SG73539A1 - Semiconductor wafer surface flattening apparatus - Google Patents

Semiconductor wafer surface flattening apparatus

Info

Publication number
SG73539A1
SG73539A1 SG1998002825A SG1998002825A SG73539A1 SG 73539 A1 SG73539 A1 SG 73539A1 SG 1998002825 A SG1998002825 A SG 1998002825A SG 1998002825 A SG1998002825 A SG 1998002825A SG 73539 A1 SG73539 A1 SG 73539A1
Authority
SG
Singapore
Prior art keywords
semiconductor wafer
wafer surface
surface flattening
flattening apparatus
semiconductor
Prior art date
Application number
SG1998002825A
Other languages
English (en)
Inventor
Shigeto Izumi
Original Assignee
Speedfam Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam Co Ltd filed Critical Speedfam Co Ltd
Publication of SG73539A1 publication Critical patent/SG73539A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
SG1998002825A 1998-01-09 1998-07-31 Semiconductor wafer surface flattening apparatus SG73539A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1500598A JPH11204468A (ja) 1998-01-09 1998-01-09 半導体ウエハの表面平坦化装置

Publications (1)

Publication Number Publication Date
SG73539A1 true SG73539A1 (en) 2000-06-20

Family

ID=11876790

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1998002825A SG73539A1 (en) 1998-01-09 1998-07-31 Semiconductor wafer surface flattening apparatus

Country Status (6)

Country Link
US (1) US6062954A (de)
EP (1) EP0928662A3 (de)
JP (1) JPH11204468A (de)
KR (1) KR19990066788A (de)
SG (1) SG73539A1 (de)
TW (1) TW411521B (de)

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US6358128B1 (en) 1999-03-05 2002-03-19 Ebara Corporation Polishing apparatus
SG97860A1 (en) * 1999-03-05 2003-08-20 Ebara Corp Polishing apparatus
JP4579879B2 (ja) * 1999-03-05 2010-11-10 株式会社荏原製作所 ポリッシング装置
US6354922B1 (en) 1999-08-20 2002-03-12 Ebara Corporation Polishing apparatus
US6261157B1 (en) * 1999-05-25 2001-07-17 Applied Materials, Inc. Selective damascene chemical mechanical polishing
JP2001018161A (ja) 1999-07-07 2001-01-23 Ebara Corp 研磨装置
JP2001018169A (ja) 1999-07-07 2001-01-23 Ebara Corp 研磨装置
JP4790695B2 (ja) * 1999-08-20 2011-10-12 株式会社荏原製作所 ポリッシング装置
US6196900B1 (en) * 1999-09-07 2001-03-06 Vlsi Technology, Inc. Ultrasonic transducer slurry dispenser
US6390887B1 (en) * 1999-12-21 2002-05-21 Johnson & Johnson Vision Products, Inc. Pre-cutter and edger machine
US6705930B2 (en) * 2000-01-28 2004-03-16 Lam Research Corporation System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
US6340326B1 (en) 2000-01-28 2002-01-22 Lam Research Corporation System and method for controlled polishing and planarization of semiconductor wafers
US6358126B1 (en) 2000-05-23 2002-03-19 Ebara Corporation Polishing apparatus
US6991524B1 (en) * 2000-07-07 2006-01-31 Disc Go Technologies Inc. Method and apparatus for reconditioning digital discs
US6585572B1 (en) 2000-08-22 2003-07-01 Lam Research Corporation Subaperture chemical mechanical polishing system
US6640155B2 (en) 2000-08-22 2003-10-28 Lam Research Corporation Chemical mechanical polishing apparatus and methods with central control of polishing pressure applied by polishing head
US6652357B1 (en) 2000-09-22 2003-11-25 Lam Research Corporation Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing
US7481695B2 (en) 2000-08-22 2009-01-27 Lam Research Corporation Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head
US6471566B1 (en) * 2000-09-18 2002-10-29 Lam Research Corporation Sacrificial retaining ring CMP system and methods for implementing the same
US6443815B1 (en) 2000-09-22 2002-09-03 Lam Research Corporation Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing
US6620027B2 (en) * 2001-01-09 2003-09-16 Applied Materials Inc. Method and apparatus for hard pad polishing
DE10117612B4 (de) * 2001-04-07 2007-04-12 Infineon Technologies Ag Polieranlage
US6817923B2 (en) * 2001-05-24 2004-11-16 Applied Materials, Inc. Chemical mechanical processing system with mobile load cup
US6575818B2 (en) * 2001-06-27 2003-06-10 Oriol Inc. Apparatus and method for polishing multiple semiconductor wafers in parallel
US6746308B1 (en) * 2001-07-11 2004-06-08 Advanced Micro Devices, Inc. Dynamic lot allocation based upon wafer state characteristics, and system for accomplishing same
US6586336B2 (en) 2001-08-31 2003-07-01 Oriol, Inc. Chemical-mechanical-polishing station
JP2003092274A (ja) * 2001-09-19 2003-03-28 Nikon Corp 加工装置および方法、この装置を用いた半導体デバイス製造方法およびこの方法により製造される半導体デバイス
KR100470229B1 (ko) * 2002-02-08 2005-02-05 두산디앤디 주식회사 화학기계적 연마장치의 로딩디바이스
US6780083B2 (en) * 2002-04-19 2004-08-24 Peter Wolters Cmp-Systeme Gmbh & Co. Kg Apparatus and method for the chemical mechanical polishing of the surface of circular flat workpieces, in particular semi-conductor wafers
US7063597B2 (en) 2002-10-25 2006-06-20 Applied Materials Polishing processes for shallow trench isolation substrates
US7163441B2 (en) * 2004-02-05 2007-01-16 Robert Gerber Semiconductor wafer grinder
US7011567B2 (en) * 2004-02-05 2006-03-14 Robert Gerber Semiconductor wafer grinder
JP2008277635A (ja) * 2007-05-01 2008-11-13 Tokyo Seimitsu Co Ltd ウェハ研磨装置、ウェハ研磨システム及びウェハ研磨方法
US8944887B2 (en) * 2011-02-09 2015-02-03 Axus Technology, Llc Apparatus and method for surface grinding and edge trimming workpieces

