SG76651A1 - Chemical amplification type positive resist - Google Patents
Chemical amplification type positive resistInfo
- Publication number
- SG76651A1 SG76651A1 SG200001727A SG200001727A SG76651A1 SG 76651 A1 SG76651 A1 SG 76651A1 SG 200001727 A SG200001727 A SG 200001727A SG 200001727 A SG200001727 A SG 200001727A SG 76651 A1 SG76651 A1 SG 76651A1
- Authority
- SG
- Singapore
- Prior art keywords
- positive resist
- chemical amplification
- type positive
- amplification type
- chemical
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C381/00—Compounds containing carbon and sulfur and having functional groups not covered by groups C07C301/00 - C07C337/00
- C07C381/12—Sulfonium compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/115—Cationic or anionic
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/122—Sulfur compound containing
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9299099 | 1999-03-31 | ||
JP31526499 | 1999-11-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG76651A1 true SG76651A1 (en) | 2000-11-21 |
Family
ID=26434354
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200001727A SG76651A1 (en) | 1999-03-31 | 2000-03-23 | Chemical amplification type positive resist |
Country Status (7)
Country | Link |
---|---|
US (1) | US6348297B1 (zh) |
EP (1) | EP1041442B1 (zh) |
KR (1) | KR100704423B1 (zh) |
CN (1) | CN1207632C (zh) |
DE (1) | DE60015220T2 (zh) |
SG (1) | SG76651A1 (zh) |
TW (1) | TWI225966B (zh) |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100704423B1 (ko) * | 1999-03-31 | 2007-04-06 | 스미또모 가가꾸 가부시키가이샤 | 화학 증폭형 포지티브 레지스트 |
US6596458B1 (en) * | 1999-05-07 | 2003-07-22 | Fuji Photo Film Co., Ltd. | Positive-working photoresist composition |
US6528232B1 (en) * | 1999-11-01 | 2003-03-04 | Nec Corporation | Sulfonium salt compound, photoresist composition and method for patterning by employing same |
US6534241B2 (en) | 2000-01-12 | 2003-03-18 | Howard A. Fromson | Method of actinically imaging a semiconductor |
JP2001215704A (ja) * | 2000-01-31 | 2001-08-10 | Sumitomo Chem Co Ltd | 化学増幅型ポジ型レジスト組成物 |
TW573225B (en) * | 2000-02-28 | 2004-01-21 | Sumitomo Chemical Co | Chemically amplified positive resist composition |
TWI286664B (en) * | 2000-06-23 | 2007-09-11 | Sumitomo Chemical Co | Chemical amplification type positive resist composition and sulfonium salt |
US6749987B2 (en) | 2000-10-20 | 2004-06-15 | Fuji Photo Film Co., Ltd. | Positive photosensitive composition |
DE10058951A1 (de) * | 2000-11-28 | 2002-06-20 | Infineon Technologies Ag | Verfahren zur Herstellung einer Lithographiemaske für eine integrierte Schaltung |
US6858370B2 (en) | 2001-02-23 | 2005-02-22 | Fuji Photo Film Co., Ltd. | Positive photosensitive composition |
JP4225699B2 (ja) | 2001-03-12 | 2009-02-18 | 富士フイルム株式会社 | ポジ型感光性組成物 |
JP4117112B2 (ja) * | 2001-03-30 | 2008-07-16 | 富士フイルム株式会社 | ポジ型フォトレジスト組成物 |
