SG146541A1 - Lithographic apparatus and method - Google Patents
Lithographic apparatus and methodInfo
- Publication number
- SG146541A1 SG146541A1 SG200801816-0A SG2008018160A SG146541A1 SG 146541 A1 SG146541 A1 SG 146541A1 SG 2008018160 A SG2008018160 A SG 2008018160A SG 146541 A1 SG146541 A1 SG 146541A1
- Authority
- SG
- Singapore
- Prior art keywords
- substrate
- lithographic apparatus
- radiation
- constructed
- patterning device
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 5
- 230000005855 radiation Effects 0.000 abstract 3
- 238000000059 patterning Methods 0.000 abstract 2
- 230000003750 conditioning effect Effects 0.000 abstract 1
- 238000005286 illumination Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Epidemiology (AREA)
- Environmental & Geological Engineering (AREA)
- Toxicology (AREA)
- Public Health (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Electron Beam Exposure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/716,670 US8760621B2 (en) | 2007-03-12 | 2007-03-12 | Lithographic apparatus and method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG146541A1 true SG146541A1 (en) | 2008-10-30 |
Family
ID=39590611
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200801816-0A SG146541A1 (en) | 2007-03-12 | 2008-03-04 | Lithographic apparatus and method |
Country Status (7)
Country | Link |
---|---|
US (1) | US8760621B2 (ko) |
EP (1) | EP1970764A3 (ko) |
JP (1) | JP4700076B2 (ko) |
KR (1) | KR100952445B1 (ko) |
CN (1) | CN101266412B (ko) |
SG (1) | SG146541A1 (ko) |
TW (1) | TWI470362B (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL2003470A (en) * | 2008-10-07 | 2010-04-08 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
NL2007834A (en) | 2010-12-23 | 2012-06-27 | Asml Netherlands Bv | Lithographic apparatus and removable member. |
EP2515170B1 (en) * | 2011-04-20 | 2020-02-19 | ASML Netherlands BV | Thermal conditioning system for thermal conditioning a part of a lithographic apparatus and a thermal conditioning method |
CN104281019B (zh) * | 2013-07-08 | 2016-02-17 | 中芯国际集成电路制造(上海)有限公司 | 光刻的迭对值校准方法 |
US11222783B2 (en) * | 2017-09-19 | 2022-01-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Using cumulative heat amount data to qualify hot plate used for postexposure baking |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03102850A (ja) * | 1989-09-18 | 1991-04-30 | Fujitsu Ltd | ウェハホルダ |
US5220171A (en) * | 1990-11-01 | 1993-06-15 | Canon Kabushiki Kaisha | Wafer holding device in an exposure apparatus |
US5155652A (en) * | 1991-05-02 | 1992-10-13 | International Business Machines Corporation | Temperature cycling ceramic electrostatic chuck |
JPH06283594A (ja) * | 1993-03-24 | 1994-10-07 | Tokyo Electron Ltd | 静電チャック |
US5738165A (en) * | 1993-05-07 | 1998-04-14 | Nikon Corporation | Substrate holding apparatus |
JPH07142555A (ja) | 1993-06-29 | 1995-06-02 | Hitachi Ltd | ウエハチャック |
JPH0729831U (ja) * | 1993-11-11 | 1995-06-02 | 株式会社ニコン | 露光装置の基板保持装置 |
AU7438296A (en) | 1995-10-12 | 1997-04-30 | Magapanel Corporation | Magnification control and thermal substrate chuck for photolithography |
US6019164A (en) * | 1997-12-31 | 2000-02-01 | Temptronic Corporation | Workpiece chuck |
US6073681A (en) | 1997-12-31 | 2000-06-13 | Temptronic Corporation | Workpiece chuck |
