SG184022A1 - Integrated microminiature relay - Google Patents
Integrated microminiature relay Download PDFInfo
- Publication number
- SG184022A1 SG184022A1 SG2012067484A SG2012067484A SG184022A1 SG 184022 A1 SG184022 A1 SG 184022A1 SG 2012067484 A SG2012067484 A SG 2012067484A SG 2012067484 A SG2012067484 A SG 2012067484A SG 184022 A1 SG184022 A1 SG 184022A1
- Authority
- SG
- Singapore
- Prior art keywords
- electrical contact
- substrate
- coil
- plane
- magnetic
- Prior art date
Links
- 230000005291 magnetic effect Effects 0.000 claims abstract description 285
- 239000000758 substrate Substances 0.000 claims abstract description 132
- 238000000034 method Methods 0.000 claims description 23
- 239000003302 ferromagnetic material Substances 0.000 claims description 14
- 230000008878 coupling Effects 0.000 claims description 12
- 238000010168 coupling process Methods 0.000 claims description 12
- 238000005859 coupling reaction Methods 0.000 claims description 12
- 230000003190 augmentative effect Effects 0.000 claims description 11
- 230000005465 channeling Effects 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 description 16
- 238000013461 design Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 14
- 238000009713 electroplating Methods 0.000 description 12
- 230000004907 flux Effects 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 9
- 239000004020 conductor Substances 0.000 description 9
- 238000012545 processing Methods 0.000 description 9
- 230000005294 ferromagnetic effect Effects 0.000 description 8
- 238000000151 deposition Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 7
- 230000008021 deposition Effects 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- ORQBXQOJMQIAOY-UHFFFAOYSA-N nobelium Chemical compound [No] ORQBXQOJMQIAOY-UHFFFAOYSA-N 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000000708 deep reactive-ion etching Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000815 supermalloy Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H51/00—Electromagnetic relays
- H01H51/02—Non-polarised relays
- H01H51/04—Non-polarised relays with single armature; with single set of ganged armatures
- H01H51/06—Armature is movable between two limit positions of rest and is moved in one direction due to energisation of an electromagnet and after the electromagnet is de-energised is returned by energy stored during the movement in the first direction, e.g. by using a spring, by using a permanent magnet, by gravity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/64—Protective enclosures, baffle plates, or screens for contacts
- H01H1/66—Contacts sealed in an evacuated or gas-filled envelope, e.g. magnetic dry-reed contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H50/00—Details of electromagnetic relays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H50/00—Details of electromagnetic relays
- H01H50/005—Details of electromagnetic relays using micromechanics
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Micromachines (AREA)
- Relay Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/725,168 US8665041B2 (en) | 2008-03-20 | 2010-03-16 | Integrated microminiature relay |
| PCT/US2011/027930 WO2011115814A1 (en) | 2010-03-16 | 2011-03-10 | Integrated microminiature relay |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG184022A1 true SG184022A1 (en) | 2012-10-30 |
Family
ID=44059281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2012067484A SG184022A1 (en) | 2010-03-16 | 2011-03-10 | Integrated microminiature relay |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US8665041B2 (enExample) |
| EP (1) | EP2548212A1 (enExample) |
| JP (1) | JP2013522847A (enExample) |
| KR (1) | KR20130069571A (enExample) |
| CN (1) | CN102893355A (enExample) |
| SG (1) | SG184022A1 (enExample) |
| WO (1) | WO2011115814A1 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8665041B2 (en) * | 2008-03-20 | 2014-03-04 | Ht Microanalytical, Inc. | Integrated microminiature relay |
| US8436701B2 (en) | 2010-02-08 | 2013-05-07 | International Business Machines Corporation | Integrated electromechanical relays |
| FR2966813A1 (fr) * | 2010-10-29 | 2012-05-04 | Thales Sa | Microsysteme electromecanique (mems). |
| US8552824B1 (en) * | 2012-04-03 | 2013-10-08 | Hamilton Sundstrand Corporation | Integrated planar electromechanical contactors |
