SG168488A1 - Position calibration of alignment heads in a multi-head alignment system - Google Patents
Position calibration of alignment heads in a multi-head alignment systemInfo
- Publication number
- SG168488A1 SG168488A1 SG201005142-3A SG2010051423A SG168488A1 SG 168488 A1 SG168488 A1 SG 168488A1 SG 2010051423 A SG2010051423 A SG 2010051423A SG 168488 A1 SG168488 A1 SG 168488A1
- Authority
- SG
- Singapore
- Prior art keywords
- alignment
- head
- heads
- position calibration
- wafer
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7007—Alignment other than original with workpiece
- G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7019—Calibration
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US22610209P | 2009-07-16 | 2009-07-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG168488A1 true SG168488A1 (en) | 2011-02-28 |
Family
ID=42712749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG201005142-3A SG168488A1 (en) | 2009-07-16 | 2010-07-15 | Position calibration of alignment heads in a multi-head alignment system |
Country Status (7)
Country | Link |
---|---|
US (1) | US20110013165A1 (de) |
EP (1) | EP2275871B1 (de) |
JP (1) | JP5215357B2 (de) |
KR (1) | KR101196360B1 (de) |
CN (1) | CN101957567B (de) |
SG (1) | SG168488A1 (de) |
TW (1) | TW201118513A (de) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012204695A (ja) * | 2011-03-25 | 2012-10-22 | Tokyo Electron Ltd | プローブカード検出装置、ウエハの位置合わせ装置及びウエハの位置合わせ方法 |
KR101764169B1 (ko) * | 2011-08-19 | 2017-08-02 | 삼성전자 주식회사 | 마스크리스 노광 장치와 이를 이용한 빔 위치 계측 방법 |
US9360778B2 (en) * | 2012-03-02 | 2016-06-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and method for lithography patterning |
US9606442B2 (en) | 2012-07-30 | 2017-03-28 | Asml Netherlands B.V. | Position measuring apparatus, position measuring method, lithographic apparatus and device manufacturing method |
TWI490077B (zh) * | 2012-11-30 | 2015-07-01 | Ind Tech Res Inst | 校準裝置及多軸機械之補償方法 |
JP6102230B2 (ja) * | 2012-12-07 | 2017-03-29 | 株式会社ニコン | 露光装置及び露光方法、並びにデバイス製造方法 |
CN103969967B (zh) * | 2013-02-01 | 2016-08-24 | 上海微电子装备有限公司 | 用于硅片对准级间串绕测试和拟合的信号处理方法 |
CN104460234B (zh) * | 2013-09-18 | 2017-01-18 | 上海微电子装备有限公司 | 多传感器对准系统中离焦倾斜校准与补偿方法及系统 |
JP5720028B1 (ja) | 2013-10-03 | 2015-05-20 | 株式会社 システムスクエア | 包装体の検査装置 |
NL2014941A (en) | 2014-07-16 | 2016-04-12 | Asml Netherlands Bv | Lithographic apparatus, device manufacturing method and associated data processing apparatus and computer program product. |
CN104714375B (zh) * | 2015-04-02 | 2017-09-29 | 安徽三安光电有限公司 | 一种晶片曝光设备及其曝光方法 |
US10718606B2 (en) * | 2015-04-17 | 2020-07-21 | Nikon Corporation | Determination of customized components for fitting wafer profile |
CN106483778B (zh) | 2015-08-31 | 2018-03-30 | 上海微电子装备(集团)股份有限公司 | 基于相对位置测量的对准系统、双工件台系统及测量系统 |
US10101676B2 (en) * | 2015-09-23 | 2018-10-16 | KLA—Tencor Corporation | Spectroscopic beam profile overlay metrology |