US6215642B1 (en) * | 1999-03-11 | 2001-04-10 | Nikon Corporation Of Japan | Vacuum compatible, deformable electrostatic chuck with high thermal conductivity |
JP4700819B2 (ja) * | 2000-03-10 | 2011-06-15 | キヤノン株式会社 | 基板保持装置、半導体製造装置および半導体デバイス製造方法 |
WO2002009155A2 (en) * | 2000-07-10 | 2002-01-31 | Temptronic Corporation | Wafer chuck having with interleaved heating and cooling elements |
JP2003068626A (ja) * | 2001-08-29 | 2003-03-07 | Canon Inc | 露光装置内ユニットの輻射冷却方法及び輻射冷却装置 |
JP2003282685A (ja) | 2002-03-27 | 2003-10-03 | Sumitomo Metal Ind Ltd | 冷却プレート |
EP1359466A1 (en) * | 2002-05-01 | 2003-11-05 | ASML Netherlands B.V. | Chuck, lithographic projection apparatus, method of manufacturing a chuck and device manufacturing method |
JP2004103799A (ja) * | 2002-09-09 | 2004-04-02 | Canon Inc | 基板保持装置、デバイス製造装置及びデバイス製造方法 |
US7105836B2 (en) * | 2002-10-18 | 2006-09-12 | Asml Holding N.V. | Method and apparatus for cooling a reticle during lithographic exposure |
CN100568101C (zh) * | 2002-11-12 | 2009-12-09 | Asml荷兰有限公司 | 光刻装置和器件制造方法 |
JP4307130B2 (ja) * | 2003-04-08 | 2009-08-05 | キヤノン株式会社 | 露光装置 |
EP1491967A1 (en) * | 2003-06-27 | 2004-12-29 | ASML Netherlands B.V. | Method and apparatus for positioning a substrate on a substrate table |
US7061579B2 (en) * | 2003-11-13 | 2006-06-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7489388B2 (en) * | 2003-12-22 | 2009-02-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP4833859B2 (ja) * | 2004-01-30 | 2011-12-07 | 東京エレクトロン株式会社 | 流体用ギャップを有する基板ホルダとこの基板ホルダの製造方法 |
US8749762B2 (en) * | 2004-05-11 | 2014-06-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
FR2873497B1 (fr) * | 2004-07-23 | 2014-03-28 | Accumulateurs Fixes | Accumulateur electrochimique au lithium fonctionnant a haute temperature |
US7532310B2 (en) | 2004-10-22 | 2009-05-12 | Asml Netherlands B.V. | Apparatus, method for supporting and/or thermally conditioning a substrate, a support table, and a chuck |
US7196768B2 (en) | 2004-10-26 | 2007-03-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7327439B2 (en) * | 2004-11-16 | 2008-02-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2006211812A (ja) * | 2005-01-27 | 2006-08-10 | Canon Inc | 位置決め装置、露光装置、並びにデバイス製造方法 |
JP2006310374A (ja) | 2005-04-26 | 2006-11-09 | Sumitomo Electric Ind Ltd | ウェハ保持体及びウェハ保持体を備えた露光装置 |
JP2007081279A (ja) * | 2005-09-16 | 2007-03-29 | Nikon Corp | ステージ装置および露光装置 |
US7649611B2 (en) * | 2005-12-30 | 2010-01-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
-
2007
- 2007-03-12 US US11/716,670 patent/US8760621B2/en active Active
-
2008
- 2008-03-03 TW TW97107362A patent/TWI470362B/zh active
- 2008-03-04 SG SG200801816-0A patent/SG146541A1/en unknown
- 2008-03-04 EP EP08250736A patent/EP1970764A3/en not_active Withdrawn
- 2008-03-04 CN CN200810080999XA patent/CN101266412B/zh active Active
- 2008-03-06 JP JP2008056277A patent/JP4700076B2/ja active Active
- 2008-03-06 KR KR1020080020858A patent/KR100952445B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN101266412B (zh) | 2011-02-16 |
KR100952445B1 (ko) | 2010-04-12 |
JP4700076B2 (ja) | 2011-06-15 |
US8760621B2 (en) | 2014-06-24 |
KR20080083572A (ko) | 2008-09-18 |
EP1970764A2 (en) | 2008-09-17 |
US20080225244A1 (en) | 2008-09-18 |
TW200848948A (en) | 2008-12-16 |
TWI470362B (zh) | 2015-01-21 |
CN101266412A (zh) | 2008-09-17 |
EP1970764A3 (en) | 2010-07-07 |
JP2008227489A (ja) | 2008-09-25 |
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