SG170099A1 - Integrated circuit package system with warp-free chip - Google Patents

Integrated circuit package system with warp-free chip

Info

Publication number
SG170099A1
SG170099A1 SG201101734-0A SG2011017340A SG170099A1 SG 170099 A1 SG170099 A1 SG 170099A1 SG 2011017340 A SG2011017340 A SG 2011017340A SG 170099 A1 SG170099 A1 SG 170099A1
Authority
SG
Singapore
Prior art keywords
integrated circuit
circuit package
package system
warp
free chip
Prior art date
Application number
SG201101734-0A
Other languages
English (en)
Inventor
Byung Tai Do
Il Kwon Shim
B Dimaano Antonio Jr
Heap Hoe Kuan
Original Assignee
Stats Chippac Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stats Chippac Ltd filed Critical Stats Chippac Ltd
Publication of SG170099A1 publication Critical patent/SG170099A1/en

Links

Classifications

    • H—ELECTRICITY
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    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/4951—Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)
SG201101734-0A 2007-09-20 2008-09-11 Integrated circuit package system with warp-free chip SG170099A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/858,554 US7892894B2 (en) 2007-09-20 2007-09-20 Method of manufacturing integrated circuit package system with warp-free chip

Publications (1)

Publication Number Publication Date
SG170099A1 true SG170099A1 (en) 2011-04-29

Family

ID=40470749

Family Applications (2)

Application Number Title Priority Date Filing Date
SG200806703-5A SG151203A1 (en) 2007-09-20 2008-09-11 Integrated circuit package system with warp-free chip
SG201101734-0A SG170099A1 (en) 2007-09-20 2008-09-11 Integrated circuit package system with warp-free chip

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG200806703-5A SG151203A1 (en) 2007-09-20 2008-09-11 Integrated circuit package system with warp-free chip

Country Status (4)

Country Link
US (2) US7892894B2 (zh)
KR (1) KR20090031315A (zh)
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US8421197B2 (en) 2013-04-16
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