SG50498A1 - Magnetron sputtering apparatus - Google Patents

Magnetron sputtering apparatus

Info

Publication number
SG50498A1
SG50498A1 SG1996002853A SG1996002853A SG50498A1 SG 50498 A1 SG50498 A1 SG 50498A1 SG 1996002853 A SG1996002853 A SG 1996002853A SG 1996002853 A SG1996002853 A SG 1996002853A SG 50498 A1 SG50498 A1 SG 50498A1
Authority
SG
Singapore
Prior art keywords
magnetron sputtering
sputtering apparatus
magnetron
sputtering
Prior art date
Application number
SG1996002853A
Other languages
English (en)
Inventor
Yoji Arita
Original Assignee
Mitsubishi Chem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chem Corp filed Critical Mitsubishi Chem Corp
Publication of SG50498A1 publication Critical patent/SG50498A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
SG1996002853A 1989-01-30 1990-01-30 Magnetron sputtering apparatus SG50498A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1770489 1989-01-30

Publications (1)

Publication Number Publication Date
SG50498A1 true SG50498A1 (en) 1998-07-20

Family

ID=11951168

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996002853A SG50498A1 (en) 1989-01-30 1990-01-30 Magnetron sputtering apparatus

Country Status (5)

Country Link
EP (2) EP0645798B1 (ja)
JP (1) JPH0774439B2 (ja)
CA (2) CA2008934C (ja)
DE (2) DE69031743T2 (ja)
SG (1) SG50498A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02118750U (ja) * 1989-03-08 1990-09-25
DE69433208T2 (de) * 1993-10-22 2004-08-05 Manley, Barry, Boulder Verfahren und vorrichtung zum sputtern von magnetischem targetmaterial
NL1000139C2 (nl) * 1995-04-13 1996-10-15 Od & Me Bv Magnetronsputtersysteem.
DE19622606C2 (de) * 1996-06-05 2002-02-28 Applied Films Gmbh & Co Kg Sputterkathode
DE19622605A1 (de) * 1996-06-05 1997-12-11 Leybold Systems Gmbh Sputterkathode
DE19708344A1 (de) * 1997-03-01 1998-09-03 Leybold Systems Gmbh Sputterkathode
DE19836125C2 (de) * 1998-08-10 2001-12-06 Leybold Systems Gmbh Zerstäubungsvorrichtung mit einer Kathode mit Permanentmagnetanordnung
US7182843B2 (en) * 2003-11-05 2007-02-27 Dexter Magnetic Technologies, Inc. Rotating sputtering magnetron
US20070246354A1 (en) * 2006-04-19 2007-10-25 Maxim Integrated Products, Inc. Plasma systems with magnetic filter devices to alter film deposition/etching characteristics
JP6612448B2 (ja) * 2016-06-21 2019-11-27 株式会社アルバック ターゲット装置、スパッタリング装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4265729A (en) * 1978-09-27 1981-05-05 Vac-Tec Systems, Inc. Magnetically enhanced sputtering device
CH648690A5 (de) * 1980-10-14 1985-03-29 Balzers Hochvakuum Kathodenanordnung zur abstaeubung von material von einem target in einer kathodenzerstaeubungsanlage.
EP0144838B1 (de) * 1983-12-05 1989-10-11 Leybold Aktiengesellschaft Magnetronkatode zum Zerstäuben ferromagnetischer Targets
JPH0633454B2 (ja) * 1984-11-20 1994-05-02 松下電器産業株式会社 スパツタリング装置

Also Published As

Publication number Publication date
DE69031743D1 (de) 1998-01-02
EP0645798A1 (en) 1995-03-29
JPH0774439B2 (ja) 1995-08-09
EP0645798B1 (en) 1997-11-19
CA2008934C (en) 1997-06-17
EP0381437A2 (en) 1990-08-08
DE69027344D1 (de) 1996-07-18
CA2202801A1 (en) 1990-07-30
EP0381437A3 (en) 1991-03-27
EP0381437B1 (en) 1996-06-12
DE69031743T2 (de) 1998-03-12
CA2008934A1 (en) 1990-07-30
DE69027344T2 (de) 1996-10-10
JPH02277772A (ja) 1990-11-14

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