SG168493A1 - Adsorbing apparatus - Google Patents

Adsorbing apparatus

Info

Publication number
SG168493A1
SG168493A1 SG201005261-1A SG2010052611A SG168493A1 SG 168493 A1 SG168493 A1 SG 168493A1 SG 2010052611 A SG2010052611 A SG 2010052611A SG 168493 A1 SG168493 A1 SG 168493A1
Authority
SG
Singapore
Prior art keywords
elastic
adsorbing
adsorption
holder
adsorbing member
Prior art date
Application number
SG201005261-1A
Inventor
Akira Nakatsu
Original Assignee
Canon Machinery Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Machinery Inc filed Critical Canon Machinery Inc
Publication of SG168493A1 publication Critical patent/SG168493A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
  • Manipulator (AREA)
  • Dicing (AREA)

Abstract

To provide an adsorbing apparatus capable of easily adsorbing an object to be adsorbed at the time of adsorption, applying stable bonding force to the object to be adsorbed at the time of bonding, and easily connecting an elastic adsorbing member and a holder to each other. The adsorbing apparatus includes: an elastic adsorbing member (2) which has a flat adsorption surface (10) in which a vacuum suction port (12) is formed, the elastic adsorbing member having a uniform thickness; and a holder (1) for holding an upper surface of the elastic adsorbing member (2) from a side of a reverse adsorption-surface. The holder (1) includes a pin member (7) protruding from a flat surface to a side of the adsorption surface, the flat surface coming into contact with the reverse adsorption-surface of the elastic adsorbing member (2), and the pin member (7) is inserted into the elastic adsorbing member (2), to thereby connect the elastic adsorbing member (2) and the holder (1) to each other.
SG201005261-1A 2009-08-04 2010-07-20 Adsorbing apparatus SG168493A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009181603A JP4397967B1 (en) 2009-08-04 2009-08-04 Adsorption device

Publications (1)

Publication Number Publication Date
SG168493A1 true SG168493A1 (en) 2011-02-28

Family

ID=41591579

Family Applications (1)

Application Number Title Priority Date Filing Date
SG201005261-1A SG168493A1 (en) 2009-08-04 2010-07-20 Adsorbing apparatus

Country Status (4)

Country Link
JP (1) JP4397967B1 (en)
KR (1) KR101597644B1 (en)
SG (1) SG168493A1 (en)
TW (1) TWI474419B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103213840A (en) * 2013-04-01 2013-07-24 上海功源电子科技有限公司 Automatic material separating machine
KR101731932B1 (en) 2017-01-18 2017-05-02 주식회사 대한테크 Collet for semiconductor chip pickup

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69325756T2 (en) * 1992-09-24 2000-03-02 Ebara Corp., Tokio/Tokyo Polisher
JPH07335720A (en) * 1994-06-10 1995-12-22 Toshiba Corp Semiconductor chip take-up device and its take-up method
JP2002066972A (en) * 2000-09-01 2002-03-05 Koganei Corp Suction device
JP3848606B2 (en) * 2002-08-26 2006-11-22 日東電工株式会社 Collet and method for picking up chip parts using the same
JP4298640B2 (en) * 2004-12-06 2009-07-22 キヤノンマシナリー株式会社 Collet for die bonder

Also Published As

Publication number Publication date
JP4397967B1 (en) 2010-01-13
KR101597644B1 (en) 2016-02-25
TW201105559A (en) 2011-02-16
JP2011035261A (en) 2011-02-17
TWI474419B (en) 2015-02-21
KR20110014066A (en) 2011-02-10

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