SG146440A1 - Methods of forming metal-comprising materials and capacitor electrodes; and capacitor constructions - Google Patents

Methods of forming metal-comprising materials and capacitor electrodes; and capacitor constructions

Info

Publication number
SG146440A1
SG146440A1 SG200601021-9A SG2006010219A SG146440A1 SG 146440 A1 SG146440 A1 SG 146440A1 SG 2006010219 A SG2006010219 A SG 2006010219A SG 146440 A1 SG146440 A1 SG 146440A1
Authority
SG
Singapore
Prior art keywords
capacitor
methods
materials
constructions
metal
Prior art date
Application number
SG200601021-9A
Other languages
English (en)
Inventor
Haining Yang
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Publication of SG146440A1 publication Critical patent/SG146440A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H01L28/60—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
    • H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Semiconductor Memories (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Chemical Vapour Deposition (AREA)
SG200601021-9A 2001-08-16 2002-08-15 Methods of forming metal-comprising materials and capacitor electrodes; and capacitor constructions SG146440A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/932,236 US20030036242A1 (en) 2001-08-16 2001-08-16 Methods of forming metal-comprising materials and capacitor electrodes; and capacitor constructions

Publications (1)

Publication Number Publication Date
SG146440A1 true SG146440A1 (en) 2008-10-30

Family

ID=25461998

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200601021-9A SG146440A1 (en) 2001-08-16 2002-08-15 Methods of forming metal-comprising materials and capacitor electrodes; and capacitor constructions

Country Status (11)

Country Link
US (5) US20030036242A1 (zh)
EP (1) EP1417701B1 (zh)
JP (1) JP2005526377A (zh)
KR (2) KR100627503B1 (zh)
CN (1) CN100521086C (zh)
AT (1) ATE360260T1 (zh)
AU (1) AU2002327474A1 (zh)
DE (1) DE60219635T2 (zh)
SG (1) SG146440A1 (zh)
TW (1) TW559982B (zh)
WO (1) WO2003017341A2 (zh)

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KR100587686B1 (ko) * 2004-07-15 2006-06-08 삼성전자주식회사 질화 티타늄막 형성방법 및 이를 이용한 커패시터 제조방법
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US8859047B2 (en) 2010-02-23 2014-10-14 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Use of ruthenium tetroxide as a precursor and reactant for thin film depositions
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EP3752655A1 (en) 2018-02-12 2020-12-23 Merck Patent GmbH Methods of vapor deposition of ruthenium using an oxygen-free co-reactant

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Also Published As

Publication number Publication date
US20060040414A1 (en) 2006-02-23
KR20040030959A (ko) 2004-04-09
KR20060031708A (ko) 2006-04-12
WO2003017341A2 (en) 2003-02-27
EP1417701B1 (en) 2007-04-18
WO2003017341A3 (en) 2004-02-19
KR100627503B1 (ko) 2006-09-21
CN100521086C (zh) 2009-07-29
US7354842B2 (en) 2008-04-08
US6924195B2 (en) 2005-08-02
US20030036210A1 (en) 2003-02-20
US20050032366A1 (en) 2005-02-10
TW559982B (en) 2003-11-01
JP2005526377A (ja) 2005-09-02
US20030036242A1 (en) 2003-02-20
DE60219635D1 (de) 2007-05-31
WO2003017341B1 (en) 2004-04-15
US20040161892A1 (en) 2004-08-19
EP1417701A2 (en) 2004-05-12
ATE360260T1 (de) 2007-05-15
AU2002327474A1 (en) 2003-03-03
DE60219635T2 (de) 2007-12-20
KR100632614B1 (ko) 2006-10-09
CN1543665A (zh) 2004-11-03

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