SG134323A1 - Method of forming a three-dimensional microstructure on a surface, uses thereof, and microstructured products so obtained - Google Patents

Method of forming a three-dimensional microstructure on a surface, uses thereof, and microstructured products so obtained

Info

Publication number
SG134323A1
SG134323A1 SG200705123-8A SG2007051238A SG134323A1 SG 134323 A1 SG134323 A1 SG 134323A1 SG 2007051238 A SG2007051238 A SG 2007051238A SG 134323 A1 SG134323 A1 SG 134323A1
Authority
SG
Singapore
Prior art keywords
silicone
layer
dimensional microstructure
microstructured
layers
Prior art date
Application number
SG200705123-8A
Other languages
English (en)
Inventor
Robert Ghislain Stocq
Original Assignee
Mactac Europ S A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mactac Europ S A filed Critical Mactac Europ S A
Publication of SG134323A1 publication Critical patent/SG134323A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
    • B29C59/046—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts for layered or coated substantially flat surfaces
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/403—Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2009/00—Layered products
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/006—Presence of polyolefin in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C09J2427/006—Presence of halogenated polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • C09J2483/005—Presence of polysiloxane in the release coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1452—Polymer derived only from ethylenically unsaturated monomer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1452—Polymer derived only from ethylenically unsaturated monomer
    • Y10T428/1457—Silicon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1486—Ornamental, decorative, pattern, or indicia
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Manufacturing Of Printed Wiring (AREA)
SG200705123-8A 2003-12-29 2005-01-03 Method of forming a three-dimensional microstructure on a surface, uses thereof, and microstructured products so obtained SG134323A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP03079017A EP1550546A1 (fr) 2003-12-29 2003-12-29 Procédé de microstructuration d'une surface de substrat souple multicouche, et substrat microstructuré

Publications (1)

Publication Number Publication Date
SG134323A1 true SG134323A1 (en) 2007-08-29

Family

ID=34560186

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200705123-8A SG134323A1 (en) 2003-12-29 2005-01-03 Method of forming a three-dimensional microstructure on a surface, uses thereof, and microstructured products so obtained

Country Status (21)

