SG11201902847PA - Optical measurement device and method - Google Patents

Optical measurement device and method

Info

Publication number
SG11201902847PA
SG11201902847PA SG11201902847PA SG11201902847PA SG11201902847PA SG 11201902847P A SG11201902847P A SG 11201902847PA SG 11201902847P A SG11201902847P A SG 11201902847PA SG 11201902847P A SG11201902847P A SG 11201902847PA SG 11201902847P A SG11201902847P A SG 11201902847PA
Authority
SG
Singapore
Prior art keywords
measurement device
frame
optical measurement
optical
deformation
Prior art date
Application number
SG11201902847PA
Inventor
Zhiyong Yang
Bing Xu
Yuzhi Li
Chang Zhou
Original Assignee
Shanghai Micro Electronics Equipment Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Micro Electronics Equipment Group Co Ltd filed Critical Shanghai Micro Electronics Equipment Group Co Ltd
Publication of SG11201902847PA publication Critical patent/SG11201902847PA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02015—Interferometers characterised by the beam path configuration
    • G01B9/02017—Interferometers characterised by the beam path configuration with multiple interactions between the target object and light beams, e.g. beam reflections occurring from different locations
    • G01B9/02019—Interferometers characterised by the beam path configuration with multiple interactions between the target object and light beams, e.g. beam reflections occurring from different locations contacting different points on same face of object
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
    • G01B11/161—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge by interferometric means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography

Abstract

TITLE: OPTICAL MEASUREMENT DEVICE AND METHOD Provided is an optical measurement device, comprising a frame measurement unit capable of measuring the amount of deformation of an optical detection stage frame (), and a correction module for correcting the position of a substrate stage (6) and/or the position of an optical detection unit (5) according to the amount of deformation of the optical detection stage frame (2), so as to solve the problem of an error of measurement of a mark position caused by frame deformation. Also provided is an optical measurement method. Figure 1. 19
SG11201902847PA 2016-09-30 2017-09-25 Optical measurement device and method SG11201902847PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610876758.0A CN107883887B (en) 2016-09-30 2016-09-30 A kind of optical measuring device and method
PCT/CN2017/103233 WO2018059359A1 (en) 2016-09-30 2017-09-25 Optical measurement device and method

Publications (1)

Publication Number Publication Date
SG11201902847PA true SG11201902847PA (en) 2019-05-30

Family

ID=61762535

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201902847PA SG11201902847PA (en) 2016-09-30 2017-09-25 Optical measurement device and method

Country Status (7)

Country Link
US (1) US10921719B2 (en)
JP (1) JP6794536B2 (en)
KR (1) KR102214364B1 (en)
CN (1) CN107883887B (en)
SG (1) SG11201902847PA (en)
TW (1) TWI652551B (en)
WO (1) WO2018059359A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111750774B (en) * 2019-03-29 2021-09-24 上海微电子装备（集团）股份有限公司 Optical measuring device and method
CN112113509B (en) * 2019-06-20 2022-06-17 上海微电子装备（集团）股份有限公司 Gantry type measuring device and gantry type measuring method
CN111288913B (en) * 2020-03-26 2022-01-04 西北核技术研究院 Non-contact measurement method and system for deformation of double-layer cylinder under internal explosion effect
CN115854888B (en) * 2023-03-01 2023-05-05 季华实验室 Ranging mechanism, ranging method and related equipment

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3984841B2 (en) 2002-03-07 2007-10-03 キヤノン株式会社 Distortion measuring apparatus, distortion suppressing apparatus, exposure apparatus, and device manufacturing method
JP2004111653A (en) 2002-09-18 2004-04-08 Canon Inc Positioning device, exposure device applying the locating device thereto and manufacturing method of semiconductor device
JP4432037B2 (en) 2004-04-07 2010-03-17 株式会社オーク製作所 Exposure system with data correction function
TWI600979B (en) * 2006-09-01 2017-10-01 Nippon Kogaku Kk Moving body driving method and moving body driving system, pattern forming method and apparatus, exposure method and apparatus, and device manufacturing method
US7710540B2 (en) 2007-04-05 2010-05-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TWM360360U (en) 2009-02-02 2009-07-01 Unice E O Services Inc Optical measurement device with anti-shock structure
US8514395B2 (en) * 2009-08-25 2013-08-20 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
NL2007155A (en) * 2010-08-25 2012-02-28 Asml Netherlands Bv Stage apparatus, lithographic apparatus and method of positioning an object table.
JP5335761B2 (en) 2010-12-13 2013-11-06 株式会社オーク製作所 Exposure equipment
JP5717431B2 (en) * 2010-12-14 2015-05-13 キヤノン株式会社 Stage apparatus, exposure apparatus, and device manufacturing method
JP2014048182A (en) * 2012-08-31 2014-03-17 Sharp Corp Film thickness measuring device
JP2014225428A (en) * 2013-04-24 2014-12-04 キヤノン株式会社 Charged particle beam irradiation apparatus, method for irradiation of charged particle beam, and method for manufacturing article
EP3096346A4 (en) * 2014-01-16 2017-09-27 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
CN105527796B (en) 2014-09-28 2018-03-13 上海微电子装备（集团）股份有限公司 Planer-type equipment and control method
JP2016133349A (en) 2015-01-16 2016-07-25 株式会社東芝 Thickness measurement method and thickness measurement device

Also Published As

Publication number Publication date
TWI652551B (en) 2019-03-01
US10921719B2 (en) 2021-02-16
TW201826039A (en) 2018-07-16
US20190235396A1 (en) 2019-08-01
JP6794536B2 (en) 2020-12-02
WO2018059359A1 (en) 2018-04-05
CN107883887B (en) 2019-11-26
KR20190054164A (en) 2019-05-21
KR102214364B1 (en) 2021-02-09
JP2019529929A (en) 2019-10-17
CN107883887A (en) 2018-04-06

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