| WO2013184223A1 (en) * | 2012-06-05 | 2013-12-12 | The Regents Of The University Of California | Micro electromagnetically actuated latched switches |
| US10551215B2 (en) | 2015-06-11 | 2020-02-04 | Analog Devices Global Unlimited Company | Systems, circuits and methods for determining a position of a movable object |
| US10145906B2 (en) | 2015-12-17 | 2018-12-04 | Analog Devices Global | Devices, systems and methods including magnetic structures |
| US10342142B2 (en) | 2017-07-28 | 2019-07-02 | International Business Machines Corporation | Implementing customized PCB via creation through use of magnetic pads |
| JP6950613B2 (ja) | 2018-04-11 | 2021-10-13 | Tdk株式会社 | 磁気作動型ｍｅｍｓスイッチ |
| KR102073153B1 (ko) * | 2018-08-14 | 2020-02-04 | 한국과학기술연구원 | 2-자유도 충격 액추에이터 및 충격 제어 방법 |
| US11387029B2 (en) * | 2018-09-12 | 2022-07-12 | LuxNour Technologies Inc. | Apparatus for transferring plurality of micro devices and methods of fabrication |
| US11915855B2 (en) * | 2019-03-22 | 2024-02-27 | Cyntec Co., Ltd. | Method to form multile electrical components and a single electrical component made by the method |
Family Cites Families (58)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US2497547A (en) * | 1946-04-20 | 1950-02-14 | Hastings Charles Edwin | Magnetic switch |
| US2931872A (en) * | 1958-09-22 | 1960-04-05 | Iron Fireman Mfg Co | Polarized relay |
| US3087125A (en) * | 1961-07-13 | 1963-04-23 | Gen Electric | Coaxial reed relay for interrupting the center conductor and simultaneously terminating its opened ends |
| US3167625A (en) * | 1961-09-26 | 1965-01-26 | Wheelock Signals Inc | Mounting structure for electromagentic sealed relay |
| US3268839A (en) * | 1965-03-05 | 1966-08-23 | Gen Electric | Magnetic reed relay |
| GB1145083A (en) * | 1965-04-30 | 1969-03-12 | Modern Prec Engineering Finchl | Improvements in or relating to electromagnetic switches |
| DE1251869B (de) * | 1966-10-08 | 1967-10-12 | Telefunken Patentverwertungsgesellschaft m.b.H., Ulm/Donau, Elisabethenstr. 3 | Magnetisch gesteurtes Schutzrohrkontakt-Relais |
| US3586809A (en) * | 1969-04-24 | 1971-06-22 | Briggs & Stratton Corp | Reed switch for rapid cycle,high power applications |
| US3579158A (en) * | 1969-07-28 | 1971-05-18 | Clare & Co C P | Armature structure for reed switches |
| FR2058828A5 (enExample) * | 1969-09-29 | 1971-05-28 | Preux Roger | |
| US3913054A (en) * | 1973-11-08 | 1975-10-14 | Robertshaw Controls Co | Thermally responsive switch |
| JPS51121170A (en) * | 1975-04-15 | 1976-10-22 | Yaskawa Denki Seisakusho Kk | Reed switch |
| US4011533A (en) * | 1976-01-14 | 1977-03-08 | Briggs & Stratton Corporation | Magnetically actuated switch for precise rapid cycle operation |
| JP2714736B2 (ja) * | 1992-06-01 | 1998-02-16 | シャープ株式会社 | マイクロリレー |
| DE69311277T2 (de) * | 1992-12-15 | 1998-01-15 | Asulab Sa | Schutzrohrschalter und Herstellungsverfahren für aufgehängte dreidimensionale metallische Mikrostrukturen |
| US5472539A (en) * | 1994-06-06 | 1995-12-05 | General Electric Company | Methods for forming and positioning moldable permanent magnets on electromagnetically actuated microfabricated components |
| US6094116A (en) * | 1996-08-01 | 2000-07-25 | California Institute Of Technology | Micro-electromechanical relays |
| JPH10269920A (ja) * | 1997-03-26 | 1998-10-09 | Omron Corp | 電磁石マイクロリレー |
| FR2761518B1 (fr) * | 1997-04-01 | 1999-05-28 | Suisse Electronique Microtech | Moteur planaire magnetique et micro-actionneur magnetique comportant un tel moteur |
| CH691559A5 (fr) * | 1997-04-21 | 2001-08-15 | Asulab Sa | Micro-contacteur magnétique et son procédé de fabrication. |
| JPH11134994A (ja) * | 1997-10-30 | 1999-05-21 | Omron Corp | リレー |
| JP3636022B2 (ja) | 1998-12-22 | 2005-04-06 | 日本電気株式会社 | マイクロマシンスイッチ |
| US6410360B1 (en) * | 1999-01-26 | 2002-06-25 | Teledyne Industries, Inc. | Laminate-based apparatus and method of fabrication |
| DE10031569A1 (de) | 1999-07-01 | 2001-02-01 | Advantest Corp | Integrierter Mikroschalter und Verfahren zu seiner Herstellung |
| JP2001076605A (ja) * | 1999-07-01 | 2001-03-23 | Advantest Corp | 集積型マイクロスイッチおよびその製造方法 |
| JP2001076599A (ja) | 1999-09-02 | 2001-03-23 | Tokai Rika Co Ltd | マイクロリードスイッチ、マイクロリードスイッチ体及びマイクロリードスイッチ部材の製造方法 |
| US6310526B1 (en) * | 1999-09-21 | 2001-10-30 | Lap-Sum Yip | Double-throw miniature electromagnetic microwave (MEM) switches |
| US6469602B2 (en) * | 1999-09-23 | 2002-10-22 | Arizona State University | Electronically switching latching micro-magnetic relay and method of operating same |