Country Link
US (2) US7879419B2 (ru)
EP (3) EP1550546A1 (ru)
JP (2) JP4616277B2 (ru)
KR (1) KR101082315B1 (ru)
CN (1) CN100540299C (ru)
AT (2) ATE405411T1 (ru)
AU (2) AU2005203680B2 (ru)
BE (1) BE1015984A5 (ru)
BR (1) BRPI0506660A (ru)
CA (1) CA2548651C (ru)
DE (2) DE602005009396D1 (ru)
DK (2) DK1818160T3 (ru)
EA (1) EA010748B1 (ru)
ES (2) ES2313692T3 (ru)
IL (1) IL176379A (ru)
IN (1) IN2012DN00383A (ru)
NZ (2) NZ584826A (ru)
PL (2) PL1699614T3 (ru)
SG (1) SG134323A1 (ru)
WO (1) WO2005063464A2 (ru)
ZA (1) ZA200605346B (ru)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1550546A1 (fr) * 2003-12-29 2005-07-06 Mactac Europe S.A. Procédé de microstructuration d'une surface de substrat souple multicouche, et substrat microstructuré
AU2009225508A1 (en) * 2008-03-20 2009-09-24 Avery Dennison Corporation Acrylic polymers having controlled placement of functional groups
CN105408438B (zh) 2013-06-06 2018-12-07 3M创新有限公司 用于制备结构化粘合剂制品的方法
JP2016521779A (ja) 2013-06-06 2016-07-25 スリーエム イノベイティブ プロパティズ カンパニー 構造化ラミネート接着剤物品の調製方法
CN105307850B (zh) 2013-06-06 2018-05-15 3M创新有限公司 用于制备结构化粘合剂制品的方法
JP2018535123A (ja) 2015-11-02 2018-11-29 スリーエム イノベイティブ プロパティズ カンパニー 低光沢度積層物品
US11267944B2 (en) 2015-12-30 2022-03-08 Saint-Gobain Performance Plastics Corporation Radiation curable article and method for making and using same
CN109070444B (zh) * 2016-04-29 2021-11-19 美国圣戈班性能塑料公司 可辐射固化的系统和制备可辐射固化的制品的方法
MX2018015968A (es) * 2016-06-27 2019-03-21 Havi Global Solutions Llc Superficies de empaque microestructuradas para un agarre mejorado.
WO2018013779A1 (en) * 2016-07-13 2018-01-18 North Carolina State University Silicone compositions for three-dimensional printing
CN108690545A (zh) * 2017-04-12 2018-10-23 段希忠 Fr阻燃聚芳酰胺纤维纸聚酯薄膜柔软复合材料
WO2019234684A1 (en) 2018-06-07 2019-12-12 3M Innovative Properties Company Microstructured release liners for selective transfer of ink to film
TWI808228B (zh) * 2018-07-29 2023-07-11 瑞士商Ｂｖｗ控股公司 具有吸力的圖案化表面
US11907447B2 (en) 2018-12-18 2024-02-20 3M Innovative Properties Company Polymeric film having structured surface
SG11202110863TA (en) * 2019-04-09 2021-10-28 Azul 3D Inc Methodologies to rapidly cure and coat parts produced by additive manufacturing
US11766822B2 (en) 2019-08-20 2023-09-26 3M Innovative Properties Company Microstructured surface with increased microorganism removal when cleaned, articles and methods
FI3838591T3 (fi) 2019-12-20 2024-05-29 Mondi Ag Irrotettava kalvo uudelleen aseteltavissa olevia tarratuotteita varten
CN111562638A (zh) * 2020-05-25 2020-08-21 苏州大学 一种反射型隔热薄膜及其制备方法
WO2022082117A1 (en) * 2020-10-16 2022-04-21 Magna Rohinni Automotive Llc Led optics system
CN113008417B (zh) * 2021-02-22 2022-06-28 清华大学 基于多级结构的柔性压力传感器、制备方法及测量系统
WO2023164091A1 (en) * 2022-02-24 2023-08-31 University Of Florida Research Foundation, Incorporated 3d printing from gas phase monomers

