SG131744A1 - Circuit board protection cover and circuit board having circuit board protection cover - Google Patents

Circuit board protection cover and circuit board having circuit board protection cover

Info

Publication number
SG131744A1
SG131744A1 SG200203423-9A SG2002034239A SG131744A1 SG 131744 A1 SG131744 A1 SG 131744A1 SG 2002034239 A SG2002034239 A SG 2002034239A SG 131744 A1 SG131744 A1 SG 131744A1
Authority
SG
Singapore
Prior art keywords
circuit board
protection cover
board protection
incision
circuit
Prior art date
Application number
SG200203423-9A
Other languages
English (en)
Inventor
Fumio Hasegawa
Original Assignee
Nec Lcd Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Lcd Technologies Ltd filed Critical Nec Lcd Technologies Ltd
Publication of SG131744A1 publication Critical patent/SG131744A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2818—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casings For Electric Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Liquid Crystal (AREA)
  • Structure Of Printed Boards (AREA)
SG200203423-9A 2001-06-12 2002-06-10 Circuit board protection cover and circuit board having circuit board protection cover SG131744A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001176537A JP2002368360A (ja) 2001-06-12 2001-06-12 保護カバーを設けた回路基板

Publications (1)

Publication Number Publication Date
SG131744A1 true SG131744A1 (en) 2007-05-28

Family

ID=19017510

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200203423-9A SG131744A1 (en) 2001-06-12 2002-06-10 Circuit board protection cover and circuit board having circuit board protection cover

Country Status (6)

Country Link
US (1) US6735088B2 (de)
EP (1) EP1267600B1 (de)
JP (1) JP2002368360A (de)
KR (1) KR100459319B1 (de)
SG (1) SG131744A1 (de)
TW (1) TW540288B (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060109014A1 (en) * 2004-11-23 2006-05-25 Te-Tsung Chao Test pad and probe card for wafer acceptance testing and other applications
US20060124747A1 (en) * 2004-12-09 2006-06-15 Rathbun Irwin D Protective envelope for a chip card
US8021193B1 (en) * 2005-04-25 2011-09-20 Nvidia Corporation Controlled impedance display adapter
JP2017072478A (ja) * 2015-10-07 2017-04-13 株式会社東海理化電機製作所 基板構造
ES2863777T3 (es) * 2016-04-28 2021-10-11 Teleste Oyj Disposición estructural para un dispositivo de campo CATV
JP2019029371A (ja) * 2017-07-25 2019-02-21 ソニー株式会社 電子機器
WO2019104630A1 (zh) * 2017-11-30 2019-06-06 深圳市柔宇科技有限公司 显示屏保护结构、显示组件及切割方法、贴膜方法
DE102018101690B3 (de) * 2018-01-25 2019-06-06 Logicdata Electronic & Software Entwicklungs Gmbh Elektronische Komponente eines verstellbaren Möbelsystems, Möbelsystem, Anordnung und Verfahren zur Konfiguration einer elektronischen Komponente
DE102018212380A1 (de) * 2018-07-25 2020-01-30 Brose Fahrzeugteile Gmbh & Co. Kommanditgesellschaft, Bamberg Elektronik eines Kraftfahrzeugs

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2704075A (en) * 1952-03-10 1955-03-15 Baxter Don Inc Flexible plastic container
US3496969A (en) * 1967-05-12 1970-02-24 Sterigard Corp Valve for pressurizing a container
JPS60151669A (ja) * 1984-01-19 1985-08-09 Fuji Xerox Co Ltd トナ−ボツクス
JPH0525897Y2 (de) * 1986-11-21 1993-06-30
US4919955A (en) * 1987-09-08 1990-04-24 Mitchell Jerry L Method for packaging perishable products
JP3108535B2 (ja) * 1992-07-28 2000-11-13 松下電工株式会社 リレーのシールド構造
US5422433A (en) * 1993-11-15 1995-06-06 Motorola, Inc. Radio frequency isolation shield having reclosable opening
JPH0832271A (ja) * 1994-07-15 1996-02-02 Tokin Corp 高周波デバイス用表示ラベル
JPH08264988A (ja) * 1995-03-24 1996-10-11 Matsushita Electric Works Ltd 立体回路基板、及び、その製造方法
GB2308235B (en) * 1995-12-12 1999-11-24 Eev Ltd High frequency apparatus
JP3264835B2 (ja) * 1996-08-07 2002-03-11 アルプス電気株式会社 高周波機器のシールドケース
US6070397A (en) * 1997-04-19 2000-06-06 Bachhuber; Michael W. Self sealing storage system and patch thereof
JP3247321B2 (ja) * 1997-09-16 2002-01-15 株式会社オートネットワーク技術研究所 電子ユニットの検査方法
JPH11177262A (ja) * 1997-12-09 1999-07-02 Matsushita Electric Ind Co Ltd 電子機器
JP2000148031A (ja) * 1998-11-13 2000-05-26 Toshiba Corp 平面表示装置
DE19932418B4 (de) * 1999-05-20 2013-12-19 Hans Schmied Gmbh Rahmen für eine HF-Abdeckung, sowie Verfahren zu seiner Herstellung

Also Published As

Publication number Publication date
KR20020095116A (ko) 2002-12-20
US6735088B2 (en) 2004-05-11
EP1267600A2 (de) 2002-12-18
EP1267600A3 (de) 2005-10-26
EP1267600B1 (de) 2013-05-15
KR100459319B1 (ko) 2004-12-03
TW540288B (en) 2003-07-01
JP2002368360A (ja) 2002-12-20
US20020186550A1 (en) 2002-12-12

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