SG43451A1 - Automatic electronic parts mounting apparatus - Google Patents

Automatic electronic parts mounting apparatus

Info

Publication number
SG43451A1
SG43451A1 SG1996011618A SG1996011618A SG43451A1 SG 43451 A1 SG43451 A1 SG 43451A1 SG 1996011618 A SG1996011618 A SG 1996011618A SG 1996011618 A SG1996011618 A SG 1996011618A SG 43451 A1 SG43451 A1 SG 43451A1
Authority
SG
Singapore
Prior art keywords
mounting apparatus
electronic parts
parts mounting
automatic electronic
automatic
Prior art date
Application number
SG1996011618A
Other languages
English (en)
Inventor
Shigetoshi Negishi
Takeshi Nishiguchi
Mikio Yasuda
Takashi Munezane
Manabu Morioka
Takayoshi Kado
Takaharu Fuji
Noboru Furuta
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of SG43451A1 publication Critical patent/SG43451A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0411—Pick-and-place heads or apparatus, e.g. with jaws having multiple mounting heads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00—Metal working
    • Y10S29/044—Vacuum
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49137—Different components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y10T29/53048—Multiple station assembly or disassembly apparatus
    • Y10T29/53052—Multiple station assembly or disassembly apparatus including position sensor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53187—Multiple station assembly apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)
SG1996011618A 1995-12-15 1996-12-11 Automatic electronic parts mounting apparatus SG43451A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP32677395 1995-12-15
JP11763396 1996-05-13

Publications (1)

Publication Number Publication Date
SG43451A1 true SG43451A1 (en) 1997-10-17

Family

ID=26455721

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996011618A SG43451A1 (en) 1995-12-15 1996-12-11 Automatic electronic parts mounting apparatus

Country Status (8)

Country Link
US (1) US6691400B1 (zh)
EP (1) EP0779777B1 (zh)
KR (1) KR100285148B1 (zh)
CN (1) CN1071536C (zh)
DE (1) DE69606963T2 (zh)
MY (1) MY133263A (zh)
SG (1) SG43451A1 (zh)
TW (1) TW324882B (zh)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3477321B2 (ja) * 1996-07-25 2003-12-10 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
DE19925217A1 (de) * 1999-06-01 2000-12-21 Siemens Ag Verfahren zum Bestücken von Substraten mit Bauelementen
EP1215954B1 (en) * 1999-09-02 2006-11-15 Matsushita Electric Industrial Co., Ltd. Method and device for part recognition, and method and device for part mounting
WO2001076343A1 (de) * 2000-03-31 2001-10-11 Siemens Aktiengesellschaft Vorrichtung und verfahren zum bestücken von substraten mit elektrischen bauelementen
DE10016130C1 (de) * 2000-03-31 2001-08-23 Siemens Ag Vorrichtung zum Bestücken von Substraten mit elektrischen Bauelementen
WO2002028161A1 (en) * 2000-09-26 2002-04-04 Matsushita Technology (S) Pte Ltd. Component placement machine and method thereof
DE10156266A1 (de) * 2001-11-16 2003-06-05 Siemens Ag Vorrichtung und Verfahren zum Bestücken von Substraten mit elektrischen Bauelementen mittels in zwei parallelen Führungsbahnen verschiebbaren Bestückköpfen
DE10235471A1 (de) * 2002-08-02 2004-02-19 Siemens Ag Verfahren und Vorrichtung zum Bestücken von Substraten
JP2004241595A (ja) * 2003-02-06 2004-08-26 Matsushita Electric Ind Co Ltd 部品実装機
JP4349125B2 (ja) * 2003-12-26 2009-10-21 パナソニック株式会社 電子部品搭載装置
WO2006080366A2 (en) * 2005-01-27 2006-08-03 Matsushita Electric Industrial Co., Ltd. Monitoring method, monitoring apparatus, and mounter
JPWO2007057968A1 (ja) * 2005-11-18 2009-04-30 富士通株式会社 部品搭載装置における作業支援システム、部品配列の認識方法およびカセット配列の認識方法
JP4772636B2 (ja) * 2006-10-03 2011-09-14 ヤマハ発動機株式会社 部品実装装置
KR20090083355A (ko) * 2006-11-06 2009-08-03 파나소닉 주식회사 이동 장치 및 전자부품 실장 장치
TWI408874B (zh) * 2008-06-27 2013-09-11 Hon Hai Prec Ind Co Ltd 音圈馬達組裝裝置
DE102010047369A1 (de) * 2010-10-05 2012-04-05 Phoenix Contact Gmbh & Co. Kg Verfahren zur Montage von Bauteilen auf einer Tragschiene sowie System zur Durchführung des Verfahrens
KR101649855B1 (ko) * 2010-11-12 2016-08-23 한화테크윈 주식회사 가변 피치 헤드를 이용한 부품 실장 최적화 방법 및 그 방법을 이용한 부품 실장기
US10548231B2 (en) * 2013-11-29 2020-01-28 Botfactory Inc. Apparatus for depositing conductive and nonconductive material to form a printed circuit
WO2015081347A1 (en) * 2013-11-29 2015-06-04 Michael Knox Apparatus and method for the manufacturing of printed wiring boards and component attachment
US11596071B2 (en) * 2013-11-29 2023-02-28 Botfactory Inc. Apparatus for depositing conductive and nonconductive material to form a printed circuit
JPWO2015141802A1 (ja) * 2014-03-20 2017-04-13 オリンパス株式会社 実装構造体の製造方法、実装用治具、実装構造体の製造装置、撮像装置および内視鏡装置
USD756431S1 (en) * 2015-05-19 2016-05-17 F. Richard Langner Robot accessory mount
US10750647B2 (en) * 2017-09-15 2020-08-18 Dell Products, L.P. Reducing displacement of selected components during printed circuit board assembly (PCBA) manufacturing
DE102018125903A1 (de) 2018-10-18 2020-04-23 Osram Opto Semiconductors Gmbh Haftstempel und Verfahren zum Transfer fehlender Halbleiterchips
CN111037528B (zh) * 2019-11-20 2023-05-02 重庆启尔电子科技有限公司 一种pcb板用托架

