SG172404A1 - Coated carrier for lapping and methods of making and using - Google Patents
Coated carrier for lapping and methods of making and using Download PDFInfo
- Publication number
- SG172404A1 SG172404A1 SG2011047115A SG2011047115A SG172404A1 SG 172404 A1 SG172404 A1 SG 172404A1 SG 2011047115 A SG2011047115 A SG 2011047115A SG 2011047115 A SG2011047115 A SG 2011047115A SG 172404 A1 SG172404 A1 SG 172404A1
- Authority
- SG
- Singapore
- Prior art keywords
- carrier
- layer
- polymeric
- primer layer
- lapping
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 60
- 239000010410 layer Substances 0.000 claims abstract description 217
- 239000013047 polymeric layer Substances 0.000 claims abstract description 77
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 42
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 42
- 239000005011 phenolic resin Substances 0.000 claims abstract description 42
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 36
- 239000003822 epoxy resin Substances 0.000 claims abstract description 34
- 229920003986 novolac Polymers 0.000 claims abstract description 31
- 229920001002 functional polymer Polymers 0.000 claims abstract description 28
- 230000001737 promoting effect Effects 0.000 claims abstract description 15
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 53
- 229920000642 polymer Polymers 0.000 claims description 40
- 238000000576 coating method Methods 0.000 claims description 28
- 239000011248 coating agent Substances 0.000 claims description 23
- 239000010432 diamond Substances 0.000 claims description 15
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 229920001187 thermosetting polymer Polymers 0.000 claims description 14
- 229910003460 diamond Inorganic materials 0.000 claims description 13
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 12
- 229930003836 cresol Natural products 0.000 claims description 12
- 229920002635 polyurethane Polymers 0.000 claims description 12
- 239000004814 polyurethane Substances 0.000 claims description 12
- 239000012530 fluid Substances 0.000 claims description 11
- 239000003960 organic solvent Substances 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 10
- 238000005507 spraying Methods 0.000 claims description 10
- 229920001169 thermoplastic Polymers 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 9
- 239000011230 binding agent Substances 0.000 claims description 8
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 8
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 6
- VMKYTRPNOVFCGZ-UHFFFAOYSA-N 2-sulfanylphenol Chemical compound OC1=CC=CC=C1S VMKYTRPNOVFCGZ-UHFFFAOYSA-N 0.000 claims description 5
- 229920006295 polythiol Polymers 0.000 claims description 5
- 229920003987 resole Polymers 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 4
- 239000008188 pellet Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 description 61
- 238000009472 formulation Methods 0.000 description 56
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 54
- 239000007921 spray Substances 0.000 description 49
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 36
- 239000000853 adhesive Substances 0.000 description 29
- 230000001070 adhesive effect Effects 0.000 description 29
- 239000000969 carrier Substances 0.000 description 26
- 238000005498 polishing Methods 0.000 description 23
- 239000011668 ascorbic acid Substances 0.000 description 21
- 238000002156 mixing Methods 0.000 description 21
- 239000000463 material Substances 0.000 description 19
- 235000012431 wafers Nutrition 0.000 description 14
- 230000008569 process Effects 0.000 description 12
- 238000012360 testing method Methods 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 8
- 238000010998 test method Methods 0.000 description 8
- 238000000227 grinding Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 5
- 239000012876 carrier material Substances 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 5
- 230000003750 conditioning effect Effects 0.000 description 5
- 239000004148 curcumin Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 208000036762 Acute promyelocytic leukaemia Diseases 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- 239000008367 deionised water Substances 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 238000002791 soaking Methods 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 230000004075 alteration Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 241000202755 Areca Species 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 229920006311 Urethane elastomer Polymers 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 150000004984 aromatic diamines Chemical class 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 239000012763 reinforcing filler Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- WLNBMPZUVDTASE-HXIISURNSA-N (2r,3r,4s,5r)-2-amino-3,4,5,6-tetrahydroxyhexanal;sulfuric acid Chemical compound [O-]S([O-])(=O)=O.O=C[C@H]([NH3+])[C@@H](O)[C@H](O)[C@H](O)CO.O=C[C@H]([NH3+])[C@@H](O)[C@H](O)[C@H](O)CO WLNBMPZUVDTASE-HXIISURNSA-N 0.000 description 1
