SG147432A1 - Novel photosensitive resin compositions - Google Patents

Novel photosensitive resin compositions

Info

Publication number
SG147432A1
SG147432A1 SG200807601-0A SG2008076010A SG147432A1 SG 147432 A1 SG147432 A1 SG 147432A1 SG 2008076010 A SG2008076010 A SG 2008076010A SG 147432 A1 SG147432 A1 SG 147432A1
Authority
SG
Singapore
Prior art keywords
photosensitive resin
resin compositions
compound
novel photosensitive
naphthoquinone diazide
Prior art date
Application number
SG200807601-0A
Other languages
English (en)
Inventor
Ahmad A Naiini
Richard Hopla
David B Powell
Jon Metivier
Ilaeya Rushkin
Original Assignee
Fujifilm Electronic Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Electronic Materials filed Critical Fujifilm Electronic Materials
Publication of SG147432A1 publication Critical patent/SG147432A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
SG200807601-0A 2003-10-15 2004-10-15 Novel photosensitive resin compositions SG147432A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US51119803P 2003-10-15 2003-10-15

Publications (1)

Publication Number Publication Date
SG147432A1 true SG147432A1 (en) 2008-11-28

Family

ID=34465196

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200807601-0A SG147432A1 (en) 2003-10-15 2004-10-15 Novel photosensitive resin compositions

Country Status (7)

Country Link
US (2) US7416830B2 (ko)
EP (1) EP1680711A4 (ko)
JP (1) JP4522412B2 (ko)
KR (1) KR20070007026A (ko)
SG (1) SG147432A1 (ko)
TW (1) TWI363249B (ko)
WO (1) WO2005038524A2 (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI402616B (zh) * 2005-06-03 2013-07-21 Fujifilm Electronic Materials 新穎的光敏性樹脂組成物
US7803510B2 (en) * 2005-08-17 2010-09-28 Fujifilm Electronic Materials U.S.A., Inc. Positive photosensitive polybenzoxazole precursor compositions
EP2110708B1 (en) * 2007-02-13 2012-12-05 Toray Industries, Inc. Positive-type photosensitive resin composition
US20090111050A1 (en) * 2007-10-16 2009-04-30 Naiini Ahmad A Novel Photosensitive Resin Compositions
KR100932765B1 (ko) * 2008-02-28 2009-12-21 한양대학교 산학협력단 폴리이미드-폴리벤조옥사졸 공중합체, 이의 제조방법, 및이를 포함하는 기체 분리막
CA2640517A1 (en) * 2008-05-19 2009-11-19 Industry-University Cooperation Foundation, Hanyang University Polyamic acids dope composition, preparation method of hollow fiber using the same and hollow fiber prepared therefrom
KR101023089B1 (ko) 2008-09-29 2011-03-24 제일모직주식회사 포지티브형 감광성 수지 조성물
US8013103B2 (en) * 2008-10-10 2011-09-06 Industry-University Cooperation Foundation, Hanyang University Polymer compounds and a preparation method thereof
US8487064B2 (en) 2008-10-10 2013-07-16 Industry-University Cooperation Foundation, Hanyang University Polymer compounds and a preparation method thereof
KR101233382B1 (ko) * 2008-11-17 2013-02-14 제일모직주식회사 포지티브형 감광성 수지 조성물
JP5515419B2 (ja) * 2009-05-26 2014-06-11 日立化成デュポンマイクロシステムズ株式会社 ポジ型感光性樹脂組成物、該樹脂組成物を用いたパターン硬化膜の製造方法並びに電子部品及びその製造方法
JP2011053458A (ja) * 2009-09-02 2011-03-17 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、該樹脂組成物を用いたパターン硬化膜の製造方法及び電子部品
KR101005818B1 (ko) * 2009-12-10 2011-01-05 신미영 주방용기의 연결구조
KR101333704B1 (ko) * 2009-12-29 2013-11-27 제일모직주식회사 포지티브형 감광성 수지 조성물
KR101400192B1 (ko) 2010-12-31 2014-05-27 제일모직 주식회사 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자
JP5488752B1 (ja) * 2013-09-03 2014-05-14 住友ベークライト株式会社 感光性樹脂材料および樹脂膜

