SG174808A1 - Apparatus and method for drying a substrate - Google Patents
Apparatus and method for drying a substrate Download PDFInfo
- Publication number
- SG174808A1 SG174808A1 SG2011065885A SG2011065885A SG174808A1 SG 174808 A1 SG174808 A1 SG 174808A1 SG 2011065885 A SG2011065885 A SG 2011065885A SG 2011065885 A SG2011065885 A SG 2011065885A SG 174808 A1 SG174808 A1 SG 174808A1
- Authority
- SG
- Singapore
- Prior art keywords
- transition arm
- bellows
- dry
- transition
- wet
- Prior art date
Links
- 238000001035 drying Methods 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 title description 9
- 230000007704 transition Effects 0.000 claims abstract description 177
- 238000004140 cleaning Methods 0.000 claims abstract description 31
- 239000012530 fluid Substances 0.000 claims abstract description 28
- 230000007246 mechanism Effects 0.000 claims abstract description 18
- 238000000926 separation method Methods 0.000 claims abstract description 9
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000004913 activation Effects 0.000 claims description 4
- 229920002530 polyetherether ketone Polymers 0.000 claims description 4
- 239000005357 flat glass Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 18
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 239000007788 liquid Substances 0.000 description 7
- 230000007547 defect Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 3
- 238000004590 computer program Methods 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Drying Of Solid Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/531,905 US20080066339A1 (en) | 2006-09-14 | 2006-09-14 | Apparatus and method for drying a substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG174808A1 true SG174808A1 (en) | 2011-10-28 |
Family
ID=39184520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2011065885A SG174808A1 (en) | 2006-09-14 | 2007-09-11 | Apparatus and method for drying a substrate |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US20080066339A1 (ja) |
| JP (1) | JP2010503822A (ja) |
| CN (1) | CN101522371A (ja) |
| SG (1) | SG174808A1 (ja) |
| WO (1) | WO2008033861A2 (ja) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110186088A1 (en) * | 2010-01-31 | 2011-08-04 | Miller Kenneth C | Substrate nest with drip remover |
| US20120058258A1 (en) * | 2010-09-07 | 2012-03-08 | Molecular Imprints, Inc. | Methods of cleaning hard drive disk substrates for nanoimprint lithography |
| DE102013102545A1 (de) * | 2012-04-27 | 2013-10-31 | Awt Advanced Wet Technologies Gmbh | Verfahren zum Behandeln von zumindest einem Substrat in einem flüssigen Medium |
| CN103868344B (zh) * | 2014-04-01 | 2015-12-09 | 上海千山远东制药机械有限公司 | 自动进出料系统的无缝对接桥板机构 |
| CN108831849A (zh) * | 2018-06-25 | 2018-11-16 | 清华大学 | 基于热马兰哥尼效应的晶圆干燥装置和干燥方法 |
| US20220399211A1 (en) * | 2021-06-11 | 2022-12-15 | Akrion Technologies Inc. | Apparatus, system, and method for drying semiconductor wafers |
| CN114001546B (zh) * | 2021-11-01 | 2022-09-30 | 华海清科股份有限公司 | 一种晶圆提拉干燥的动态交接方法及晶圆干燥装置 |
| CN116544144B (zh) * | 2023-05-16 | 2023-10-27 | 江苏亚电科技有限公司 | 具有喷气功能的晶圆清洗干燥升降机构 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3141334A (en) * | 1960-10-14 | 1964-07-21 | Bendix Corp | Pressure detecting instrument |
| GB955005A (en) * | 1961-07-21 | 1964-04-08 | Molins Machine Co Ltd | Apparatus for gripping and lifting articles |
| EP0097191B1 (de) * | 1981-12-24 | 1986-08-27 | Hans Richter | Montageroboter |
| US4611966A (en) * | 1984-05-30 | 1986-09-16 | Johnson Lester R | Apparatus for transferring semiconductor wafers |
| US5227001A (en) * | 1990-10-19 | 1993-07-13 | Integrated Process Equipment Corporation | Integrated dry-wet semiconductor layer removal apparatus and method |
| US5575079A (en) * | 1993-10-29 | 1996-11-19 | Tokyo Electron Limited | Substrate drying apparatus and substrate drying method |
| US6050275A (en) * | 1996-09-27 | 2000-04-18 | Tokyo Electron Limited | Apparatus for and method of cleaning objects to be processed |
| JP3406168B2 (ja) * | 1996-12-27 | 2003-05-12 | 株式会社カイジョー | 基板の引き上げ乾燥装置 |
| JP3171807B2 (ja) * | 1997-01-24 | 2001-06-04 | 東京エレクトロン株式会社 | 洗浄装置及び洗浄方法 |
| US6571806B2 (en) * | 1998-09-04 | 2003-06-03 | Komag, Inc. | Method for drying a substrate |
| MY140644A (en) * | 2001-04-17 | 2010-01-15 | Komag Inc | Method and apparatus for drying a substrate. |
| JP3888608B2 (ja) * | 2001-04-25 | 2007-03-07 | 東京エレクトロン株式会社 | 基板両面処理装置 |
| SE523503C2 (sv) * | 2002-07-23 | 2004-04-27 | Jettec Ab | Kapillärrör |
-
2006
- 2006-09-14 US US11/531,905 patent/US20080066339A1/en not_active Abandoned
-
2007
- 2007-09-11 WO PCT/US2007/078190 patent/WO2008033861A2/en active Application Filing
- 2007-09-11 JP JP2009528436A patent/JP2010503822A/ja active Pending
- 2007-09-11 CN CNA2007800383740A patent/CN101522371A/zh active Pending
- 2007-09-11 SG SG2011065885A patent/SG174808A1/en unknown
-
2010
- 2010-08-04 US US12/850,541 patent/US20100293810A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008033861A3 (en) | 2008-08-21 |
| JP2010503822A (ja) | 2010-02-04 |
| US20100293810A1 (en) | 2010-11-25 |
| WO2008033861A2 (en) | 2008-03-20 |
| CN101522371A (zh) | 2009-09-02 |
| US20080066339A1 (en) | 2008-03-20 |
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