- HGXVKAPCSIXGAK-UHFFFAOYSA-N 2,4-diethyl-6-methylbenzene-1,3-diamine;4,6-diethyl-2-methylbenzene-1,3-diamine Chemical group CCC1=CC(CC)=C(N)C(C)=C1N.CCC1=CC(C)=C(N)C(CC)=C1N HGXVKAPCSIXGAK-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical group ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- AOFIWCXMXPVSAZ-UHFFFAOYSA-N 4-methyl-2,6-bis(methylsulfanyl)benzene-1,3-diamine Chemical class CSC1=CC(C)=C(N)C(SC)=C1N AOFIWCXMXPVSAZ-UHFFFAOYSA-N 0.000 description 1
- 208000003343 Antiphospholipid Syndrome Diseases 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- 241000207199 Citrus Species 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- RFAZFSACZIVZDV-UHFFFAOYSA-N butan-2-one Chemical compound CCC(C)=O.CCC(C)=O RFAZFSACZIVZDV-UHFFFAOYSA-N 0.000 description 1
- 238000007385 chemical modification Methods 0.000 description 1
- 235000020971 citrus fruits Nutrition 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- -1 e.g. Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000003847 radiation curing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 239000008149 soap solution Substances 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 238000000527 sonication Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000007592 spray painting technique Methods 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14169608P | 2008-12-31 | 2008-12-31 | |
| PCT/US2009/069672 WO2010078312A1 (en) | 2008-12-31 | 2009-12-29 | Coated carrier for lapping and methods of making and using |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG172404A1 true SG172404A1 (en) | 2011-07-28 |
Family
ID=42104530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2011047115A SG172404A1 (en) | 2008-12-31 | 2009-12-29 | Coated carrier for lapping and methods of making and using |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20110256813A1 (enExample) |
| EP (1) | EP2379280A1 (enExample) |
| JP (1) | JP2012513908A (enExample) |
| KR (1) | KR20110111438A (enExample) |
| CN (1) | CN102325629A (enExample) |
| SG (1) | SG172404A1 (enExample) |
| TW (1) | TW201032954A (enExample) |
| WO (1) | WO2010078312A1 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011003008B4 (de) * | 2011-01-21 | 2018-07-12 | Siltronic Ag | Führungskäfig und Verfahren zur gleichzeitig beidseitigen Material abtragenden Bearbeitung von Halbleiterscheiben |
| US20130017765A1 (en) | 2011-07-11 | 2013-01-17 | 3M Innovative Properties Company | Lapping carrier and method of using the same |
| JP2013094884A (ja) * | 2011-10-31 | 2013-05-20 | Sumitomo Bakelite Co Ltd | 被研磨物保持材、被研磨物保持材の製造方法、および研磨方法 |
| TW201400294A (zh) * | 2012-03-30 | 2014-01-01 | Sumitomo Bakelite Co | 被研磨物保持材及用於此之積層板 |
| WO2013146134A1 (ja) * | 2012-03-30 | 2013-10-03 | コニカミノルタ株式会社 | 情報記録媒体用ガラス基板の製造方法および情報記録媒体 |
| DE102012214998B4 (de) * | 2012-08-23 | 2014-07-24 | Siltronic Ag | Verfahren zum beidseitigen Bearbeiten einer Halbleiterscheibe |
| JP6838811B2 (ja) | 2014-05-02 | 2021-03-03 | スリーエム イノベイティブ プロパティズ カンパニー | 断続的構造化研磨物品並びに被加工物の研磨方法 |
| CN104015123A (zh) * | 2014-06-18 | 2014-09-03 | 蓝思科技股份有限公司 | 一种蓝宝石面板的双面抛光工艺 |
| US10688625B2 (en) * | 2015-12-30 | 2020-06-23 | 3M Innovative Properties Company | Abrasive article |
| CN105666312B (zh) * | 2016-01-21 | 2017-08-01 | 苏州新美光纳米科技有限公司 | 晶片快速抛光装置及方法 |
| US10556317B2 (en) | 2016-03-03 | 2020-02-11 | P.R. Hoffman Machine Products Inc. | Polishing machine wafer holder |
| US20170252893A1 (en) * | 2016-03-03 | 2017-09-07 | P.R. Hoffman Machine Products Inc. | Polishing machine work piece holder |
| CN106863025A (zh) * | 2017-03-28 | 2017-06-20 | 江苏吉星新材料有限公司 | 一种2吋、4吋蓝宝石衬底背面缺陷修复加工方法 |
| JP6743785B2 (ja) * | 2017-08-30 | 2020-08-19 | 株式会社Sumco | キャリアの製造方法およびウェーハの研磨方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5859153A (en) | 1996-06-21 | 1999-01-12 | Minnesota Mining And Manufacturing Company | Novolak compounds useful as adhesion promoters for epoxy resins |
| US5882245A (en) * | 1997-02-28 | 1999-03-16 | Advanced Ceramics Research, Inc. | Polymer carrier gears for polishing of flat objects |
| JP2974007B1 (ja) * | 1997-10-20 | 1999-11-08 | 新神戸電機株式会社 | 被研磨物保持材及び被研磨物の製造法 |
| US6419555B1 (en) | 1999-06-03 | 2002-07-16 | Brian D. Goers | Process and apparatus for polishing a workpiece |
| US6911512B2 (en) | 2003-10-10 | 2005-06-28 | 3M Innovative Properties Company | Powder coating fluoropolymer compositions with aromatic materials |
| US20080166952A1 (en) * | 2005-02-25 | 2008-07-10 | Shin-Etsu Handotai Co., Ltd | Carrier For Double-Side Polishing Apparatus, Double-Side Polishing Apparatus And Double-Side Polishing Method Using The Same |
-
2009
- 2009-12-29 KR KR1020117017691A patent/KR20110111438A/ko not_active Withdrawn
- 2009-12-29 JP JP2011544580A patent/JP2012513908A/ja not_active Withdrawn
- 2009-12-29 SG SG2011047115A patent/SG172404A1/en unknown
- 2009-12-29 CN CN2009801574034A patent/CN102325629A/zh active Pending
- 2009-12-29 WO PCT/US2009/069672 patent/WO2010078312A1/en not_active Ceased
- 2009-12-29 EP EP09804366A patent/EP2379280A1/en not_active Withdrawn
- 2009-12-29 US US13/141,596 patent/US20110256813A1/en not_active Abandoned
- 2009-12-30 TW TW098146127A patent/TW201032954A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20110111438A (ko) | 2011-10-11 |
| JP2012513908A (ja) | 2012-06-21 |
| TW201032954A (en) | 2010-09-16 |
| CN102325629A (zh) | 2012-01-18 |
| EP2379280A1 (en) | 2011-10-26 |
| US20110256813A1 (en) | 2011-10-20 |
| WO2010078312A1 (en) | 2010-07-08 |
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