SG172404A1 - Coated carrier for lapping and methods of making and using - Google Patents
Coated carrier for lapping and methods of making and using Download PDFInfo
- Publication number
- SG172404A1 SG172404A1 SG2011047115A SG2011047115A SG172404A1 SG 172404 A1 SG172404 A1 SG 172404A1 SG 2011047115 A SG2011047115 A SG 2011047115A SG 2011047115 A SG2011047115 A SG 2011047115A SG 172404 A1 SG172404 A1 SG 172404A1
- Authority
- SG
- Singapore
- Prior art keywords
- carrier
- layer
- polymeric
- primer layer
- lapping
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14169608P | 2008-12-31 | 2008-12-31 | |
| PCT/US2009/069672 WO2010078312A1 (en) | 2008-12-31 | 2009-12-29 | Coated carrier for lapping and methods of making and using |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG172404A1 true SG172404A1 (en) | 2011-07-28 |
Family
ID=42104530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2011047115A SG172404A1 (en) | 2008-12-31 | 2009-12-29 | Coated carrier for lapping and methods of making and using |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20110256813A1 (https=) |
| EP (1) | EP2379280A1 (https=) |
| JP (1) | JP2012513908A (https=) |
| KR (1) | KR20110111438A (https=) |
| CN (1) | CN102325629A (https=) |
| SG (1) | SG172404A1 (https=) |
| TW (1) | TW201032954A (https=) |
| WO (1) | WO2010078312A1 (https=) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011003008B4 (de) * | 2011-01-21 | 2018-07-12 | Siltronic Ag | Führungskäfig und Verfahren zur gleichzeitig beidseitigen Material abtragenden Bearbeitung von Halbleiterscheiben |
| US20130017765A1 (en) | 2011-07-11 | 2013-01-17 | 3M Innovative Properties Company | Lapping carrier and method of using the same |
| JP2013094884A (ja) * | 2011-10-31 | 2013-05-20 | Sumitomo Bakelite Co Ltd | 被研磨物保持材、被研磨物保持材の製造方法、および研磨方法 |
| TW201400294A (zh) * | 2012-03-30 | 2014-01-01 | 住友電木股份有限公司 | 被研磨物保持材及用於此之積層板 |
| WO2013146134A1 (ja) * | 2012-03-30 | 2013-10-03 | コニカミノルタ株式会社 | 情報記録媒体用ガラス基板の製造方法および情報記録媒体 |
| DE102012214998B4 (de) * | 2012-08-23 | 2014-07-24 | Siltronic Ag | Verfahren zum beidseitigen Bearbeiten einer Halbleiterscheibe |
| CN106376234B (zh) | 2014-05-02 | 2019-11-05 | 3M创新有限公司 | 间断的结构化磨料制品以及抛光工件的方法 |
| CN104015123A (zh) * | 2014-06-18 | 2014-09-03 | 蓝思科技股份有限公司 | 一种蓝宝石面板的双面抛光工艺 |
| CN108472786B (zh) * | 2015-12-30 | 2021-07-27 | 3M创新有限公司 | 磨料制品 |
| CN105666312B (zh) * | 2016-01-21 | 2017-08-01 | 苏州新美光纳米科技有限公司 | 晶片快速抛光装置及方法 |
| US10556317B2 (en) * | 2016-03-03 | 2020-02-11 | P.R. Hoffman Machine Products Inc. | Polishing machine wafer holder |
| US20170252893A1 (en) * | 2016-03-03 | 2017-09-07 | P.R. Hoffman Machine Products Inc. | Polishing machine work piece holder |
| CN106863025A (zh) * | 2017-03-28 | 2017-06-20 | 江苏吉星新材料有限公司 | 一种2吋、4吋蓝宝石衬底背面缺陷修复加工方法 |
| JP6743785B2 (ja) * | 2017-08-30 | 2020-08-19 | 株式会社Sumco | キャリアの製造方法およびウェーハの研磨方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5859153A (en) | 1996-06-21 | 1999-01-12 | Minnesota Mining And Manufacturing Company | Novolak compounds useful as adhesion promoters for epoxy resins |
| US5882245A (en) * | 1997-02-28 | 1999-03-16 | Advanced Ceramics Research, Inc. | Polymer carrier gears for polishing of flat objects |
| JP2974007B1 (ja) * | 1997-10-20 | 1999-11-08 | 新神戸電機株式会社 | 被研磨物保持材及び被研磨物の製造法 |
| US6419555B1 (en) | 1999-06-03 | 2002-07-16 | Brian D. Goers | Process and apparatus for polishing a workpiece |
| US6911512B2 (en) | 2003-10-10 | 2005-06-28 | 3M Innovative Properties Company | Powder coating fluoropolymer compositions with aromatic materials |
| US20080166952A1 (en) * | 2005-02-25 | 2008-07-10 | Shin-Etsu Handotai Co., Ltd | Carrier For Double-Side Polishing Apparatus, Double-Side Polishing Apparatus And Double-Side Polishing Method Using The Same |
-
2009
- 2009-12-29 KR KR1020117017691A patent/KR20110111438A/ko not_active Withdrawn
- 2009-12-29 WO PCT/US2009/069672 patent/WO2010078312A1/en not_active Ceased
- 2009-12-29 EP EP09804366A patent/EP2379280A1/en not_active Withdrawn
- 2009-12-29 CN CN2009801574034A patent/CN102325629A/zh active Pending
- 2009-12-29 SG SG2011047115A patent/SG172404A1/en unknown
- 2009-12-29 JP JP2011544580A patent/JP2012513908A/ja not_active Withdrawn
- 2009-12-29 US US13/141,596 patent/US20110256813A1/en not_active Abandoned
- 2009-12-30 TW TW098146127A patent/TW201032954A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2010078312A1 (en) | 2010-07-08 |
| JP2012513908A (ja) | 2012-06-21 |
| US20110256813A1 (en) | 2011-10-20 |
| KR20110111438A (ko) | 2011-10-11 |
| TW201032954A (en) | 2010-09-16 |
| EP2379280A1 (en) | 2011-10-26 |
| CN102325629A (zh) | 2012-01-18 |
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