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2931297A1 (de) 1979-08-01 1981-02-19 Siemens Ag Waermebestaendige positivresists und verfahren zur herstellung waermebestaendiger reliefstrukturen
DE3021748A1 (de) 1980-06-10 1981-12-17 Siemens AG, 1000 Berlin und 8000 München Strahlungsreaktive vorstufen hochwaermebestaendiger polymerer
DE3411659A1 (de) 1984-03-29 1985-10-03 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von polyoxazol- und polythiazol-vorstufen
US4818658A (en) 1987-04-17 1989-04-04 Shipley Company Inc. Photoactive esterification product of a diazooxide compound and a curcumin dye and photoresist materials with product
EP0391196A3 (de) 1989-04-06 1991-02-27 Siemens Aktiengesellschaft Herstellung von Hydroxypolyamiden
DD289265A5 (de) 1989-11-30 1991-04-25 Veb Fotochemische Werke Berlin,De Verfahren zur selektiven herstellung von definierten mit 1,2-naphthochinon-2-diazid-4-sulfonsaeure und 1,2-naphthochinon-2-diazid-5-sulfonsaeure gemischt veresterten trihydroxy-alkoxycarbonyl-benzenen
DE69131529T2 (de) * 1990-05-29 2000-01-20 Sumitomo Bakelite Co. Ltd., Tokio/Tokyo Positiv arbeitende lichtempfindliche Harzzusammensetzung
US5362599A (en) * 1991-11-14 1994-11-08 International Business Machines Corporations Fast diazoquinone positive resists comprising mixed esters of 4-sulfonate and 5-sulfonate compounds
US5612164A (en) * 1995-02-09 1997-03-18 Hoechst Celanese Corporation Positive photoresist composition comprising a mixed ester of trishydroxyphenyl ethane and a mixed ester of trihydroxybenzophenone
JP3449926B2 (ja) * 1997-09-02 2003-09-22 住友ベークライト株式会社 ポジ型感光性樹脂組成物
US6177225B1 (en) * 1998-10-01 2001-01-23 Arch Specialty Chemicals, Inc. Photosensitive resin compositions
US6127086A (en) * 1998-10-01 2000-10-03 Arch Specialty Chemicals, Inc. Photosensitive resin compositions
JP4068253B2 (ja) * 1999-01-27 2008-03-26 Ａｚエレクトロニックマテリアルズ株式会社 ポジ型感光性樹脂組成物
ATE366952T1 (de) 1999-06-01 2007-08-15 Toray Industries Positiv arbeitende lichtempfindliche polyimidvorstufen-zusammensetzung
JP4665333B2 (ja) * 2000-11-27 2011-04-06 東レ株式会社 ポジ型感光性樹脂前駆体組成物
WO2004081663A2 (en) 2003-03-11 2004-09-23 Arch Specialty Chemicals, Inc. Novel photosensitive resin compositions
EP1611483A4 (en) * 2003-03-11 2009-12-16 Fujifilm Electronic Materials NEW PHOTOSENSITIVE RESIN COMPOSITIONS
JP2007525545A (ja) * 2003-03-11 2007-09-06 フジフィルム・エレクトロニック・マテリアルズ・ユーエスエイ・インコーポレイテッド 新規な感光性樹脂組成物

Also Published As

Publication number Publication date
JP4522412B2 (ja) 2010-08-11
TWI363249B (en) 2012-05-01
WO2005038524A3 (en) 2006-06-22
TW200527134A (en) 2005-08-16
EP1680711A2 (en) 2006-07-19
US20050181297A1 (en) 2005-08-18
EP1680711A4 (en) 2010-04-07
KR20070007026A (ko) 2007-01-12
WO2005038524A2 (en) 2005-04-28
US7416830B2 (en) 2008-08-26
US20090004444A1 (en) 2009-01-01
JP2007509371A (ja) 2007-04-12
US20060063095A9 (en) 2006-03-23

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