SG67452A1 - Sockets apparatus - Google Patents

Sockets apparatus

Info

Publication number
SG67452A1
SG67452A1 SG1997004334A SG1997004334A SG67452A1 SG 67452 A1 SG67452 A1 SG 67452A1 SG 1997004334 A SG1997004334 A SG 1997004334A SG 1997004334 A SG1997004334 A SG 1997004334A SG 67452 A1 SG67452 A1 SG 67452A1
Authority
SG
Singapore
Prior art keywords
sockets
sockets apparatus
Prior art date
Application number
SG1997004334A
Other languages
English (en)
Inventor
Masao Tohyama
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of SG67452A1 publication Critical patent/SG67452A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/193—Means for increasing contact pressure at the end of engagement of coupling part, e.g. zero insertion force or no friction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
    • H05K7/1084—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding pin grid array package carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Connecting Device With Holders (AREA)
SG1997004334A 1996-12-09 1997-12-05 Sockets apparatus SG67452A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34470196A JP3745060B2 (ja) 1996-12-09 1996-12-09 ソケット

Publications (1)

Publication Number Publication Date
SG67452A1 true SG67452A1 (en) 1999-09-21

Family

ID=18371319

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997004334A SG67452A1 (en) 1996-12-09 1997-12-05 Sockets apparatus

Country Status (5)

Country Link
US (1) US6050836A (ko)
JP (1) JP3745060B2 (ko)
KR (1) KR100510905B1 (ko)
SG (1) SG67452A1 (ko)
TW (1) TW366605B (ko)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6126467A (en) * 1998-07-22 2000-10-03 Enplas Corporation Socket for electrical parts
TW421333U (en) * 1999-02-24 2001-02-01 Hung Rung Fang IC socket
JP4087012B2 (ja) * 1999-05-31 2008-05-14 株式会社エンプラス 電気部品用ソケット
JP3758069B2 (ja) * 1999-07-30 2006-03-22 株式会社エンプラス 電気部品用ソケット
JP3257994B2 (ja) 1999-08-30 2002-02-18 日本テキサス・インスツルメンツ株式会社 ソケット
US6402528B2 (en) 1999-11-30 2002-06-11 Texas Instruments Incorporated Electronic part mounting device
JP4266466B2 (ja) * 1999-11-30 2009-05-20 株式会社センサータ・テクノロジーズジャパン ソケット及び電子部品装着装置
JP2001203048A (ja) * 2000-01-20 2001-07-27 Fujitsu Takamisawa Component Ltd コネクタおよび電子部品
JP4251423B2 (ja) 2000-01-28 2009-04-08 株式会社センサータ・テクノロジーズジャパン ソケット
JP4641079B2 (ja) * 2000-02-14 2011-03-02 スリーエム イノベイティブ プロパティズ カンパニー 半導体部品検査用ソケット及び半導体部品検査装置
JP2002025731A (ja) 2000-07-07 2002-01-25 Texas Instr Japan Ltd ソケット及び電子部品装着装置
JP2002071749A (ja) * 2000-08-29 2002-03-12 Molex Inc Ｉｃパッケージの試験評価用ソケット
DE10053745B4 (de) * 2000-10-30 2004-07-15 Heigl, Helmuth, Dr.-Ing. Vorrichtung und Verfahren zur Kontaktierung eines oder mehrerer Anschlüsse an einem elektronischen Bauteil
JP4615151B2 (ja) * 2001-06-19 2011-01-19 モレックス インコーポレイテド 半導体パッケージ用ソケット
JP4721582B2 (ja) * 2001-09-14 2011-07-13 株式会社センサータ・テクノロジーズジャパン ソケット
JP3942936B2 (ja) * 2002-04-09 2007-07-11 株式会社エンプラス 電気部品用ソケット
US20050221682A1 (en) * 2004-04-06 2005-10-06 Fci Americas Technology, Inc. High speed receptacle connector part
US7229324B2 (en) * 2004-04-06 2007-06-12 Fci Sa High speed receptacle connector part
US7121860B2 (en) * 2004-09-02 2006-10-17 Micron Technology, Inc. Pinch-style support contact, method of enabling electrical communication with and supporting an IC package, and socket including same
EP3278403A4 (en) * 2016-04-29 2019-01-16 Hewlett Packard Enterprise Development L.P. EINPRESSSTIFTWANDLER
CN106825879B (zh) * 2017-03-13 2018-06-12 江苏锡沂高新区科技发展有限公司 一种焊接机中的启动设备
KR102146290B1 (ko) * 2019-04-04 2020-08-21 황동원 반도체 소자 테스트용 lidless BGA 소켓장치
KR102160209B1 (ko) * 2019-07-30 2020-09-25 (주)마이크로컨텍솔루션 반도체 칩 테스트 소켓
KR102192759B1 (ko) * 2019-10-16 2020-12-18 주식회사 오킨스전자 Key 스위치를 포함하는 SSD 메모리 테스트 소켓
CN110994271B (zh) * 2020-01-06 2020-07-24 浙江利恩工程设计咨询有限公司 一种安全性能较高的供电辅助设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5482471A (en) * 1993-02-24 1996-01-09 Texas Instruments Incorporated Socket apparatus for IC package testing
JPH06333656A (ja) * 1993-05-19 1994-12-02 Augat Inc 電子部品用ソケット
US5419710A (en) * 1994-06-10 1995-05-30 Pfaff; Wayne K. Mounting apparatus for ball grid array device
JP3256796B2 (ja) * 1994-08-23 2002-02-12 日本テキサス・インスツルメンツ株式会社 ソケット及びソケットを用いた電気部品の試験方法
JP3259122B2 (ja) * 1994-10-04 2002-02-25 日本テキサス・インスツルメンツ株式会社 ソケット
US5498970A (en) * 1995-02-06 1996-03-12 Minnesota Mining And Manufacturing Top load socket for ball grid array devices
JP3550786B2 (ja) * 1995-03-30 2004-08-04 株式会社エンプラス Ｉｃソケット
JP3550787B2 (ja) * 1995-03-30 2004-08-04 株式会社エンプラス Ｉｃソケット

Also Published As

Publication number Publication date
JP3745060B2 (ja) 2006-02-15
KR19980063835A (ko) 1998-10-07
US6050836A (en) 2000-04-18
KR100510905B1 (ko) 2005-11-11
JPH10172702A (ja) 1998-06-26
TW366605B (en) 1999-08-11

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