SG38974A1 - Shield assembly and method of shielding suitable for using in a communication device - Google Patents

Shield assembly and method of shielding suitable for using in a communication device

Info

Publication number
SG38974A1
SG38974A1 SG1996010385A SG1996010385A SG38974A1 SG 38974 A1 SG38974 A1 SG 38974A1 SG 1996010385 A SG1996010385 A SG 1996010385A SG 1996010385 A SG1996010385 A SG 1996010385A SG 38974 A1 SG38974 A1 SG 38974A1
Authority
SG
Singapore
Prior art keywords
communication device
shield assembly
shielding suitable
shielding
shield
Prior art date
Application number
SG1996010385A
Other languages
English (en)
Inventor
Scott William Matuszewki
Jin Won Lee
John Francis Hannon
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of SG38974A1 publication Critical patent/SG38974A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/3827—Portable transceivers
    • H04B1/3833—Hand-held transceivers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
SG1996010385A 1995-08-21 1996-07-30 Shield assembly and method of shielding suitable for using in a communication device SG38974A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/517,496 US5633786A (en) 1995-08-21 1995-08-21 Shield assembly and method of shielding suitable for use in a communication device

Publications (1)

Publication Number Publication Date
SG38974A1 true SG38974A1 (en) 1997-04-17

Family

ID=24060057

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996010385A SG38974A1 (en) 1995-08-21 1996-07-30 Shield assembly and method of shielding suitable for using in a communication device

Country Status (12)

Country Link
US (1) US5633786A (zh)
JP (1) JP3786746B2 (zh)
KR (1) KR100226236B1 (zh)
CN (1) CN1071086C (zh)
AU (1) AU700176B2 (zh)
BR (1) BR9603472B1 (zh)
CA (1) CA2182852C (zh)
DE (1) DE19633354C2 (zh)
FI (1) FI115111B (zh)
FR (1) FR2738105B1 (zh)
GB (1) GB2304471B (zh)
SG (1) SG38974A1 (zh)

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JP3734807B2 (ja) * 2003-05-19 2006-01-11 Ｔｄｋ株式会社 電子部品モジュール
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WO2005104643A1 (fr) * 2004-04-23 2005-11-03 Conception Et Developpement Michelin S.A. Support adapte pour recevoir un module electronique a circuit de refroidissement par liquide, et ensemble forme par support et modules
JP4454388B2 (ja) * 2004-05-20 2010-04-21 日本電気株式会社 半導体モジュール
US7398072B2 (en) 2004-08-31 2008-07-08 Research In Motion Limited Mobile wireless communications device with reduced microphone noise from radio frequency communications circuitry
US7087835B2 (en) * 2004-10-19 2006-08-08 Bi-Link Metal Specialties Inc. Apparatus and method for shielding printed circuit boards
DE602004017330D1 (de) * 2004-11-19 2008-12-04 Sony Ericsson Mobile Comm Ab Elektromagnetische Abschirmung für elektrische Bauteile auf einer gedrucken Leiterplatte
WO2006053639A1 (en) * 2004-11-19 2006-05-26 Sony Ericsson Mobile Communications Ab An electromagnetic shield for shielding electrical components on a printed circuit board
CN1780178B (zh) * 2004-11-23 2011-05-04 简呈豪 无线通信屏蔽鉴别方法及系统
DE102005028203B4 (de) * 2005-03-03 2010-11-11 Diabetes.Online Ag Mobiltelefon mit eingebautem Messgerät
KR100676702B1 (ko) * 2005-03-08 2007-02-01 삼성전자주식회사 전자기기용 회로기판실장패널
JP4511408B2 (ja) * 2005-04-18 2010-07-28 富士通株式会社 表示モジュールおよび携帯端末装置
US7518880B1 (en) 2006-02-08 2009-04-14 Bi-Link Shielding arrangement for electronic device
KR100803348B1 (ko) 2006-09-15 2008-02-13 주식회사유비와이즈 내장된 안테나를 구비하는 휴대용 ｒｆ 수신기용 어셈블리
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WO2009078060A1 (ja) * 2007-12-14 2009-06-25 Fujitsu Limited シールドケース、それを用いた電子装置、および携帯型情報機器
US8466151B2 (en) 2007-12-26 2013-06-18 Critical Outcome Technologies, Inc. Compounds and method for treatment of cancer
US7952890B2 (en) * 2008-04-30 2011-05-31 Apple Inc. Interlocking EMI shield
US8099064B2 (en) 2008-05-08 2012-01-17 Research In Motion Limited Mobile wireless communications device with reduced harmonics resulting from metal shield coupling
EP2318406B1 (en) 2008-07-17 2016-01-27 Critical Outcome Technologies, Inc. Thiosemicarbazone inhibitor compounds and cancer treatment methods
US7952881B2 (en) * 2009-03-31 2011-05-31 Motorola Solutions, Inc. Thermal-electrical assembly for a portable communication device
JP2010251375A (ja) * 2009-04-10 2010-11-04 Toshiba Corp 電子回路
US20100257732A1 (en) * 2009-04-14 2010-10-14 Ziberna Frank J Shielding Arrangement for Electronic Device
US20110018160A1 (en) * 2009-07-24 2011-01-27 Ziberna Frank J Method of Producing Covers for Electronics
JP5154520B2 (ja) * 2009-07-31 2013-02-27 シャープ株式会社 構造体
WO2011120153A1 (en) 2010-04-01 2011-10-06 Critical Outcome Technologies Inc. Compounds and method for treatment of hiv
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KR101608796B1 (ko) * 2013-06-11 2016-04-04 삼성전자주식회사 쉴드 캔 조립체 및 그것을 갖는 전자 장치
EP2962799B8 (de) * 2014-07-04 2016-10-12 ABB Schweiz AG Halbleitermodul mit Ultraschall geschweißten Anschlüssen
CN108781526A (zh) * 2016-03-16 2018-11-09 索尼互动娱乐股份有限公司 电子设备
DE102016108867A1 (de) * 2016-05-13 2017-11-16 Kathrein Werke Kg Schirmgehäuse für HF-Anwendungen
JP6846161B2 (ja) * 2016-10-28 2021-03-24 株式会社小糸製作所 負荷駆動装置、車両用灯具および負荷駆動装置の製造方法
TW202019270A (zh) * 2018-11-14 2020-05-16 和碩聯合科技股份有限公司 電子裝置及其電磁屏蔽組件

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Also Published As

Publication number Publication date
FI963273A (fi) 1997-02-22
BR9603472A (pt) 1998-05-12
CN1071086C (zh) 2001-09-12
BR9603472B1 (pt) 2010-08-10
FI115111B (fi) 2005-02-28
AU700176B2 (en) 1998-12-24
AU6085196A (en) 1997-02-27
FI963273A0 (fi) 1996-08-21
FR2738105A1 (fr) 1997-02-28
FR2738105B1 (fr) 1999-05-21
DE19633354A1 (de) 1997-02-27
GB2304471B (en) 1999-10-13
JPH09107187A (ja) 1997-04-22
US5633786A (en) 1997-05-27
GB2304471A (en) 1997-03-19
CA2182852C (en) 1999-11-09
CA2182852A1 (en) 1997-02-22
DE19633354C2 (de) 2002-01-31
KR100226236B1 (ko) 1999-10-15
JP3786746B2 (ja) 2006-06-14
CN1148787A (zh) 1997-04-30
GB9617246D0 (en) 1996-09-25
KR970014505A (ko) 1997-03-29
MX9603551A (es) 1997-07-31

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