US6927009B2 (en) * | 2001-05-22 | 2005-08-09 | Fuji Photo Film Co., Ltd. | Positive photosensitive composition |
JP3912767B2 (ja) | 2001-06-21 | 2007-05-09 | 富士フイルム株式会社 | ポジ型感光性組成物 |
US7192681B2 (en) | 2001-07-05 | 2007-03-20 | Fuji Photo Film Co., Ltd. | Positive photosensitive composition |
TW588218B (en) * | 2001-08-21 | 2004-05-21 | Fuji Photo Film Co Ltd | Stimulation-sensitive composition and compound |
TWI246525B (en) * | 2001-11-06 | 2006-01-01 | Wako Pure Chem Ind Ltd | Hybrid onium salt |
US6818379B2 (en) * | 2001-12-03 | 2004-11-16 | Sumitomo Chemical Company, Limited | Sulfonium salt and use thereof |
JP3895224B2 (ja) * | 2001-12-03 | 2007-03-22 | 東京応化工業株式会社 | ポジ型レジスト組成物及びそれを用いたレジストパターン形成方法 |
JP3918542B2 (ja) * | 2001-12-11 | 2007-05-23 | 住友化学株式会社 | 化学増幅型ポジ型レジスト組成物 |
EP1319981B1 (en) * | 2001-12-13 | 2012-10-24 | FUJIFILM Corporation | Positive resist composition |
US20030235775A1 (en) | 2002-06-13 | 2003-12-25 | Munirathna Padmanaban | Photoresist composition for deep ultraviolet lithography comprising a mixture of photoactive compounds |
US7122589B2 (en) * | 2002-09-30 | 2006-10-17 | Fuji Photo Film Co., Ltd | Positive resist composition and pattern formation method using the same |
WO2004053594A2 (en) * | 2002-12-05 | 2004-06-24 | International Business Machines Corporation | High sensitivity resist compositions for electron-based lithography |
US7314700B2 (en) * | 2002-12-05 | 2008-01-01 | International Business Machines Corporation | High sensitivity resist compositions for electron-based lithography |
US6878504B2 (en) * | 2003-05-28 | 2005-04-12 | Everlight Usa, Inc. | Chemically-amplified resist compositions |
JP4772288B2 (ja) | 2003-06-05 | 2011-09-14 | 東京応化工業株式会社 | ホトレジスト組成物用樹脂、ホトレジスト組成物、およびレジストパターン形成方法 |
JP2005031233A (ja) * | 2003-07-09 | 2005-02-03 | Tokyo Ohka Kogyo Co Ltd | レジスト組成物、積層体、及びレジストパターン形成方法 |
EP1505439A3 (en) * | 2003-07-24 | 2005-04-20 | Fuji Photo Film Co., Ltd. | Positive photosensitive composition and method of forming resist pattern |
JP4188265B2 (ja) * | 2003-10-23 | 2008-11-26 | 東京応化工業株式会社 | レジスト組成物およびレジストパターン形成方法 |
US7304175B2 (en) * | 2005-02-16 | 2007-12-04 | Sumitomo Chemical Company, Limited | Salt suitable for an acid generator and a chemically amplified resist composition containing the same |
JP4505357B2 (ja) * | 2005-03-16 | 2010-07-21 | 富士フイルム株式会社 | 感光性組成物、該感光性組成物に用いる化合物及び該感光性組成物を用いたパターン形成方法 |
US7579497B2 (en) | 2005-03-30 | 2009-08-25 | Sumitomo Chemical Company, Limited | Salt suitable for an acid generator and a chemically amplified resist composition containing the same |
TWI394004B (zh) | 2005-03-30 | 2013-04-21 | Sumitomo Chemical Co | 適合作為酸產生劑之鹽及含有該鹽之化學放大型光阻組成物 |
KR100737553B1 (ko) | 2005-05-30 | 2007-07-10 | 인터내셔널 비지네스 머신즈 코포레이션 | 전자계 리소그래피용 고감도 레지스트 조성물 |
US7531686B2 (en) | 2005-10-28 | 2009-05-12 | Sumitomo Chemical Company, Limited | Salt suitable for an acid generator and a chemically amplified resist composition containing the same |
