SG77207A1 - Cleaning method and apparatus - Google Patents

Cleaning method and apparatus

Info

Publication number
SG77207A1
SG77207A1 SG1998005348A SG1998005348A SG77207A1 SG 77207 A1 SG77207 A1 SG 77207A1 SG 1998005348 A SG1998005348 A SG 1998005348A SG 1998005348 A SG1998005348 A SG 1998005348A SG 77207 A1 SG77207 A1 SG 77207A1
Authority
SG
Singapore
Prior art keywords
cleaning method
cleaning
Prior art date
Application number
SG1998005348A
Other languages
English (en)
Inventor
Kanji Kobayashi
Jun Kudo
Masao Yamaguchi
Shinya Yoshihara
Original Assignee
Tdk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk Corp filed Critical Tdk Corp
Publication of SG77207A1 publication Critical patent/SG77207A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
SG1998005348A 1997-12-09 1998-12-08 Cleaning method and apparatus SG77207A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33911197A JP3331168B2 (ja) 1997-12-09 1997-12-09 洗浄方法および装置

Publications (1)

Publication Number Publication Date
SG77207A1 true SG77207A1 (en) 2000-12-19

Family

ID=18324374

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1998005348A SG77207A1 (en) 1997-12-09 1998-12-08 Cleaning method and apparatus

Country Status (4)

Country Link
US (2) US6254688B1 (zh)
JP (1) JP3331168B2 (zh)
CN (1) CN1165971C (zh)
SG (1) SG77207A1 (zh)

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US6575177B1 (en) * 1999-04-27 2003-06-10 Applied Materials Inc. Semiconductor substrate cleaning system
US6622334B1 (en) * 2000-03-29 2003-09-23 International Business Machines Corporation Wafer edge cleaning utilizing polish pad material
US6439245B1 (en) * 2000-06-30 2002-08-27 Lam Research Corporation Method for transferring wafers from a conveyor system to a wafer processing station
US6678911B2 (en) * 2000-12-11 2004-01-20 Speedfam-Ipec Corporation Multiple vertical wafer cleaner
US6851151B1 (en) * 2001-06-29 2005-02-08 Lam Research Corporation Brush drive assembly in a substrate processing brush box
US6907637B1 (en) * 2001-06-29 2005-06-21 Lam Research Corporation Edge wheel assembly in a substrate processing brush box
KR100677034B1 (ko) 2003-10-20 2007-01-31 동부일렉트로닉스 주식회사 반도체 소자의 세정방법 및 그 장치
US20050109371A1 (en) * 2003-10-27 2005-05-26 Applied Materials, Inc. Post CMP scrubbing of substrates
KR101160932B1 (ko) 2003-10-28 2012-06-28 어플라이드 머티어리얼스, 인코포레이티드 스크러버 박스 및 그 사용 방법
US20050211276A1 (en) * 2004-03-15 2005-09-29 Applied Materials, Inc. Lid for a semiconductor device processing apparatus and methods for using the same
JP4586660B2 (ja) * 2005-07-19 2010-11-24 旭硝子株式会社 円盤状ガラス基板の洗浄方法
US20070212983A1 (en) * 2006-03-13 2007-09-13 Applied Materials, Inc. Apparatus and methods for conditioning a polishing pad
JP4890919B2 (ja) * 2006-04-13 2012-03-07 東京エレクトロン株式会社 基板洗浄方法、基板洗浄装置、プログラム、および記録媒体
WO2007145904A2 (en) * 2006-06-05 2007-12-21 Applied Materials, Inc. Methods and apparatus for supporting a substrate in a horizontal orientation during cleaning
JP2008077764A (ja) * 2006-09-21 2008-04-03 Hitachi Global Storage Technologies Netherlands Bv 磁気ヘッドスライダの洗浄方法、製造方法および洗浄装置
US9275849B2 (en) * 2007-07-30 2016-03-01 Planar Semiconductor, Inc. Single-chamber apparatus for precision cleaning and drying of flat objects
TWI372661B (en) * 2007-11-21 2012-09-21 Tokyo Electron Ltd Cleaning apparatus and cleaning method
CN101665020B (zh) * 2008-09-03 2013-01-09 海德堡印刷机械股份公司 用于运行印刷机的清洁装置的方法
US8562748B1 (en) * 2009-01-30 2013-10-22 WD Media, LLC Multiple cleaning processes in a single tank
US8468637B2 (en) * 2009-02-06 2013-06-25 Endoclear Llc Mechanically-actuated endotracheal tube cleaning device
KR20120081513A (ko) * 2011-01-11 2012-07-19 삼성모바일디스플레이주식회사 마스크 세정 장치
CN102157352A (zh) * 2011-03-23 2011-08-17 北京大学 一种微纳结构的湿法腐蚀方法及其腐蚀装置
US9478444B2 (en) * 2013-07-23 2016-10-25 Taiwan Semiconductor Manufacturing Co., Ltd. Mechanisms for cleaning wafer and scrubber
CN103736690B (zh) * 2013-12-31 2018-12-18 上海集成电路研发中心有限公司 硅片清洗方法
US10589321B2 (en) 2014-04-24 2020-03-17 Struers ApS Method of, and an apparatus for, rinsing materialographic samples
SG10201402001WA (en) * 2014-05-02 2015-12-30 Jcs Echigo Pte Ltd Media scrubbing apparatus and method
KR102389613B1 (ko) 2015-05-06 2022-04-22 삼성전자주식회사 기판 세정 장치
CN107481956A (zh) * 2017-07-14 2017-12-15 合肥文胜新能源科技有限公司 硅片清洗装置
TWI759727B (zh) * 2020-04-24 2022-04-01 弘塑科技股份有限公司 批次式基板浸泡洗邊設備
CN114226294A (zh) * 2020-09-09 2022-03-25 中国科学院微电子研究所 晶片清洗装置及晶片清洗方法
CN112992740A (zh) * 2021-03-01 2021-06-18 李军平 一种切割晶圆用的清洗设备

