SG168493A1 - Adsorbing apparatus - Google Patents
Adsorbing apparatusInfo
- Publication number
- SG168493A1 SG168493A1 SG201005261-1A SG2010052611A SG168493A1 SG 168493 A1 SG168493 A1 SG 168493A1 SG 2010052611 A SG2010052611 A SG 2010052611A SG 168493 A1 SG168493 A1 SG 168493A1
- Authority
- SG
- Singapore
- Prior art keywords
- elastic
- adsorbing
- adsorption
- holder
- adsorbing member
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
- Dicing (AREA)
- Manipulator (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009181603A JP4397967B1 (ja) | 2009-08-04 | 2009-08-04 | 吸着装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG168493A1 true SG168493A1 (en) | 2011-02-28 |
Family
ID=41591579
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG201005261-1A SG168493A1 (en) | 2009-08-04 | 2010-07-20 | Adsorbing apparatus |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4397967B1 (ja) |
KR (1) | KR101597644B1 (ja) |
SG (1) | SG168493A1 (ja) |
TW (1) | TWI474419B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103213840A (zh) * | 2013-04-01 | 2013-07-24 | 上海功源电子科技有限公司 | 自动分料机 |
KR101731932B1 (ko) | 2017-01-18 | 2017-05-02 | 주식회사 대한테크 | 반도체 칩 픽업용 콜렛 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69333322T2 (de) * | 1992-09-24 | 2004-09-30 | Ebara Corp. | Poliergerät |
JPH07335720A (ja) * | 1994-06-10 | 1995-12-22 | Toshiba Corp | 半導体チップ取上装置およびその取上方法 |
JP2002066972A (ja) | 2000-09-01 | 2002-03-05 | Koganei Corp | 吸着装置 |
JP3848606B2 (ja) | 2002-08-26 | 2006-11-22 | 日東電工株式会社 | コレットおよびそれを用いてチップ部品をピックアップする方法 |
JP4298640B2 (ja) | 2004-12-06 | 2009-07-22 | キヤノンマシナリー株式会社 | ダイボンダー用コレット |
-
2009
- 2009-08-04 JP JP2009181603A patent/JP4397967B1/ja active Active
- 2009-11-16 KR KR1020090110317A patent/KR101597644B1/ko active IP Right Grant
- 2009-12-23 TW TW98144521A patent/TWI474419B/zh active
-
2010
- 2010-07-20 SG SG201005261-1A patent/SG168493A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2011035261A (ja) | 2011-02-17 |
KR20110014066A (ko) | 2011-02-10 |
JP4397967B1 (ja) | 2010-01-13 |
KR101597644B1 (ko) | 2016-02-25 |
TW201105559A (en) | 2011-02-16 |
TWI474419B (zh) | 2015-02-21 |
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