TWI395062B (zh) | 2005-11-21 | 2013-05-01 | Sumitomo Chemical Co | 適合酸產生劑之鹽及含有該鹽之化學增幅阻劑組成物 |
TWI381246B (zh) | 2005-12-27 | 2013-01-01 | Sumitomo Chemical Co | 適用於酸產生劑的鹽及含有該鹽之化學增幅型阻劑組成物 |
US8257912B2 (en) * | 2006-08-02 | 2012-09-04 | Nxp B.V. | Photolithography |
TWI399617B (zh) | 2006-08-02 | 2013-06-21 | Sumitomo Chemical Co | 適用為酸產生劑之鹽及含該鹽之化學放大正型阻劑組成物 |
TWI402249B (zh) * | 2006-08-22 | 2013-07-21 | Sumitomo Chemical Co | 適合作為酸產生劑之鹽及含有該鹽之化學放大型正型光阻組成物 |
TWI435169B (zh) | 2006-12-06 | 2014-04-21 | Sumitomo Chemical Co | 化學性放大阻劑組成物 |
TWI437364B (zh) | 2006-12-14 | 2014-05-11 | Sumitomo Chemical Co | 化學放大型阻劑組成物 |
CN101211113B (zh) * | 2006-12-27 | 2012-01-11 | 住友化学株式会社 | 化学放大型抗蚀剂组合物 |
CN101236357B (zh) * | 2007-01-30 | 2012-07-04 | 住友化学株式会社 | 化学放大型抗蚀剂组合物 |
JP4844436B2 (ja) * | 2007-03-07 | 2011-12-28 | 住友化学株式会社 | 化学増幅型レジスト組成物 |
JP5012122B2 (ja) * | 2007-03-22 | 2012-08-29 | 住友化学株式会社 | 化学増幅型レジスト組成物 |
KR100933984B1 (ko) * | 2007-11-26 | 2009-12-28 | 제일모직주식회사 | 신규 공중합체 및 이를 포함하는 레지스트 조성물 |
US8853290B2 (en) | 2009-06-08 | 2014-10-07 | Sanyo Chemical Industries, Ltd. | Photosensitive composition |
US9772558B2 (en) * | 2013-09-24 | 2017-09-26 | International Business Machines Corporation | Sulfonic acid ester containing polymers for organic solvent based dual-tone photoresists |
JP7365110B2 (ja) * | 2018-09-11 | 2023-10-19 | 信越化学工業株式会社 | ヨードニウム塩、レジスト組成物、及びパターン形成方法 |
CN110231754B (zh) * | 2019-04-23 | 2023-05-02 | 苏州瑞红电子化学品有限公司 | 一种杂环多官光致产酸剂及其制备方法和制得的化学增幅型光刻胶 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5278031A (en) * | 1992-10-23 | 1994-01-11 | Polaroid Corporation | Process for thermochemical generation of squaric acid and for thermal imaging, and imaging medium for use therein |
JP2936956B2 (ja) * | 1993-04-15 | 1999-08-23 | 信越化学工業株式会社 | レジスト材料 |
US5635332A (en) | 1993-07-14 | 1997-06-03 | Nec Corporation | Alkylsulfonium salts and photoresist compositions containing the same |
JP2606655B2 (ja) | 1993-09-20 | 1997-05-07 | 日本電気株式会社 | 感光性化合物および感光性組成物 |
JP2770740B2 (ja) * | 1994-07-14 | 1998-07-02 | 日本電気株式会社 | 橋かけ環式アルキル基を有するスルホニウム塩化合物および光酸発生剤 |
US5558971A (en) | 1994-09-02 | 1996-09-24 | Wako Pure Chemical Industries, Ltd. | Resist material |
US6013416A (en) | 1995-06-28 | 2000-01-11 | Fujitsu Limited | Chemically amplified resist compositions and process for the formation of resist patterns |
JP3679206B2 (ja) * | 1996-09-20 | 2005-08-03 | 東京応化工業株式会社 | ポジ型レジスト組成物、それを用いた多層レジスト材料及びレジストパターン形成方法 |
KR19980027924A (ko) * | 1996-10-18 | 1998-07-15 | 김광호 | 화학 증폭형 레지스트의 조성물 |
TW482946B (en) | 1997-01-29 | 2002-04-11 | Sumitomo Chemical Co | Chemical amplification type positive photoresist composition |
JP3637723B2 (ja) * | 1997-03-12 | 2005-04-13 | Jsr株式会社 | ネガ型感放射線性樹脂組成物 |
JP2964990B2 (ja) | 1997-05-07 | 1999-10-18 | 日本電気株式会社 | 橋かけ環式アルキル基を有する光酸発生剤を含有する感光性樹脂組成物、およびそれを用いたパターン形成方法 |