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US3137877A (en) 1962-12-06 1964-06-23 William C Brass Clinical thermometer cleaning device
EP0166696B1 (de) * 1984-06-29 1989-07-19 Ciba-Geigy Ag Zusätze für Schmierstoffe
JPS6197836A (ja) 1984-10-18 1986-05-16 Hitachi Electronics Eng Co Ltd ウエ−ハのエツチング装置
SU1276380A1 (ru) 1985-01-07 1986-12-15 Предприятие П/Я Р-6670 Устройство дл очистки мелких изделий
SU1458032A1 (ru) 1987-02-25 1989-02-15 Предприятие П/Я Р-6058 Установка дл очистки изделий
JPH01304733A (ja) 1988-06-01 1989-12-08 Mitsubishi Electric Corp 半導体ウエハの洗浄装置
JPH02109334A (ja) 1988-10-18 1990-04-23 Mitsubishi Electric Corp 半導体ウェハの洗浄装置
JPH02281733A (ja) 1989-04-24 1990-11-19 Matsushita Electric Ind Co Ltd 基板洗浄装置および基板洗浄方法
KR0134962B1 (ko) 1989-07-13 1998-04-22 나까다 구스오 디스크 세척장치
JPH06104226B2 (ja) 1989-10-17 1994-12-21 株式会社荏原製作所 キャリヤ洗浄機
JPH03232229A (ja) 1990-02-07 1991-10-16 Mitsubishi Electric Corp 半導体基板の洗浄装置およびその洗浄方法
US5317778A (en) 1991-07-31 1994-06-07 Shin-Etsu Handotai Co., Ltd. Automatic cleaning apparatus for wafers
JP2897537B2 (ja) 1992-06-16 1999-05-31 日本電気株式会社 基板洗浄装置
GB9304426D0 (en) 1993-03-04 1993-04-21 Eastman Derek D Traffic cone cleaning tank
DE69421353T2 (de) 1993-08-31 2000-05-11 Kabushiki Kaisha Shoyo Seiki, Ohme Reinigungsgerät
JPH0786218A (ja) 1993-09-17 1995-03-31 Dainippon Screen Mfg Co Ltd 基板洗浄装置
JP3153717B2 (ja) 1994-11-25 2001-04-09 シャープ株式会社 バッチ型ブラシ洗浄装置
JPH08318237A (ja) 1995-05-26 1996-12-03 Nikon Corp 基板の洗浄装置
JP3349299B2 (ja) 1995-07-21 2002-11-20 アルプス電気株式会社 ウエット処理方法及び処理装置
US5624501A (en) 1995-09-26 1997-04-29 Gill, Jr.; Gerald L. Apparatus for cleaning semiconductor wafers
JP3018964B2 (ja) 1995-11-24 2000-03-13 双葉電子工業株式会社 洗浄方法及び洗浄装置
JP3131149B2 (ja) * 1996-05-09 2001-01-31 スピードファムクリーンシステム株式会社 流液式スクラバ洗浄方法及び装置
US5875507A (en) 1996-07-15 1999-03-02 Oliver Design, Inc. Wafer cleaning apparatus
KR19980073947A (ko) 1997-03-20 1998-11-05 윤종용 웨이퍼 세정방법
JPH1126419A (ja) 1997-06-27 1999-01-29 Yamaha Corp ウエハ洗浄装置及びウエハ研磨システム
SE9704619L (sv) 1997-12-10 1999-06-11 Skf Ab Hållare för rullager och en metod för dess montering

Also Published As

Publication number Publication date
US6254688B1 (en) 2001-07-03
JP3331168B2 (ja) 2002-10-07
CN1219758A (zh) 1999-06-16
US6247198B1 (en) 2001-06-19
JPH11176779A (ja) 1999-07-02
CN1165971C (zh) 2004-09-08

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