SG155856A1 - Method for coarse wafer alignment in a lithographic apparatus - Google Patents

Method for coarse wafer alignment in a lithographic apparatus

Info

Publication number
SG155856A1
SG155856A1 SG200901815-1A SG2009018151A SG155856A1 SG 155856 A1 SG155856 A1 SG 155856A1 SG 2009018151 A SG2009018151 A SG 2009018151A SG 155856 A1 SG155856 A1 SG 155856A1
Authority
SG
Singapore
Prior art keywords
mark
scan path
periodic structure
lithographic apparatus
wafer alignment
Prior art date
Application number
SG200901815-1A
Other languages
English (en)
Inventor
Patrick Warnaar
Franciscus Godefridus Casper Bijnen
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of SG155856A1 publication Critical patent/SG155856A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7069—Alignment mark illumination, e.g. darkfield, dual focus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049—Technique, e.g. interferometric
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG200901815-1A 2008-03-21 2009-03-10 Method for coarse wafer alignment in a lithographic apparatus SG155856A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US6471908P 2008-03-21 2008-03-21

Publications (1)

Publication Number Publication Date
SG155856A1 true SG155856A1 (en) 2009-10-29

Family

ID=40637047

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200901815-1A SG155856A1 (en) 2008-03-21 2009-03-10 Method for coarse wafer alignment in a lithographic apparatus

Country Status (7)

Country Link
US (2) US8130366B2 (zh)
EP (1) EP2103995A3 (zh)
JP (1) JP2009231837A (zh)
KR (1) KR20090101123A (zh)
CN (1) CN101539725B (zh)
SG (1) SG155856A1 (zh)
TW (1) TW201001100A (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2699967B1 (en) * 2011-04-22 2023-09-13 ASML Netherlands B.V. Position determination in a lithography system using a substrate having a partially reflective position mark
WO2012144905A2 (en) 2011-04-22 2012-10-26 Mapper Lithography Ip B.V. Lithography system for processing a target, such as a wafer, and a method for operating a lithography system for processing a target, such as a wafer
US9383662B2 (en) 2011-05-13 2016-07-05 Mapper Lithography Ip B.V. Lithography system for processing at least a part of a target
US9484188B2 (en) 2015-03-11 2016-11-01 Mapper Lithography Ip B.V. Individual beam pattern placement verification in multiple beam lithography
US10678150B1 (en) 2018-11-15 2020-06-09 Applied Materials, Inc. Dynamic generation of layout adaptive packaging
JP2021149000A (ja) * 2020-03-19 2021-09-27 キオクシア株式会社 露光方法、露光装置、及び半導体装置の製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5719726A (en) * 1980-07-10 1982-02-02 Nippon Kogaku Kk <Nikon> Positioning device
JPH07119570B2 (ja) * 1988-05-27 1995-12-20 株式会社ニコン アライメント方法
JPH03241816A (ja) * 1990-02-20 1991-10-29 Nec Kansai Ltd ウェーハアライメント方法
JPH0845814A (ja) * 1994-07-27 1996-02-16 Nikon Corp 露光装置および位置決め方法
JPH10172890A (ja) * 1996-12-12 1998-06-26 Nikon Corp 投影露光方法
JP3907940B2 (ja) * 2000-12-04 2007-04-18 Ｎｅｃエレクトロニクス株式会社 露光方法
EP1372040B1 (en) 2002-06-11 2008-03-05 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US20060061743A1 (en) 2004-09-22 2006-03-23 Asml Netherlands B.V. Lithographic apparatus, alignment system, and device manufacturing method
CN100485527C (zh) * 2005-04-21 2009-05-06 中国科学院上海光学精密机械研究所 光刻机成像质量的检测方法
US7737566B2 (en) * 2005-06-01 2010-06-15 Asml Netherlands B.V. Alignment devices and methods for providing phase depth control
JP2007208081A (ja) * 2006-02-02 2007-08-16 Oki Electric Ind Co Ltd アラインメントマーク、合わせマーク及び半導体装置の製造方法
US7486408B2 (en) * 2006-03-21 2009-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method with reduced scribe lane usage for substrate measurement
US7898662B2 (en) * 2006-06-20 2011-03-01 Asml Netherlands B.V. Method and apparatus for angular-resolved spectroscopic lithography characterization
JP4965203B2 (ja) * 2006-09-11 2012-07-04 株式会社リコー 遅延時間生成回路、それを用いた二次電池保護用半導体装置、バッテリパックおよび電子機器
CN100456142C (zh) * 2006-10-18 2009-01-28 上海微电子装备有限公司 一种对准标记及其制造方法

Also Published As

Publication number Publication date
CN101539725B (zh) 2011-04-13
KR20090101123A (ko) 2009-09-24
EP2103995A3 (en) 2012-02-29
TW201001100A (en) 2010-01-01
JP2009231837A (ja) 2009-10-08
CN101539725A (zh) 2009-09-23
US20120127452A1 (en) 2012-05-24
US20090237637A1 (en) 2009-09-24
EP2103995A2 (en) 2009-09-23
US8130366B2 (en) 2012-03-06

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