KR100914527B1 - 기판 이송 로봇의 기판 처짐 방지 장치 및 방법 - Google Patents
기판 이송 로봇의 기판 처짐 방지 장치 및 방법Info
- Publication number
- KR100914527B1 KR100914527B1 KR1020070094936A KR20070094936A KR100914527B1 KR 100914527 B1 KR100914527 B1 KR 100914527B1 KR 1020070094936 A KR1020070094936 A KR 1020070094936A KR 20070094936 A KR20070094936 A KR 20070094936A KR 100914527 B1 KR100914527 B1 KR 100914527B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- finger portion
- transfer robot
- finger
- elevating member
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (5)
- 기판의 양 끝단을 지지하며, 적어도 일측은 좌우방향으로 이동 가능하게 기판 이송 로봇에 구비되는 핑거부;상기 기판의 중심부 하부에서 상기 기판을 지지하며, 상하방향으로 이동 가능하게 구비되는 적어도 하나 이상의 승강부재;상기 핑거부 및 승강부재를 이동시키는 구동부;상기 기판의 중심부 처짐 및 상승 상태를 센싱하는 센서부; 및상기 센서부의 센싱 결과에 따라 상기 기판이 돔 형상을 유지하도록 상기 구동부를 제어하는 제어부를 포함하며,상기 제어부는 상기 승강부재를 상승시켜 상기 기판의 중심부를 평형점 이상으로 들어올린 상태에서, 상기 핑거부를 이동시켜 상기 기판의 양 끝단을 지지하여 상기 기판을 돔 형상으로 유지시키는, 기판 이송 로봇의 기판 처짐 방지 장치.
- 제 1 항에 있어서,상기 핑거부는 상기 기판의 양 끝단에 각각 위치하는 제1 핑거부 및 제2 핑거부를 포함하고,상기 제1 핑거부 및 상기 제2 핑거부는 상기 기판의 양 끝단을 클램핑하는 클램핑 부재를 각각 포함하는, 기판 이송 로봇의 기판 처짐 방지 장치.
- 제 2 항에 있어서,상기 핑거부는 상기 제1 핑거부 및 상기 제2 핑거부 사이인 상기 기판의 중심부 아래에 위치하는 제3 핑거부를 더 포함하고,상기 승강부재는 상기 제3 핑거부에 장착되어, 상기 기판의 중심부를 지지하는, 기판 이송 로봇의 기판 처짐 방지 장치.
- 제 1 항에 있어서,상기 승강부재는 상단부에 첨단이 형성된 봉으로 이루어지는, 기판 이송 로봇의 기판 처짐 방지 장치.
- 기판 이송 로봇에서 기판의 양 끝단을 지지하며 적어도 일측은 좌우 방향으로 이동 가능하게 상기 기판 이송 로봇에 구비되는 핑거부에 지지된 기판의 처짐 발생시, 상기 기판의 중심부 하부에서 상기 기판을 지지하며 상하방향으로 이동 가능하게 구비되는 적어도 하나의 승강부재를 상승시켜 상기 기판의 중심부를 평형점 이상으로 들어올리는 단계; 및상기 기판이 상승한 상태에서 상기 기판을 지지하도록 상기 핑거부를 이동시켜 상기 핑거부의 클램핑 부재에 의하여 상기 기판의 양 끝단을 클램핑하여 상기 기판을 돔 형상으로 유지시키는 단계를 포함하는 기판 이송 로봇의 기판 처짐 방지 방법.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070094936A KR100914527B1 (ko) | 2007-09-18 | 2007-09-18 | 기판 이송 로봇의 기판 처짐 방지 장치 및 방법 |
Applications Claiming Priority (1)
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KR1020070094936A KR100914527B1 (ko) | 2007-09-18 | 2007-09-18 | 기판 이송 로봇의 기판 처짐 방지 장치 및 방법 |
Publications (2)
Publication Number | Publication Date |
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KR20090029583A KR20090029583A (ko) | 2009-03-23 |
KR100914527B1 true KR100914527B1 (ko) | 2009-09-02 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160080693A (ko) | 2014-12-30 | 2016-07-08 | 주식회사 케이씨텍 | 기판 이송기용 처짐 검출장치 |
KR20180001472A (ko) * | 2016-06-24 | 2018-01-04 | 캐논 톡키 가부시키가이샤 | 기판 협지 방법, 기판 협지 장치, 성막 방법, 성막 장치 및 전자 디바이스의 제조 방법, 기판 재치 방법, 얼라인먼트 방법, 기판 재치 장치 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101407421B1 (ko) * | 2013-05-01 | 2014-06-17 | 주식회사 에스에프에이 | 기판 증착 시스템 |
KR102682785B1 (ko) * | 2016-06-29 | 2024-07-08 | 주식회사 선익시스템 | 기판 처짐 방지 장치를 갖는 증착 장비 |
KR102699744B1 (ko) * | 2018-11-05 | 2024-08-27 | 세메스 주식회사 | 반도체 스트립 이송 유닛 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003051525A (ja) * | 2001-08-03 | 2003-02-21 | Fujitsu Display Technologies Corp | 基板搬送装置及び基板搬送方法 |
KR20060104425A (ko) * | 2005-03-30 | 2006-10-09 | 엘지전자 주식회사 | 평판 디스플레이의 노광장치 |
-
2007
- 2007-09-18 KR KR1020070094936A patent/KR100914527B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003051525A (ja) * | 2001-08-03 | 2003-02-21 | Fujitsu Display Technologies Corp | 基板搬送装置及び基板搬送方法 |
KR20060104425A (ko) * | 2005-03-30 | 2006-10-09 | 엘지전자 주식회사 | 평판 디스플레이의 노광장치 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160080693A (ko) | 2014-12-30 | 2016-07-08 | 주식회사 케이씨텍 | 기판 이송기용 처짐 검출장치 |
KR20180001472A (ko) * | 2016-06-24 | 2018-01-04 | 캐논 톡키 가부시키가이샤 | 기판 협지 방법, 기판 협지 장치, 성막 방법, 성막 장치 및 전자 디바이스의 제조 방법, 기판 재치 방법, 얼라인먼트 방법, 기판 재치 장치 |
KR101901066B1 (ko) | 2016-06-24 | 2018-09-20 | 캐논 톡키 가부시키가이샤 | 기판 협지 방법, 기판 협지 장치, 성막 방법, 성막 장치 및 전자 디바이스의 제조 방법, 기판 재치 방법, 얼라인먼트 방법, 기판 재치 장치 |
Also Published As
Publication number | Publication date |
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KR20090029583A (ko) | 2009-03-23 |
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