SG131913A1 - Method for forming multi-layer bumps on a substrate - Google Patents

Method for forming multi-layer bumps on a substrate

Info

Publication number
SG131913A1
SG131913A1 SG200607481-9A SG2006074819A SG131913A1 SG 131913 A1 SG131913 A1 SG 131913A1 SG 2006074819 A SG2006074819 A SG 2006074819A SG 131913 A1 SG131913 A1 SG 131913A1
Authority
SG
Singapore
Prior art keywords
bumps
substrate
melted
forming multi
metal powder
Prior art date
Application number
SG200607481-9A
Other languages
English (en)
Inventor
Hei Ming Shiu
On Lok Chau
Gor Amie Lai
Original Assignee
Freescale Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freescale Semiconductor Inc filed Critical Freescale Semiconductor Inc
Publication of SG131913A1 publication Critical patent/SG131913A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)
SG200607481-9A 2005-10-31 2006-10-27 Method for forming multi-layer bumps on a substrate SG131913A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/263,440 US7279409B2 (en) 2005-10-31 2005-10-31 Method for forming multi-layer bumps on a substrate

Publications (1)

Publication Number Publication Date
SG131913A1 true SG131913A1 (en) 2007-05-28

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US (1) US7279409B2 (de)
JP (1) JP5079304B2 (de)
KR (1) KR101279234B1 (de)
CN (1) CN1959531A (de)
DE (1) DE102006051151A1 (de)
SG (1) SG131913A1 (de)
TW (1) TWI330876B (de)

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JP5316261B2 (ja) * 2009-06-30 2013-10-16 富士通株式会社 マルチチップモジュールおよびプリント基板ユニット並びに電子機器
TW201133745A (en) * 2009-08-27 2011-10-01 Advanpack Solutions Private Ltd Stacked bump interconnection structure and semiconductor package formed using the same
JP5397243B2 (ja) * 2010-01-28 2014-01-22 日立化成株式会社 半導体装置の製造方法及び回路部材接続用接着シート
US9636782B2 (en) 2012-11-28 2017-05-02 International Business Machines Corporation Wafer debonding using mid-wavelength infrared radiation ablation
US20140144593A1 (en) 2012-11-28 2014-05-29 International Business Machiness Corporation Wafer debonding using long-wavelength infrared radiation ablation
TWI576190B (zh) * 2013-08-01 2017-04-01 Ibm 使用中段波長紅外光輻射燒蝕之晶圓剝離
DE102013220886A1 (de) * 2013-10-15 2015-04-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Erzeugen einer metallischen Kontaktierungsstruktur auf einem Halbleitersubstrat
US9474162B2 (en) * 2014-01-10 2016-10-18 Freescale Semiocnductor, Inc. Circuit substrate and method of manufacturing same
CN105632910B (zh) * 2015-03-31 2021-04-30 中国科学院微电子研究所 栅导体层及其制造方法
CN108807202B (zh) * 2018-06-11 2019-11-12 广东海洋大学 一种激光制作钎料凸点的方法
CN112599642A (zh) * 2020-12-18 2021-04-02 泰州隆基乐叶光伏科技有限公司 一种电池片的焊接方法以及光伏组件

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JP3193100B2 (ja) * 1992-03-13 2001-07-30 富士通株式会社 半導体装置
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JP5079304B2 (ja) 2012-11-21
DE102006051151A1 (de) 2007-06-06
KR20070046756A (ko) 2007-05-03
US7279409B2 (en) 2007-10-09
KR101279234B1 (ko) 2013-06-26
TWI330876B (en) 2010-09-21
TW200725768A (en) 2007-07-01
CN1959531A (zh) 2007-05-09
JP2007129220A (ja) 2007-05-24
US20070099413A1 (en) 2007-05-03

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