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3662881A (en) 1971-01-29 1972-05-16 Ibm Module handling apparatus
JP2541220B2 (ja) * 1987-05-19 1996-10-09 ソニー株式会社 電子部品装着装置
JPH0217899A (ja) 1988-07-01 1990-01-22 Nippon Denso Co Ltd 車両用交流発電機
US4951383A (en) * 1988-11-14 1990-08-28 Sanyo Electric Co., Ltd. Electronic parts automatic mounting apparatus
EP0395002A3 (en) 1989-04-28 1991-07-10 Sanyo Electric Co., Ltd. Electronic parts mounting apparatus
US5218753A (en) * 1989-06-22 1993-06-15 Sanyo Electric Co., Ltd. Assembling apparatus using back up pins for supporting printed circuit board
JP2844828B2 (ja) 1990-04-18 1999-01-13 松下電器産業株式会社 電子部品装着装置
US5093984A (en) * 1990-05-18 1992-03-10 Aehr Test Systems Printed circuit board loader/unloader
JP2841856B2 (ja) * 1990-11-29 1998-12-24 松下電器産業株式会社 電子部品実装装置
JPH07114319B2 (ja) * 1991-01-22 1995-12-06 松下電器産業株式会社 チップ形電子部品の供給装置
JP3159266B2 (ja) 1991-02-14 2001-04-23 三洋電機株式会社 作業装置
JPH0685492A (ja) 1992-08-31 1994-03-25 Matsushita Electric Ind Co Ltd 部品装着装置
US5323528A (en) * 1993-06-14 1994-06-28 Amistar Corporation Surface mount placement system
JPH07202496A (ja) 1993-12-28 1995-08-04 Matsushita Electric Ind Co Ltd チップ部品装着装置
JPH07202491A (ja) 1993-12-28 1995-08-04 Matsushita Electric Ind Co Ltd チップ抵抗装着方法およびチップ抵抗装着装置

Also Published As

Publication number Publication date
DE69606963D1 (de) 2000-04-13
MY133263A (en) 2007-10-31
KR100285148B1 (ko) 2001-03-15
TW324882B (en) 1998-01-11
CN1071536C (zh) 2001-09-19
US6691400B1 (en) 2004-02-17
CN1159139A (zh) 1997-09-10
DE69606963T2 (de) 2000-07-27
KR970058510A (ko) 1997-07-31
EP0779777A1 (en) 1997-06-18
EP0779777B1 (en) 2000-03-08

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