JP6671160B2 (ja) | 2015-11-30 | 2020-03-25 | キヤノン株式会社 | インプリント装置、物品製造方法および位置合わせ方法 |
KR20170131802A (ko) * | 2016-05-20 | 2017-11-30 | 삼성디스플레이 주식회사 | 표시 장치, 이의 구동 방법 및 이의 제조 방법 |
EP3324210B1 (de) * | 2016-11-18 | 2020-07-29 | Outsight | Selbstkalibrierendes sensorsystem für ein radfahrzeug |
JP6981170B2 (ja) * | 2017-10-20 | 2021-12-15 | 株式会社ニューフレアテクノロジー | 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法 |
TWI684823B (zh) * | 2018-10-01 | 2020-02-11 | 王楨坤 | 微影影像量測處理方法及系統 |
US10599055B1 (en) * | 2018-11-15 | 2020-03-24 | Applied Materials, Inc. | Self aligning systems and methods for lithography systems |
WO2021083704A1 (en) | 2019-11-01 | 2021-05-06 | Asml Netherlands B.V. | Metrology method and lithographic apparatuses |
CN111515080B (zh) * | 2020-04-09 | 2021-04-13 | 深圳市运泰利自动化设备有限公司 | 一种双点胶针管同时校准补偿的方法 |
CN113625532B (zh) * | 2020-05-08 | 2022-10-25 | 上海微电子装备(集团)股份有限公司 | 基底标记位置检测方法及装置 |
CN117280281A (zh) * | 2021-05-04 | 2023-12-22 | Asml荷兰有限公司 | 量测装置和光刻装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3513031B2 (ja) * | 1998-10-09 | 2004-03-31 | 株式会社東芝 | アライメント装置の調整方法、収差測定方法及び収差測定マーク |
KR100464854B1 (ko) * | 2002-06-26 | 2005-01-06 | 삼성전자주식회사 | 반도체 기판의 정렬 방법 및 정렬 장치 |
US6950188B2 (en) * | 2003-04-23 | 2005-09-27 | International Business Machines Corporation | Wafer alignment system using parallel imaging detection |
EP1477861A1 (de) * | 2003-05-16 | 2004-11-17 | ASML Netherlands B.V. | Verfahren zur Eichung eines lithographischen Geräts, Ausrichtverfahren, Komputerprogramm, lithographisches Gerät und Verfahren zur Herstellung einer Vorrichtung |
JP2007184342A (ja) * | 2006-01-05 | 2007-07-19 | Nikon Corp | 露光システム、露光方法、及びデバイス製造方法 |
EP2541325B1 (de) * | 2006-02-21 | 2018-02-21 | Nikon Corporation | Belichtungsvorrichtung und Belichtungsverfahren |
EP3270226A1 (de) | 2006-02-21 | 2018-01-17 | Nikon Corporation | Belichtungsvorrichtung, belichtungsverfahren und verfahren zur herstellung einer vorrichtung |
JP2009054736A (ja) * | 2007-08-24 | 2009-03-12 | Nikon Corp | マーク検出方法及び装置、位置制御方法及び装置、露光方法及び装置、並びにデバイス製造方法 |
-
2010
- 2010-07-15 EP EP10169673.0A patent/EP2275871B1/de active Active
- 2010-07-15 JP JP2010160451A patent/JP5215357B2/ja active Active
- 2010-07-15 SG SG201005142-3A patent/SG168488A1/en unknown
- 2010-07-16 CN CN2010102336343A patent/CN101957567B/zh active Active
- 2010-07-16 KR KR1020100069248A patent/KR101196360B1/ko active IP Right Grant
- 2010-07-16 TW TW099123551A patent/TW201118513A/zh unknown
- 2010-07-16 US US12/838,218 patent/US20110013165A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP2275871B1 (de) | 2018-06-27 |
CN101957567B (zh) | 2013-05-15 |
TW201118513A (en) | 2011-06-01 |
US20110013165A1 (en) | 2011-01-20 |
JP5215357B2 (ja) | 2013-06-19 |
EP2275871A2 (de) | 2011-01-19 |
KR20110007594A (ko) | 2011-01-24 |
KR101196360B1 (ko) | 2012-11-01 |
EP2275871A3 (de) | 2014-07-23 |
CN101957567A (zh) | 2011-01-26 |
JP2011023725A (ja) | 2011-02-03 |
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