| US6366186B1 (en) * | 2000-01-20 | 2002-04-02 | Jds Uniphase Inc. | Mems magnetically actuated switches and associated switching arrays |
| CN1357749A (zh) * | 2000-12-06 | 2002-07-10 | 中国科学院长光学精密机械与物理研究所 | 一种集成式微型电感位移传感器及其制备方法 |
| WO2002095896A2 (en) * | 2001-05-18 | 2002-11-28 | Microlab, Inc. | Apparatus utilizing latching micromagnetic switches |
| FR2826504B1 (fr) * | 2001-06-25 | 2003-09-12 | Commissariat Energie Atomique | Actionneur magnetique a temps de reponse reduit |
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| US20030107460A1 (en) * | 2001-12-10 | 2003-06-12 | Guanghua Huang | Low voltage MEM switch |
| US6917268B2 (en) * | 2001-12-31 | 2005-07-12 | International Business Machines Corporation | Lateral microelectromechanical system switch |
| US20030137374A1 (en) * | 2002-01-18 | 2003-07-24 | Meichun Ruan | Micro-Magnetic Latching switches with a three-dimensional solenoid coil |
| US6624003B1 (en) * | 2002-02-06 | 2003-09-23 | Teravicta Technologies, Inc. | Integrated MEMS device and package |
| JP4292532B2 (ja) | 2002-04-24 | 2009-07-08 | 株式会社沖センサデバイス | 機構デバイスの製造方法、機構デバイスおよびマイクロリードスイッチ |
| US6828887B2 (en) * | 2002-05-10 | 2004-12-07 | Jpmorgan Chase Bank | Bistable microelectromechanical system based structures, systems and methods |
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| EP1381063B1 (en) * | 2002-07-10 | 2004-11-24 | Kearney-National Netherlands Holding B.V. | Method for adjusting the switch-gap between the contact tongues of a reed switch |
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| WO2005015595A1 (ja) | 2003-08-07 | 2005-02-17 | Fujitsu Limited | マイクロスイッチング素子およびその製造方法 |
| US7215229B2 (en) * | 2003-09-17 | 2007-05-08 | Schneider Electric Industries Sas | Laminated relays with multiple flexible contacts |
| CN1601682A (zh) | 2003-09-28 | 2005-03-30 | 乐金电子(天津)电器有限公司 | 簧片开关组件 |
| JP2005108471A (ja) | 2003-09-29 | 2005-04-21 | Oki Sensor Device Corp | 接点機構デバイス及びその製造方法 |
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| US7999642B2 (en) * | 2005-03-04 | 2011-08-16 | Ht Microanalytical, Inc. | Miniaturized switch device |
| US7839242B1 (en) * | 2006-08-23 | 2010-11-23 | National Semiconductor Corporation | Magnetic MEMS switching regulator |
| JP2008243450A (ja) | 2007-03-26 | 2008-10-09 | Oki Sensor Device Corp | 接点機構デバイス、接点機構デバイスの製造方法 |
| US7566228B2 (en) * | 2007-06-26 | 2009-07-28 | Intel Corporation | Skived electrical contact for connecting an IC device to a circuit board and method of making a contact by skiving |
| JP2009009756A (ja) * | 2007-06-26 | 2009-01-15 | Panasonic Electric Works Co Ltd | マイクロリレー |
| EP2164088A1 (en) * | 2007-06-26 | 2010-03-17 | Panasonic Electric Works Co., Ltd | A micro relay |
| FR2926922B1 (fr) * | 2008-01-30 | 2010-02-19 | Schneider Electric Ind Sas | Dispositif de commande a double mode d'actionnement |
| US8665041B2 (en) * | 2008-03-20 | 2014-03-04 | Ht Microanalytical, Inc. | Integrated microminiature relay |
| CN102067262B (zh) | 2008-03-20 | 2013-11-27 | Ht微量分析有限公司 | 集成簧片开关 |
| US7902946B2 (en) * | 2008-07-11 | 2011-03-08 | National Semiconductor Corporation | MEMS relay with a flux path that is decoupled from an electrical path through the switch and a suspension structure that is independent of the core structure and a method of forming the same |
| US8436701B2 (en) * | 2010-02-08 | 2013-05-07 | International Business Machines Corporation | Integrated electromechanical relays |
-
2010
- 2010-03-16 US US12/725,168 patent/US8665041B2/en active Active
-
2011
- 2011-03-10 EP EP11709291A patent/EP2548212A1/en not_active Withdrawn
- 2011-03-10 WO PCT/US2011/027930 patent/WO2011115814A1/en not_active Ceased
- 2011-03-10 KR KR1020127026869A patent/KR20130069571A/ko not_active Withdrawn
- 2011-03-10 SG SG2012067484A patent/SG184022A1/en unknown
- 2011-03-10 CN CN2011800241500A patent/CN102893355A/zh active Pending
- 2011-03-10 JP JP2013500092A patent/JP2013522847A/ja active Pending
-
2014
- 2014-01-13 US US14/153,221 patent/US20140152406A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US20100171577A1 (en) | 2010-07-08 |
| CN102893355A (zh) | 2013-01-23 |
| EP2548212A1 (en) | 2013-01-23 |
| US8665041B2 (en) | 2014-03-04 |
| JP2013522847A (ja) | 2013-06-13 |
| US20140152406A1 (en) | 2014-06-05 |
| KR20130069571A (ko) | 2013-06-26 |
| WO2011115814A1 (en) | 2011-09-22 |
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