KR20110111438A - 래핑을 위한 코팅된 캐리어와 제조 및 사용 방법 - Google Patents

래핑을 위한 코팅된 캐리어와 제조 및 사용 방법 Download PDF

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Publication number
KR20110111438A
KR20110111438A KR1020117017691A KR20117017691A KR20110111438A KR 20110111438 A KR20110111438 A KR 20110111438A KR 1020117017691 A KR1020117017691 A KR 1020117017691A KR 20117017691 A KR20117017691 A KR 20117017691A KR 20110111438 A KR20110111438 A KR 20110111438A
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KR
South Korea
Prior art keywords
polymer
layer
carrier
wrapping
major surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020117017691A
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English (en)
Korean (ko)
Inventor
티모씨 디 플렛쳐
토드 제이 크리스티안슨
빈센트 디 로메로
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20110111438A publication Critical patent/KR20110111438A/ko
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020117017691A 2008-12-31 2009-12-29 래핑을 위한 코팅된 캐리어와 제조 및 사용 방법 Withdrawn KR20110111438A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14169608P 2008-12-31 2008-12-31
US61/141,696 2008-12-31

Publications (1)

Publication Number Publication Date
KR20110111438A true KR20110111438A (ko) 2011-10-11

Family

ID=42104530

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117017691A Withdrawn KR20110111438A (ko) 2008-12-31 2009-12-29 래핑을 위한 코팅된 캐리어와 제조 및 사용 방법

Country Status (8)

Country Link
US (1) US20110256813A1 (https=)
EP (1) EP2379280A1 (https=)
JP (1) JP2012513908A (https=)
KR (1) KR20110111438A (https=)
CN (1) CN102325629A (https=)
SG (1) SG172404A1 (https=)
TW (1) TW201032954A (https=)
WO (1) WO2010078312A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200024272A (ko) * 2017-08-30 2020-03-06 가부시키가이샤 사무코 캐리어의 제조 방법 및 웨이퍼의 연마 방법

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011003008B4 (de) * 2011-01-21 2018-07-12 Siltronic Ag Führungskäfig und Verfahren zur gleichzeitig beidseitigen Material abtragenden Bearbeitung von Halbleiterscheiben
US20130017765A1 (en) 2011-07-11 2013-01-17 3M Innovative Properties Company Lapping carrier and method of using the same
JP2013094884A (ja) * 2011-10-31 2013-05-20 Sumitomo Bakelite Co Ltd 被研磨物保持材、被研磨物保持材の製造方法、および研磨方法
TW201400294A (zh) * 2012-03-30 2014-01-01 住友電木股份有限公司 被研磨物保持材及用於此之積層板
WO2013146134A1 (ja) * 2012-03-30 2013-10-03 コニカミノルタ株式会社 情報記録媒体用ガラス基板の製造方法および情報記録媒体
DE102012214998B4 (de) * 2012-08-23 2014-07-24 Siltronic Ag Verfahren zum beidseitigen Bearbeiten einer Halbleiterscheibe
CN106376234B (zh) 2014-05-02 2019-11-05 3M创新有限公司 间断的结构化磨料制品以及抛光工件的方法
CN104015123A (zh) * 2014-06-18 2014-09-03 蓝思科技股份有限公司 一种蓝宝石面板的双面抛光工艺
CN108472786B (zh) * 2015-12-30 2021-07-27 3M创新有限公司 磨料制品
CN105666312B (zh) * 2016-01-21 2017-08-01 苏州新美光纳米科技有限公司 晶片快速抛光装置及方法
US10556317B2 (en) * 2016-03-03 2020-02-11 P.R. Hoffman Machine Products Inc. Polishing machine wafer holder
US20170252893A1 (en) * 2016-03-03 2017-09-07 P.R. Hoffman Machine Products Inc. Polishing machine work piece holder
CN106863025A (zh) * 2017-03-28 2017-06-20 江苏吉星新材料有限公司 一种2吋、4吋蓝宝石衬底背面缺陷修复加工方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5859153A (en) 1996-06-21 1999-01-12 Minnesota Mining And Manufacturing Company Novolak compounds useful as adhesion promoters for epoxy resins
US5882245A (en) * 1997-02-28 1999-03-16 Advanced Ceramics Research, Inc. Polymer carrier gears for polishing of flat objects
JP2974007B1 (ja) * 1997-10-20 1999-11-08 新神戸電機株式会社 被研磨物保持材及び被研磨物の製造法
US6419555B1 (en) 1999-06-03 2002-07-16 Brian D. Goers Process and apparatus for polishing a workpiece
US6911512B2 (en) 2003-10-10 2005-06-28 3M Innovative Properties Company Powder coating fluoropolymer compositions with aromatic materials
US20080166952A1 (en) * 2005-02-25 2008-07-10 Shin-Etsu Handotai Co., Ltd Carrier For Double-Side Polishing Apparatus, Double-Side Polishing Apparatus And Double-Side Polishing Method Using The Same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200024272A (ko) * 2017-08-30 2020-03-06 가부시키가이샤 사무코 캐리어의 제조 방법 및 웨이퍼의 연마 방법

Also Published As

Publication number Publication date
WO2010078312A1 (en) 2010-07-08
SG172404A1 (en) 2011-07-28
JP2012513908A (ja) 2012-06-21
US20110256813A1 (en) 2011-10-20
TW201032954A (en) 2010-09-16
EP2379280A1 (en) 2011-10-26
CN102325629A (zh) 2012-01-18

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PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000