SG142224A1 - Apparatus for treating substrates using plasma, method for supplying plasma and method for treating substrates using plasma - Google Patents

Apparatus for treating substrates using plasma, method for supplying plasma and method for treating substrates using plasma

Info

Publication number
SG142224A1
SG142224A1 SG200708496-5A SG2007084965A SG142224A1 SG 142224 A1 SG142224 A1 SG 142224A1 SG 2007084965 A SG2007084965 A SG 2007084965A SG 142224 A1 SG142224 A1 SG 142224A1
Authority
SG
Singapore
Prior art keywords
plasma
treating substrates
supplying
fluorine
oxygen plasma
Prior art date
Application number
SG200708496-5A
Other languages
English (en)
Inventor
Chang-Weon Lee
Original Assignee
Psk Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Psk Inc filed Critical Psk Inc
Publication of SG142224A1 publication Critical patent/SG142224A1/en

Links

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG200708496-5A 2006-10-27 2007-09-20 Apparatus for treating substrates using plasma, method for supplying plasma and method for treating substrates using plasma SG142224A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060104895A KR100762714B1 (ko) 2006-10-27 2006-10-27 플라스마를 이용하여 기판을 처리하는 장치, 플라스마를공급하는 방법 및 플라스마를 공급하여 기판을 처리하는방법

Publications (1)

Publication Number Publication Date
SG142224A1 true SG142224A1 (en) 2008-05-28

Family

ID=39390620

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200708496-5A SG142224A1 (en) 2006-10-27 2007-09-20 Apparatus for treating substrates using plasma, method for supplying plasma and method for treating substrates using plasma

Country Status (5)

Country Link
JP (1) JP2008113001A (ja)
KR (1) KR100762714B1 (ja)
CN (1) CN100590788C (ja)
SG (1) SG142224A1 (ja)
TW (1) TWI354328B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11859153B2 (en) * 2021-11-08 2024-01-02 Changxin Memory Technologies, Inc. Method for cleaning substrate and system for cleaning substrate

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100851236B1 (ko) * 2007-03-06 2008-08-20 피에스케이 주식회사 배기장치 및 이를 포함하는 기판처리장치, 그리고 배기방법
KR100978859B1 (ko) * 2008-07-11 2010-08-31 피에스케이 주식회사 할로우 캐소드 플라즈마 발생장치 및 할로우 캐소드플라즈마를 이용한 대면적 기판 처리장치
JP5508701B2 (ja) * 2008-08-28 2014-06-04 岩谷産業株式会社 半導体処理装置及び処理方法
JP5094670B2 (ja) * 2008-10-02 2012-12-12 株式会社アルバック エッチング装置、マイクロマシーン製造方法
JP5094672B2 (ja) * 2008-10-02 2012-12-12 株式会社アルバック エッチング装置
KR101446632B1 (ko) * 2013-06-24 2014-10-06 피에스케이 주식회사 기판 처리 장치 및 방법
JP6247087B2 (ja) * 2013-12-18 2017-12-13 東京エレクトロン株式会社 処理装置および活性種の生成方法
CN109545645A (zh) * 2019-01-17 2019-03-29 中国科学技术大学 一种等离子体刻蚀装置及其扩散装置
TW202221789A (zh) * 2020-11-27 2022-06-01 南韓商Psk有限公司 處理基板之方法與設備

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5887825A (ja) * 1981-11-20 1983-05-25 Fujitsu Ltd マイクロ波プラズマ処理装置
JPH07130713A (ja) * 1993-11-04 1995-05-19 Fujitsu Ltd ダウンフローエッチング装置
JP2000124204A (ja) 1998-10-20 2000-04-28 Tokyo Electron Ltd プラズマ中の負イオンの測定方法、プラズマ処理方法及びその装置
US6458722B1 (en) * 2000-10-25 2002-10-01 Applied Materials, Inc. Controlled method of silicon-rich oxide deposition using HDP-CVD
US20060118240A1 (en) * 2004-12-03 2006-06-08 Applied Science And Technology, Inc. Methods and apparatus for downstream dissociation of gases
JP2006270030A (ja) 2005-02-28 2006-10-05 Tokyo Electron Ltd プラズマ処理方法、および後処理方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11859153B2 (en) * 2021-11-08 2024-01-02 Changxin Memory Technologies, Inc. Method for cleaning substrate and system for cleaning substrate

Also Published As

Publication number Publication date
TWI354328B (en) 2011-12-11
KR100762714B1 (ko) 2007-10-02
CN101170054A (zh) 2008-04-30
JP2008113001A (ja) 2008-05-15
CN100590788C (zh) 2010-02-17
TW200820336A (en) 2008-05-01

Similar Documents

Publication Publication Date Title
SG142224A1 (en) Apparatus for treating substrates using plasma, method for supplying plasma and method for treating substrates using plasma
WO2010047970A3 (en) Method and apparatus for removing photoresist
WO2009158311A3 (en) Methods and apparatus for in-situ chamber dry clean during photomask plasma etching
TW200601429A (en) Method and apparatus for photomask plasma etching
WO2006034130A3 (en) Apparatus and process for surface treatment of substrate using an activated reactive gas
WO2005111267A3 (en) Gas distribution member supplying process gas and rf power for plasma processing
TW200739697A (en) Methods and apparatus for in-situ substrate processing
TW200614365A (en) Method for providing uniform removal of organic material
TW200737333A (en) Substrate treatment apparatus and substrate treatment method
MX2009012208A (es) Aparato para tratar gas.
TW200802554A (en) A method of manufacturing a semiconductor device and device of processing substrate
WO2008146834A1 (ja) レジスト除去方法、半導体製造方法、及びレジスト除去装置
WO2007035071A8 (en) Apparatus and method for treating substrate
WO2007038427A3 (en) Method and apparatus for electronic device manufacture using shadow masks
TW200725727A (en) Substrate processing method and substrate processing apparatus
WO2005104186A3 (en) Method and processing system for plasma-enhanced cleaning of system components
WO2009057395A1 (ja) 酸化膜除去のための基板洗浄処理方法
DE502006008626D1 (de) Verfahren zum abscheiden von schichten in einem cvd-reaktor sowie gaseinlassorgan für einen cvd-reaktor
TW200731353A (en) A deposition system and method
WO2012018375A3 (en) Plasma mediated ashing processes
WO2004055855A3 (en) Gas distribution apparatus and method for uniform etching
TW200741803A (en) Substrate processing apparatus, method for examining substrate processing conditions, and storage medium
JP2011009699A5 (ja) 基板処理装置、基板処理方法および半導体装置の製造方法
TW200719090A (en) Apparatus for and method of processing substrate subjected to exposure process
TW200943398A (en) Novel treatment and system for mask surface chemical reduction