A 1999-07-16 1999-12-10 Chemical mechanical abrasive composition for use in semiconductor processing SG79296A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN99109797A CN1125861C (zh) 1999-07-16 1999-07-16 半导体加工用化学机械研磨组合物

Publications (1)

Publication Number Publication Date
SG79296A1 true SG79296A1 (en) 2001-03-20

Family

ID=5274156

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9906337A SG79296A1 (en) 1999-07-16 1999-12-10 Chemical mechanical abrasive composition for use in semiconductor processing

Country Status (4)

Country Link
EP (1) EP1069168B1 (zh)
CN (1) CN1125861C (zh)
DE (1) DE60017642T2 (zh)
SG (1) SG79296A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI282360B (en) * 2002-06-03 2007-06-11 Hitachi Chemical Co Ltd Polishing composition and polishing method thereof
GB2393186B (en) * 2002-07-31 2006-02-22 Kao Corp Polishing composition
JP3875156B2 (ja) * 2002-08-07 2007-01-31 花王株式会社 ロールオフ低減剤
GB2393447B (en) * 2002-08-07 2006-04-19 Kao Corp Polishing composition
US7186653B2 (en) 2003-07-30 2007-03-06 Climax Engineered Materials, Llc Polishing slurries and methods for chemical mechanical polishing
CN101153205A (zh) * 2006-09-29 2008-04-02 安集微电子（上海）有限公司 用于抛光低介电材料的化学机械抛光液
WO2009041697A1 (ja) * 2007-09-28 2009-04-02 Nitta Haas Incorporated 研磨用組成物
CN102101982A (zh) * 2009-12-18 2011-06-22 安集微电子（上海）有限公司 一种化学机械抛光液
CN102477258B (zh) * 2010-11-26 2015-05-27 安集微电子（上海）有限公司 一种化学机械抛光液
KR101907637B1 (ko) * 2018-02-09 2018-12-05 엘티씨에이엠 주식회사 실리콘질화막의 고선택비 식각 조성물
CN113122147B (zh) * 2019-12-31 2024-03-12 安集微电子科技（上海）股份有限公司 一种化学机械抛光液及其使用方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0846741A1 (en) * 1996-12-05 1998-06-10 Fujimi Incorporated Polishing composition

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3850053B2 (ja) * 1995-10-04 2006-11-29 花王株式会社 磁気記録媒体基板製造用研磨材組成物及び磁気記録媒体用基板の製造方法
WO1998021289A1 (fr) * 1996-11-14 1998-05-22 Kao Corporation Composition abrasive utilisee dans la fabrication de la base d'un support d'enregistrement magnetique, et procede de fabrication de cette base a l'aide de cette composition
US6007592A (en) * 1996-11-14 1999-12-28 Nissan Chemical Industries, Ltd. Polishing composition for aluminum disk and polishing process therewith
US6068787A (en) * 1996-11-26 2000-05-30 Cabot Corporation Composition and slurry useful for metal CMP
AU5460898A (en) * 1996-11-26 1998-06-22 Cabot Corporation Composition and method for polishing rigid disks
US5916855A (en) * 1997-03-26 1999-06-29 Advanced Micro Devices, Inc. Chemical-mechanical polishing slurry formulation and method for tungsten and titanium thin films
JPH1121545A (ja) * 1997-06-30 1999-01-26 Fujimi Inkooporeetetsudo:Kk 研磨用組成物
US6083419A (en) * 1997-07-28 2000-07-04 Cabot Corporation Polishing composition including an inhibitor of tungsten etching
JPH1180708A (ja) * 1997-09-09 1999-03-26 Fujimi Inkooporeetetsudo:Kk 研磨用組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0846741A1 (en) * 1996-12-05 1998-06-10 Fujimi Incorporated Polishing composition

Also Published As

Publication number Publication date
DE60017642T2 (de) 2006-03-30
EP1069168B1 (en) 2005-01-26
DE60017642D1 (de) 2005-03-03
EP1069168A1 (en) 2001-01-17
CN1281023A (zh) 2001-01-24
CN1125861C (zh) 2003-10-29

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