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5769045A (en) * 1980-10-16 1982-04-27 Toppan Printing Co Ltd Manufacture of incorporated film
JPS5813682A (ja) * 1981-07-16 1983-01-26 Nippon Carbide Ind Co Ltd 感圧接着剤層
USRE37612E1 (en) * 1983-12-21 2002-03-26 Beiersdorf Ag Residuelessly redetachable contact-adhesive sheetlike structures
DE3346100A1 (de) * 1983-12-21 1985-07-04 Beiersdorf Ag, 2000 Hamburg Rueckstandsfrei wieder abloesbare haftklebrige flaechengebilde
US4986496A (en) * 1985-05-31 1991-01-22 Minnesota Mining And Manufacturing Drag reduction article
US5133516A (en) * 1985-05-31 1992-07-28 Minnesota Mining And Manufacturing Co. Drag reduction article
US5175030A (en) * 1989-02-10 1992-12-29 Minnesota Mining And Manufacturing Company Microstructure-bearing composite plastic articles and method of making
KR940008665B1 (ko) * 1989-10-30 1994-09-24 샤프 가부시끼가이샤 마이크로렌즈를 가지는 광학장치와 마이크로렌즈의 제조방법
JPH03202330A (ja) * 1989-10-30 1991-09-04 Sharp Corp マイクロレンズの製造方法
US5192612A (en) * 1989-10-31 1993-03-09 Avery International Corporation Positionable-repositionable pressure-sensitive adhesive
US5254390B1 (en) * 1990-11-15 1999-05-18 Minnesota Mining & Mfg Plano-convex base sheet for retroreflective articles
US5376420A (en) * 1991-07-17 1994-12-27 Nitto Denko Corporation Curable silicone-based release agent, separator having cured film formed from the same, and pressure-sensitive tape having cured film formed from the same
US5296277A (en) * 1992-06-26 1994-03-22 Minnesota Mining And Manufacturing Company Positionable and repositionable adhesive articles
US5571617A (en) * 1993-04-23 1996-11-05 Minnesota Mining And Manufacturing Company Pressure sensitive adhesive comprising tacky surface active microspheres
US6440880B2 (en) * 1993-10-29 2002-08-27 3M Innovative Properties Company Pressure-sensitive adhesives having microstructured surfaces
WO1995011945A1 (en) * 1993-10-29 1995-05-04 Minnesota Mining And Manufacturing Company Pressure-sensitive adhesives having microstructured surfaces
JP3261489B2 (ja) * 1993-11-22 2002-03-04 大日本印刷株式会社 同調ポリエステル化粧板の製造方法
US5795636A (en) * 1995-11-15 1998-08-18 Minnesota Mining And Manufacturing Company Positionable and repositionable adhesive article
NZ330835A (en) * 1996-01-10 2000-03-27 Procter & Gamble Material having a substance protected by deformable standoffs and method of making
US5662758A (en) * 1996-01-10 1997-09-02 The Procter & Gamble Company Composite material releasably sealable to a target surface when pressed thereagainst and method of making
US5814355A (en) * 1996-04-30 1998-09-29 Minnesota Mining And Manufacturing Company Mold for producing glittering cube-corner retroreflective sheeting
EP0898584A4 (en) * 1996-05-17 2002-01-02 Datacard Corp CURABLE SURFACE COMPOSITION AND METHODS FOR USE
JP3612394B2 (ja) * 1996-10-25 2005-01-19 ミネソタ マイニング アンド マニュファクチャリング カンパニー 粘着シートおよびその製造方法
US6197397B1 (en) * 1996-12-31 2001-03-06 3M Innovative Properties Company Adhesives having a microreplicated topography and methods of making and using same
JPH1134514A (ja) * 1997-07-15 1999-02-09 Dainippon Printing Co Ltd 熱転写受像シート及びその製造方法
US5954907A (en) * 1997-10-07 1999-09-21 Avery Dennison Corporation Process using electrostatic spraying for coating substrates with release coating compositions, pressure sensitive adhesives, and combinations thereof
US6972141B1 (en) * 1997-12-12 2005-12-06 3M Innovative Properties Company Removable adhesive tape laminate and separable fastener
US6372341B1 (en) * 1998-04-27 2002-04-16 3M Innovative Properties Company Tampa-indicating article for reusable substrates
US6524675B1 (en) * 1999-05-13 2003-02-25 3M Innovative Properties Company Adhesive-back articles
JP2001310333A (ja) * 2000-04-28 2001-11-06 Sanyo Chem Ind Ltd プラズマディスプレイパネル隔壁製造用樹脂型形成用材料および樹脂型
US6759110B1 (en) * 2000-08-15 2004-07-06 3M Innovative Properties Company Structured release liners with improved adhesion to adhesive articles
US6787978B2 (en) * 2000-11-28 2004-09-07 Mitsubishi Denki Kabushiki Kaisha Plasma display panel and plasma display device
US6541098B2 (en) * 2000-12-22 2003-04-01 Avery Dennison Corporation Three-dimensional flexible adhesive film structures
JP2002219778A (ja) * 2001-01-25 2002-08-06 Daikyo Giken Kogyo Kk 剥離材及びその製造方法並びに粘着性物品
US6838142B2 (en) * 2001-05-18 2005-01-04 3M Innovative Properties Company Specular laminates
US20030221770A1 (en) * 2002-05-28 2003-12-04 3M Innovative Properties Company Segmented curable transfer tapes
JP4741232B2 (ja) 2002-05-28 2011-08-03 スリーエム イノベイティブ プロパティズ カンパニー トポグラフィー的特徴を有する硬化性接着物品
JP4326190B2 (ja) * 2002-07-10 2009-09-02 スリーエム イノベイティブ プロパティズ カンパニー 可とう性成形型及びその製造方法
US7311956B2 (en) * 2002-11-26 2007-12-25 3M Innovative Properties Company Laminate and method used for applying a design to a substrate
EP1550546A1 (fr) * 2003-12-29 2005-07-06 Mactac Europe S.A. Procédé de microstructuration d'une surface de substrat souple multicouche, et substrat microstructuré

