SG71070A1 - Compact apparatus and method for storing and loading semiconductor wafer carriers - Google Patents

Compact apparatus and method for storing and loading semiconductor wafer carriers

Info

Publication number
SG71070A1
SG71070A1 SG1997004316A SG1997004316A SG71070A1 SG 71070 A1 SG71070 A1 SG 71070A1 SG 1997004316 A SG1997004316 A SG 1997004316A SG 1997004316 A SG1997004316 A SG 1997004316A SG 71070 A1 SG71070 A1 SG 71070A1
Authority
SG
Singapore
Prior art keywords
storing
semiconductor wafer
wafer carriers
compact apparatus
loading semiconductor
Prior art date
Application number
SG1997004316A
Other languages
English (en)
Inventor
Dan Marohl
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG71070A1 publication Critical patent/SG71070A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
SG1997004316A 1996-12-11 1997-12-04 Compact apparatus and method for storing and loading semiconductor wafer carriers SG71070A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/763,596 US5964561A (en) 1996-12-11 1996-12-11 Compact apparatus and method for storing and loading semiconductor wafer carriers

Publications (1)

Publication Number Publication Date
SG71070A1 true SG71070A1 (en) 2000-03-21

Family

ID=25068283

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997004316A SG71070A1 (en) 1996-12-11 1997-12-04 Compact apparatus and method for storing and loading semiconductor wafer carriers

Country Status (7)

Country Link
US (1) US5964561A (ja)
EP (2) EP0848413B1 (ja)
JP (1) JPH10223728A (ja)
KR (1) KR19980064020A (ja)
DE (1) DE69728120T2 (ja)
SG (1) SG71070A1 (ja)
TW (1) TW362255B (ja)

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US6447232B1 (en) * 1994-04-28 2002-09-10 Semitool, Inc. Semiconductor wafer processing apparatus having improved wafer input/output handling system
US6540466B2 (en) * 1996-12-11 2003-04-01 Applied Materials, Inc. Compact apparatus and method for storing and loading semiconductor wafer carriers
US6579052B1 (en) * 1997-07-11 2003-06-17 Asyst Technologies, Inc. SMIF pod storage, delivery and retrieval system
US6161054A (en) * 1997-09-22 2000-12-12 On-Line Technologies, Inc. Cell control method and apparatus
US6283692B1 (en) * 1998-12-01 2001-09-04 Applied Materials, Inc. Apparatus for storing and moving a cassette
WO2000051921A1 (en) * 1999-03-05 2000-09-08 Pri Automation, Inc. Material handling and transport system and process
DE19921246C2 (de) * 1999-05-07 2003-06-12 Infineon Technologies Ag Anlage zur Fertigung von Halbleiterprodukten
JP3602372B2 (ja) * 1999-06-07 2004-12-15 松下電器産業株式会社 真空処理装置
US6318945B1 (en) * 1999-07-28 2001-11-20 Brooks Automation, Inc. Substrate processing apparatus with vertically stacked load lock and substrate transport robot
US6354781B1 (en) * 1999-11-01 2002-03-12 Chartered Semiconductor Manufacturing Company Semiconductor manufacturing system
US6506009B1 (en) * 2000-03-16 2003-01-14 Applied Materials, Inc. Apparatus for storing and moving a cassette
US20020090282A1 (en) * 2001-01-05 2002-07-11 Applied Materials, Inc. Actuatable loadport system
KR100597035B1 (ko) * 2001-03-01 2006-07-04 에이에스엠엘 네델란즈 비.브이. 마스크핸들링방법, 마스크, 그를 위한 그리퍼를 포함하는기구 또는 장치, 디바이스 제조방법 및 그 디바이스
JP3862514B2 (ja) * 2001-05-02 2006-12-27 キヤノン株式会社 ワーク搬送装置及びワーク搬送方法
DE10157192A1 (de) * 2001-11-23 2003-06-12 Ortner C L S Gmbh Lagereinrichtung
US6726429B2 (en) 2002-02-19 2004-04-27 Vertical Solutions, Inc. Local store for a wafer processing station
TWI319123B (en) * 2002-02-22 2010-01-01 Asml Holding Nv System and method for using a two part cover for protecting a reticle
TWI367192B (en) * 2003-11-13 2012-07-01 Applied Materials Inc Calibration of high speed loader to substrate transport system
US7462011B2 (en) * 2004-08-12 2008-12-09 Tokyo Electron Limited Substrate processing system, substrate processing method, sealed container storing apparatus, program for implementing the substrate processing method, and storage medium storing the program
JP4515275B2 (ja) * 2005-01-31 2010-07-28 大日本スクリーン製造株式会社 基板処理装置
TW200717689A (en) * 2005-09-14 2007-05-01 Applied Materials Inc Methods and apparatus for a band to band transfer module
US8894344B2 (en) * 2008-08-22 2014-11-25 Applied Materials, Inc. Vertical wafer buffering system
JP5284808B2 (ja) 2009-01-26 2013-09-11 株式会社Ｓｏｋｕｄｏ ストッカー装置及び基板処理装置
JP5722092B2 (ja) * 2011-03-18 2015-05-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US11984335B2 (en) 2021-12-29 2024-05-14 Applied Materials, Inc. FOUP or cassette storage for hybrid substrate bonding system

