TW201032954A - Coated carrier for lapping and methods of making and using - Google Patents

Coated carrier for lapping and methods of making and using

Info

Publication number
TW201032954A
TW201032954A TW098146127A TW98146127A TW201032954A TW 201032954 A TW201032954 A TW 201032954A TW 098146127 A TW098146127 A TW 098146127A TW 98146127 A TW98146127 A TW 98146127A TW 201032954 A TW201032954 A TW 201032954A
Authority
TW
Taiwan
Prior art keywords
carrier
layer
making
methods
lapping
Prior art date
Application number
TW098146127A
Other languages
English (en)
Chinese (zh)
Inventor
Timothy Duane Fletcher
Vincent David Romero
Todd Jon Christianson
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW201032954A publication Critical patent/TW201032954A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW098146127A 2008-12-31 2009-12-30 Coated carrier for lapping and methods of making and using TW201032954A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14169608P 2008-12-31 2008-12-31

Publications (1)

Publication Number Publication Date
TW201032954A true TW201032954A (en) 2010-09-16

Family

ID=42104530

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098146127A TW201032954A (en) 2008-12-31 2009-12-30 Coated carrier for lapping and methods of making and using

Country Status (8)

Country Link
US (1) US20110256813A1 (enExample)
EP (1) EP2379280A1 (enExample)
JP (1) JP2012513908A (enExample)
KR (1) KR20110111438A (enExample)
CN (1) CN102325629A (enExample)
SG (1) SG172404A1 (enExample)
TW (1) TW201032954A (enExample)
WO (1) WO2010078312A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011003008B4 (de) * 2011-01-21 2018-07-12 Siltronic Ag Führungskäfig und Verfahren zur gleichzeitig beidseitigen Material abtragenden Bearbeitung von Halbleiterscheiben
US20130017765A1 (en) 2011-07-11 2013-01-17 3M Innovative Properties Company Lapping carrier and method of using the same
JP2013094884A (ja) * 2011-10-31 2013-05-20 Sumitomo Bakelite Co Ltd 被研磨物保持材、被研磨物保持材の製造方法、および研磨方法
TW201400294A (zh) * 2012-03-30 2014-01-01 Sumitomo Bakelite Co 被研磨物保持材及用於此之積層板
WO2013146134A1 (ja) * 2012-03-30 2013-10-03 コニカミノルタ株式会社 情報記録媒体用ガラス基板の製造方法および情報記録媒体
DE102012214998B4 (de) * 2012-08-23 2014-07-24 Siltronic Ag Verfahren zum beidseitigen Bearbeiten einer Halbleiterscheibe
JP6838811B2 (ja) 2014-05-02 2021-03-03 スリーエム イノベイティブ プロパティズ カンパニー 断続的構造化研磨物品並びに被加工物の研磨方法
CN104015123A (zh) * 2014-06-18 2014-09-03 蓝思科技股份有限公司 一种蓝宝石面板的双面抛光工艺
US10688625B2 (en) * 2015-12-30 2020-06-23 3M Innovative Properties Company Abrasive article
CN105666312B (zh) * 2016-01-21 2017-08-01 苏州新美光纳米科技有限公司 晶片快速抛光装置及方法
US10556317B2 (en) 2016-03-03 2020-02-11 P.R. Hoffman Machine Products Inc. Polishing machine wafer holder
US20170252893A1 (en) * 2016-03-03 2017-09-07 P.R. Hoffman Machine Products Inc. Polishing machine work piece holder
CN106863025A (zh) * 2017-03-28 2017-06-20 江苏吉星新材料有限公司 一种2吋、4吋蓝宝石衬底背面缺陷修复加工方法
JP6743785B2 (ja) * 2017-08-30 2020-08-19 株式会社Sumco キャリアの製造方法およびウェーハの研磨方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5859153A (en) 1996-06-21 1999-01-12 Minnesota Mining And Manufacturing Company Novolak compounds useful as adhesion promoters for epoxy resins
US5882245A (en) * 1997-02-28 1999-03-16 Advanced Ceramics Research, Inc. Polymer carrier gears for polishing of flat objects
JP2974007B1 (ja) * 1997-10-20 1999-11-08 新神戸電機株式会社 被研磨物保持材及び被研磨物の製造法
US6419555B1 (en) 1999-06-03 2002-07-16 Brian D. Goers Process and apparatus for polishing a workpiece
US6911512B2 (en) 2003-10-10 2005-06-28 3M Innovative Properties Company Powder coating fluoropolymer compositions with aromatic materials
US20080166952A1 (en) * 2005-02-25 2008-07-10 Shin-Etsu Handotai Co., Ltd Carrier For Double-Side Polishing Apparatus, Double-Side Polishing Apparatus And Double-Side Polishing Method Using The Same

Also Published As

Publication number Publication date
KR20110111438A (ko) 2011-10-11
JP2012513908A (ja) 2012-06-21
SG172404A1 (en) 2011-07-28
CN102325629A (zh) 2012-01-18
EP2379280A1 (en) 2011-10-26
US20110256813A1 (en) 2011-10-20
WO2010078312A1 (en) 2010-07-08

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