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JPH0615565A (ja) * 1991-12-18 1994-01-25 Shin Etsu Handotai Co Ltd ウエーハ自動ラッピング装置
JPH05326468A (ja) * 1992-05-21 1993-12-10 Kawasaki Steel Corp ウェーハの研磨方法
US5329732A (en) * 1992-06-15 1994-07-19 Speedfam Corporation Wafer polishing method and apparatus
JPH0663862A (ja) * 1992-08-22 1994-03-08 Fujikoshi Mach Corp 研磨装置
KR100390293B1 (ko) * 1993-09-21 2003-09-02 가부시끼가이샤 도시바 폴리싱장치
JPH07297195A (ja) * 1994-04-27 1995-11-10 Speedfam Co Ltd 半導体装置の平坦化方法及び平坦化装置
US5649854A (en) * 1994-05-04 1997-07-22 Gill, Jr.; Gerald L. Polishing apparatus with indexing wafer processing stations
US5562524A (en) * 1994-05-04 1996-10-08 Gill, Jr.; Gerald L. Polishing apparatus
US5816891A (en) * 1995-06-06 1998-10-06 Advanced Micro Devices, Inc. Performing chemical mechanical polishing of oxides and metals using sequential removal on multiple polish platens to increase equipment throughput
JP3582026B2 (ja) * 1995-07-21 2004-10-27 富士通株式会社 平面研磨方法および平面研磨装置
JP3321338B2 (ja) * 1995-07-24 2002-09-03 株式会社東芝 半導体装置の製造方法および製造装置
JP3500783B2 (ja) * 1995-07-26 2004-02-23 ソニー株式会社 半導体基板の研磨装置
US5643405A (en) * 1995-07-31 1997-07-01 Motorola, Inc. Method for polishing a semiconductor substrate
KR100487590B1 (ko) * 1995-08-21 2005-08-04 가부시키가이샤 에바라 세이사꾸쇼 폴리싱장치
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
JPH09155728A (ja) * 1995-12-04 1997-06-17 Speedfam Co Ltd 平面研磨方法
US5679055A (en) * 1996-05-31 1997-10-21 Memc Electronic Materials, Inc. Automated wafer lapping system
JPH1098016A (ja) * 1996-09-20 1998-04-14 Speedfam Co Ltd 半導体ウェハ研磨装置
JPH10217112A (ja) * 1997-02-06 1998-08-18 Speedfam Co Ltd Ｃｍｐ装置
JPH10230451A (ja) * 1997-02-20 1998-09-02 Speedfam Co Ltd 研磨装置及びワーク測定方法

Also Published As

Publication number Publication date
EP0928662A3 (de) 2002-02-06
TW411521B (en) 2000-11-11
US6062954A (en) 2000-05-16
EP0928662A2 (de) 1999-07-14
JPH11204468A (ja) 1999-07-30
KR19990066788A (ko) 1999-08-16

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