DE69031743D1 - Magnetronsputteranlage - Google Patents

Magnetronsputteranlage

Info

Publication number
DE69031743D1
DE69031743D1 DE69031743T DE69031743T DE69031743D1 DE 69031743 D1 DE69031743 D1 DE 69031743D1 DE 69031743 T DE69031743 T DE 69031743T DE 69031743 T DE69031743 T DE 69031743T DE 69031743 D1 DE69031743 D1 DE 69031743D1
Authority
DE
Germany
Prior art keywords
magnetron sputtering
sputtering system
magnetron
sputtering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69031743T
Other languages
English (en)
Other versions
DE69031743T2 (de
Inventor
Yoji Arita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Kasei Corp
Original Assignee
Mitsubishi Kasei Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Kasei Corp filed Critical Mitsubishi Kasei Corp
Publication of DE69031743D1 publication Critical patent/DE69031743D1/de
Application granted granted Critical
Publication of DE69031743T2 publication Critical patent/DE69031743T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
DE1990631743 1989-01-30 1990-01-30 Magnetronsputteranlage Expired - Lifetime DE69031743T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1770489 1989-01-30

Publications (2)

Publication Number Publication Date
DE69031743D1 true DE69031743D1 (de) 1998-01-02
DE69031743T2 DE69031743T2 (de) 1998-03-12

Family

ID=11951168

Family Applications (2)

Application Number Title Priority Date Filing Date
DE1990631743 Expired - Lifetime DE69031743T2 (de) 1989-01-30 1990-01-30 Magnetronsputteranlage
DE1990627344 Expired - Lifetime DE69027344T2 (de) 1989-01-30 1990-01-30 Magnetronzerstäubungsanlage

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE1990627344 Expired - Lifetime DE69027344T2 (de) 1989-01-30 1990-01-30 Magnetronzerstäubungsanlage

Country Status (5)

Country Link
EP (2) EP0381437B1 (de)
JP (1) JPH0774439B2 (de)
CA (2) CA2202801A1 (de)
DE (2) DE69031743T2 (de)
SG (1) SG50498A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02118750U (de) * 1989-03-08 1990-09-25
EP0724652B1 (de) * 1993-10-22 2003-10-01 Manley, Kelly Verfahren und vorrichtung zum sputtern von magnetischem targetmaterial
NL1000139C2 (nl) * 1995-04-13 1996-10-15 Od & Me Bv Magnetronsputtersysteem.
DE19622605A1 (de) * 1996-06-05 1997-12-11 Leybold Systems Gmbh Sputterkathode
DE19622606C2 (de) * 1996-06-05 2002-02-28 Applied Films Gmbh & Co Kg Sputterkathode
DE19708344A1 (de) * 1997-03-01 1998-09-03 Leybold Systems Gmbh Sputterkathode
DE19836125C2 (de) * 1998-08-10 2001-12-06 Leybold Systems Gmbh Zerstäubungsvorrichtung mit einer Kathode mit Permanentmagnetanordnung
US7182843B2 (en) * 2003-11-05 2007-02-27 Dexter Magnetic Technologies, Inc. Rotating sputtering magnetron
US20070246354A1 (en) * 2006-04-19 2007-10-25 Maxim Integrated Products, Inc. Plasma systems with magnetic filter devices to alter film deposition/etching characteristics
WO2017221821A1 (ja) * 2016-06-21 2017-12-28 株式会社アルバック ターゲット装置、スパッタリング装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4265729A (en) * 1978-09-27 1981-05-05 Vac-Tec Systems, Inc. Magnetically enhanced sputtering device
CH648690A5 (de) * 1980-10-14 1985-03-29 Balzers Hochvakuum Kathodenanordnung zur abstaeubung von material von einem target in einer kathodenzerstaeubungsanlage.
DE3480145D1 (en) * 1983-12-05 1989-11-16 Leybold Ag Magnetron cathode for the sputtering of ferromagnetic targets
JPH0633454B2 (ja) * 1984-11-20 1994-05-02 松下電器産業株式会社 スパツタリング装置

Also Published As

Publication number Publication date
JPH0774439B2 (ja) 1995-08-09
EP0645798B1 (de) 1997-11-19
CA2008934C (en) 1997-06-17
DE69027344D1 (de) 1996-07-18
CA2008934A1 (en) 1990-07-30
SG50498A1 (en) 1998-07-20
EP0381437A3 (de) 1991-03-27
JPH02277772A (ja) 1990-11-14
DE69031743T2 (de) 1998-03-12
CA2202801A1 (en) 1990-07-30
DE69027344T2 (de) 1996-10-10
EP0645798A1 (de) 1995-03-29
EP0381437B1 (de) 1996-06-12
EP0381437A2 (de) 1990-08-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition