HK1020983A1 - Chemical mechanical abrasive composition for use in semiconductor processing - Google Patents
Chemical mechanical abrasive composition for use in semiconductor processingInfo
- Publication number
- HK1020983A1 HK1020983A1 HK99106207A HK99106207A HK1020983A1 HK 1020983 A1 HK1020983 A1 HK 1020983A1 HK 99106207 A HK99106207 A HK 99106207A HK 99106207 A HK99106207 A HK 99106207A HK 1020983 A1 HK1020983 A1 HK 1020983A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- chemical mechanical
- semiconductor processing
- abrasive composition
- mechanical abrasive
- composition
- Prior art date
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 98100843 CN1092697C (en) | 1998-02-20 | 1998-02-20 | Chemically mechanical grinding composition for treating semiconductor |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1020983A1 true HK1020983A1 (en) | 2000-05-26 |
Family
ID=5216283
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK99106207A HK1020983A1 (en) | 1998-02-20 | 1999-12-30 | Chemical mechanical abrasive composition for use in semiconductor processing |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN1092697C (en) |
HK (1) | HK1020983A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1731277B (en) * | 2005-08-09 | 2011-07-27 | 广东光华化学厂有限公司 | Preparation method of high concentration ferric ammonium ethylene diamine tetraacetate solution |
WO2007095322A1 (en) * | 2006-02-14 | 2007-08-23 | Cabot Microelectronics Corporation | Compositions and methods for cmp of indium tin oxide surfaces |
-
1998
- 1998-02-20 CN CN 98100843 patent/CN1092697C/en not_active Expired - Fee Related
-
1999
- 1999-12-30 HK HK99106207A patent/HK1020983A1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1226591A (en) | 1999-08-25 |
CN1092697C (en) | 2002-10-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PF | Patent in force | ||
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20070220 |