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US4047624A (en) * 1975-10-21 1977-09-13 Airco, Inc. Workpiece handling system for vacuum processing
JPH067566B2 (ja) * 1983-09-28 1994-01-26 ヒューレット・パッカード・カンパニー 集積回路処理装置
US4615430A (en) * 1983-10-06 1986-10-07 Tokyo Electron Limited Precision pallet stacking type storage system for use in clean environment or the like
EP0288455B1 (en) * 1985-12-23 1990-05-16 Asyst Technologies Box door actuated retainer
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JP2905857B2 (ja) * 1989-08-11 1999-06-14 東京エレクトロン株式会社 縦型処理装置
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US5261935A (en) * 1990-09-26 1993-11-16 Tokyo Electron Sagami Limited Clean air apparatus
US5399531A (en) * 1990-12-17 1995-03-21 United Micrpelectronics Corporation Single semiconductor wafer transfer method and plural processing station manufacturing system
JPH0517006A (ja) * 1991-04-09 1993-01-26 Murata Mach Ltd トランスフアーロボツト
US5215420A (en) * 1991-09-20 1993-06-01 Intevac, Inc. Substrate handling and processing system
JP2873761B2 (ja) * 1992-01-10 1999-03-24 東京エレクトロン株式会社 半導体製造装置
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JP3275390B2 (ja) * 1992-10-06 2002-04-15 神鋼電機株式会社 可搬式密閉コンテナ流通式の自動搬送システム
KR100302012B1 (ko) * 1992-11-06 2001-11-30 조셉 제이. 스위니 미소-환경 콘테이너 연결방법 및 미소-환경 로드 로크
JP3258748B2 (ja) * 1993-02-08 2002-02-18 東京エレクトロン株式会社 熱処理装置
JP3218488B2 (ja) * 1993-03-16 2001-10-15 東京エレクトロン株式会社 処理装置
US5527390A (en) * 1993-03-19 1996-06-18 Tokyo Electron Kabushiki Treatment system including a plurality of treatment apparatus
KR100221983B1 (ko) * 1993-04-13 1999-09-15 히가시 데쓰로 처리장치
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JP3331746B2 (ja) * 1994-05-17 2002-10-07 神鋼電機株式会社 搬送システム
DE4425208C2 (de) * 1994-07-16 1996-05-09 Jenoptik Technologie Gmbh Einrichtung zur Kopplung von Be- und Entladegeräten mit Halbleiterbearbeitungsmaschinen
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Also Published As

Publication number Publication date
EP0848413A2 (en) 1998-06-17
DE69728120D1 (de) 2004-04-22
JPH10223728A (ja) 1998-08-21
EP0848413A3 (en) 2000-09-20
EP1335413A1 (en) 2003-08-13
DE69728120T2 (de) 2004-10-21
KR19980064020A (ko) 1998-10-07
TW362255B (en) 1999-06-21
US5964561A (en) 1999-10-12
EP0848413B1 (en) 2004-03-17

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