JP3819531B2 (ja) | 1997-05-20 | 2006-09-13 | 富士通株式会社 | レジスト組成物及びレジストパターン形成方法 |
JP2965016B2 (ja) | 1997-11-04 | 1999-10-18 | 日本電気株式会社 | 遠紫外線露光用感光性樹脂組成物、及びそれを用いたパターン形成方法 |
KR100704423B1 (ko) * | 1999-03-31 | 2007-04-06 | 스미또모 가가꾸 가부시키가이샤 | 화학 증폭형 포지티브 레지스트 |
-
2000
- 2000-03-23 KR KR1020000014772A patent/KR100704423B1/ko not_active IP Right Cessation
- 2000-03-23 EP EP20000105938 patent/EP1041442B1/en not_active Expired - Lifetime
- 2000-03-23 DE DE60015220T patent/DE60015220T2/de not_active Expired - Lifetime
- 2000-03-23 SG SG200001727A patent/SG76651A1/en unknown
- 2000-03-24 CN CNB001035142A patent/CN1207632C/zh not_active Expired - Fee Related
- 2000-03-24 TW TW089105517A patent/TWI225966B/zh not_active IP Right Cessation
- 2000-03-24 US US09/533,986 patent/US6348297B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1041442A1 (en) | 2000-10-04 |
DE60015220T2 (de) | 2006-02-02 |
US6348297B1 (en) | 2002-02-19 |
DE60015220D1 (de) | 2004-12-02 |
KR20000076939A (ko) | 2000-12-26 |
KR100704423B1 (ko) | 2007-04-06 |
CN1207632C (zh) | 2005-06-22 |
EP1041442B1 (en) | 2004-10-27 |
TWI225966B (en) | 2005-01-01 |
CN1268680A (zh) | 2000-10-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG76651A1 (en) | Chemical amplification type positive resist | |
SG76000A1 (en) | Chemical amplification type positive resist composition | |
SG85129A1 (en) | A chemical amplifying type positive resist composition | |
GB2358256B (en) | Chemically amplified positive resist composition | |
SG94799A1 (en) | Chemically amplified positive resist composition | |
GB9902461D0 (en) | Chemical compounds | |
GB0207098D0 (en) | Chemical amplifying type positive resist composition | |
SG99336A1 (en) | Chemically amplified positive resist composition | |
GB0021494D0 (en) | Chemical comkpounds | |
SG87205A1 (en) | Chemically amplified positive resist composition | |
SG94738A1 (en) | Chemically amplified positive resist composition | |
EP1209525A4 (en) | RESIST RESIN COMPOSITION FOR CHEMICAL AMPLIFICATION | |
AU4274001A (en) | Chemical amplification type positive resist composition | |
GB2356258B (en) | Chemical amplification type resist composition | |
GB2347536B (en) | Latch type sense amplifier circuit | |
SG105527A1 (en) | Chemical amplifying type positive resist composition | |
GB2373867B (en) | Chemical amplification type positive resist composition | |
GB9929702D0 (en) | Chemical compounds and their uses | |
GB2370367B (en) | Chemical amplifying type positive resist composition | |
GB2356941B (en) | Chemically amplified positive resist composition | |
GB9917386D0 (en) | Chemical compounds-II | |
GB9917385D0 (en) | Chemical compounds-I | |
GB9900078D0 (en) | Chemical compounds | |
GB2352826B (en) | Chemical amplification type negative resist compositions | |
GB9917384D0 (en) | Chemical compounds-III |