SG46492G - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
SG46492G
SG46492G SG46492A SG46492A SG46492G SG 46492 G SG46492 G SG 46492G SG 46492 A SG46492 A SG 46492A SG 46492 A SG46492 A SG 46492A SG 46492 G SG46492 G SG 46492G
Authority
SG
Singapore
Prior art keywords
signal lines
package
speed signal
semiconductor device
ground surfaces
Prior art date
Application number
SG46492A
Other languages
English (en)
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP60064992A external-priority patent/JPS61225842A/ja
Priority claimed from JP60074438A external-priority patent/JPH067551B2/ja
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of SG46492G publication Critical patent/SG46492G/en

Links

Classifications

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    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
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    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Noodles (AREA)
  • Structure Of Printed Boards (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Waveguides (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
SG46492A 1985-03-30 1992-04-24 Semiconductor device SG46492G (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60064992A JPS61225842A (ja) 1985-03-30 1985-03-30 半導体装置
JP60074438A JPH067551B2 (ja) 1985-04-10 1985-04-10 半導体装置

Publications (1)

Publication Number Publication Date
SG46492G true SG46492G (en) 1992-06-12

Family

ID=26406139

Family Applications (1)

Application Number Title Priority Date Filing Date
SG46492A SG46492G (en) 1985-03-30 1992-04-24 Semiconductor device

Country Status (8)

Country Link
US (1) US4725878A (fr)
EP (2) EP0198621B1 (fr)
KR (1) KR910000241B1 (fr)
AT (1) ATE68913T1 (fr)
CA (1) CA1246755A (fr)
DE (1) DE3682099D1 (fr)
HK (1) HK56292A (fr)
SG (1) SG46492G (fr)

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EP0282617A1 (fr) * 1987-03-18 1988-09-21 Texas Instruments Deutschland Gmbh Circuit intégré comprenant un support électroconducteur
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US4899118A (en) * 1988-12-27 1990-02-06 Hughes Aircraft Company Low temperature cofired ceramic packages for microwave and millimeter wave gallium arsenide integrated circuits
ATE171307T1 (de) * 1989-05-22 1998-10-15 Advanced Micro Devices Inc Leiterstruktur für eine integrierte schaltung
JP2880734B2 (ja) * 1989-08-31 1999-04-12 株式会社東芝 集積回路及びその接続回路
US4975761A (en) * 1989-09-05 1990-12-04 Advanced Micro Devices, Inc. High performance plastic encapsulated package for integrated circuit die
DE3931634A1 (de) * 1989-09-22 1991-04-04 Telefunken Electronic Gmbh Halbleiterbauelement
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JPH0425036A (ja) * 1990-05-16 1992-01-28 Mitsubishi Electric Corp マイクロ波半導体装置
JP2535651B2 (ja) * 1990-07-24 1996-09-18 株式会社東芝 半導体装置
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JP3489926B2 (ja) * 1995-11-28 2004-01-26 三菱電機株式会社 高周波回路装置
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Also Published As

Publication number Publication date
EP0198621B1 (fr) 1991-10-23
EP0198621A3 (en) 1988-01-07
HK56292A (en) 1992-08-07
CA1246755A (fr) 1988-12-13
KR910000241B1 (ko) 1991-01-23
EP0198621A2 (fr) 1986-10-22
DE3682099D1 (de) 1991-11-28
US4725878A (en) 1988-02-16
ATE68913T1 (de) 1991-11-15
EP0396152A1 (fr) 1990-11-07
KR860007730A (ko) 1986-10-17

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