Also Published As

Publication number Publication date
EP1699614A2 (en) 2006-09-13
PL1699614T3 (pl) 2009-01-30
JP2007516868A (ja) 2007-06-28
CA2548651A1 (en) 2005-07-14
PL1818160T3 (pl) 2009-02-27
EA200601255A1 (ru) 2006-12-29
IL176379A (en) 2010-05-31
DE602005009132D1 (de) 2008-10-02
DK1699614T3 (da) 2008-12-01
NZ547916A (en) 2010-08-27
ATE406253T1 (de) 2008-09-15
JP2011025704A (ja) 2011-02-10
AU2009231221A1 (en) 2009-11-19
WO2005063464A3 (en) 2005-10-06
AU2005203680A1 (en) 2005-07-14
EP1550546A1 (fr) 2005-07-06
ES2313692T3 (es) 2009-03-01
CN1906035A (zh) 2007-01-31
EA010748B1 (ru) 2008-10-30
EP1818160A1 (en) 2007-08-15
BRPI0506660A (pt) 2007-05-15
ATE405411T1 (de) 2008-09-15
KR101082315B1 (ko) 2011-11-10
EP1818160B1 (en) 2008-08-27
NZ584826A (en) 2011-08-26
BE1015984A5 (fr) 2005-12-06
EP1699614B1 (en) 2008-08-20
KR20060113960A (ko) 2006-11-03
DK1818160T3 (da) 2008-12-15
US20120070622A1 (en) 2012-03-22
CA2548651C (en) 2013-05-14
CN100540299C (zh) 2009-09-16
WO2005063464A2 (en) 2005-07-14
JP4616277B2 (ja) 2011-01-19
ES2311957T3 (es) 2009-02-16
AU2005203680B2 (en) 2009-10-08
IN2012DN00383A (ru) 2015-08-21
DE602005009396D1 (de) 2008-10-09
US7879419B2 (en) 2011-02-01
AU2009231221B2 (en) 2011-06-16
ZA200605346B (en) 2007-04-25
IL176379A0 (en) 2006-10-05
US20090263609A1 (en) 2009-10-22

Similar Documents

Publication Publication Date Title
SG134323A1 (en) Method of forming a three-dimensional microstructure on a surface, uses thereof, and microstructured products so obtained
WO2007030640A3 (en) Microstructured adhesive article and articles made therefrom
ATE424311T1 (de) Sicherheitselement und verfahren zu seiner herstellung
BRPI0515000A (pt) elemento de segurança e método para fabricação do mesmo
ATE469372T1 (de) Elektronische vorrichtung mit kunststoffsubstrat
WO2005108108A3 (de) Sicherheitselement und Verfahren zu seiner Herstellung
MX2009007991A (es) Materiales laminados elastomericos que no requieren activacion mecanica.
TW200721524A (en) Method of releasing high temperature films and/or devices from metallic substrates
BRPI0514689B8 (pt) filme de transferência e processo para a produção de um artigo termoplástico que é decorado com uma camada de transferência do referido filme de transferência
FI20020998A (fi) Menetelmä kalvon muodostamiseksi
TW200802529A (en) Soft mold and method of fabricating the same
WO2011039327A3 (de) Funktionelles laminat
TW200714940A (en) Method of manufacturing an optical functional film, optical functional film, polarizing plate, optical element and image display device
JPWO2012157636A1 (ja) ナノインプリント用モールドおよび曲面体
JP2007516868A5 (ru)
JP2018530627A5 (ru)
TWI689415B (zh) 真空熱成型用裝飾片及使用其而形成的物品、真空熱成型用裝飾片的製備方法
JP2018158549A5 (ru)
EP1505136A3 (en) Pressure-sensitive adhesive sheet and method for producing the same
Yu et al. Thermoresponsiveness of Integrated Ultra‐Thin Silicon with Poly (N‐isopropylacrylamide) Hydrogels
DK1654129T3 (da) Dekorativ, selvklæbende laminatplade
ATE385905T1 (de) Sublimationsbildübertragung und blattähnliches übertragungsmedium
TW200600333A (en) Forming method of the metallic slab for electronic device shell and its structure thereof
TWI234514B (en) Hologram heat shrink film and method for making same
JP2016088059A (ja) ２層ｐｐフィルムの製造方法および製造された２層ｐｐフィルム