SG126050A1 - Laser beam processing machine - Google Patents

Laser beam processing machine

Info

Publication number
SG126050A1
SG126050A1 SG200601419A SG200601419A SG126050A1 SG 126050 A1 SG126050 A1 SG 126050A1 SG 200601419 A SG200601419 A SG 200601419A SG 200601419 A SG200601419 A SG 200601419A SG 126050 A1 SG126050 A1 SG 126050A1
Authority
SG
Singapore
Prior art keywords
laser beam
feed
processing
indexing
chuck table
Prior art date
Application number
SG200601419A
Other languages
English (en)
Inventor
Hiroshi Morikazu
Keiji Nomaru
Katsuharu Negishi
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG126050A1 publication Critical patent/SG126050A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/02—Carriages for supporting the welding or cutting element
    • B23K37/0211—Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track
    • B23K37/0235—Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track the guide member forming part of a portal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work for planar work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/0426—Fixtures for other work
    • B23K37/0435—Clamps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Electromagnetism (AREA)
  • Laser Beam Processing (AREA)
  • Numerical Control (AREA)
SG200601419A 2005-03-09 2006-03-03 Laser beam processing machine SG126050A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005064867A JP4664710B2 (ja) 2005-03-09 2005-03-09 レーザー加工装置

Publications (1)

Publication Number Publication Date
SG126050A1 true SG126050A1 (en) 2006-10-30

Family

ID=36914944

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200601419A SG126050A1 (en) 2005-03-09 2006-03-03 Laser beam processing machine

Country Status (7)

Country Link
US (1) US20060201920A1 (ko)
JP (1) JP4664710B2 (ko)
KR (1) KR101214496B1 (ko)
CN (1) CN1853841A (ko)
DE (1) DE102006010766A1 (ko)
SG (1) SG126050A1 (ko)
TW (1) TWI362100B (ko)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5036181B2 (ja) * 2005-12-15 2012-09-26 株式会社ディスコ レーザー加工装置
JP5048978B2 (ja) 2006-07-14 2012-10-17 株式会社ディスコ レーザ加工装置
JP4917382B2 (ja) 2006-08-09 2012-04-18 株式会社ディスコ レーザー光線照射装置およびレーザー加工機
JP4885650B2 (ja) 2006-08-21 2012-02-29 株式会社ディスコ 表面位置検出装置およびレーザー加工機
JP2008073740A (ja) * 2006-09-22 2008-04-03 Disco Abrasive Syst Ltd ビアホールの加工方法
JP5101869B2 (ja) * 2006-11-15 2012-12-19 株式会社ディスコ ウエーハの加工方法
JP4959318B2 (ja) * 2006-12-20 2012-06-20 株式会社ディスコ ウエーハの計測装置およびレーザー加工機
JP2008207210A (ja) 2007-02-26 2008-09-11 Disco Abrasive Syst Ltd レーザー光線照射装置およびレーザー加工機
JP5192213B2 (ja) * 2007-11-02 2013-05-08 株式会社ディスコ レーザー加工装置
JP5254646B2 (ja) * 2008-03-13 2013-08-07 株式会社ディスコ ワーク加工方法およびワーク加工装置
US8157986B2 (en) * 2008-08-27 2012-04-17 Seoul National University Research & Development Business Foundation Magnetic nanoparticle complex
JP5324180B2 (ja) * 2008-10-07 2013-10-23 株式会社ディスコ レーザ加工方法およびレーザ加工装置
JP6030299B2 (ja) * 2011-12-20 2016-11-24 株式会社ディスコ レーザー加工装置
JP2013219200A (ja) * 2012-04-09 2013-10-24 Disco Abrasive Syst Ltd 切削装置
KR102265739B1 (ko) * 2020-01-07 2021-06-15 김재화 기준점 복귀가 용이한 원단 권취용 위치 제어장치
JP2022077223A (ja) * 2020-11-11 2022-05-23 株式会社ディスコ レーザー加工装置
WO2024082015A1 (en) * 2022-10-18 2024-04-25 Maxce Australia Pty Ltd A table and a marking system

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3199653B2 (ja) * 1996-12-27 2001-08-20 イビデン株式会社 多層プリント配線板の製造装置及び製造方法
JP2003047230A (ja) * 2001-07-26 2003-02-14 Ricoh Microelectronics Co Ltd リニアモータを用いた駆動装置、ビーム加工装置
JP2004358550A (ja) * 2003-06-09 2004-12-24 Sumitomo Heavy Ind Ltd レーザ加工方法およびレーザ加工装置
JP2005014050A (ja) 2003-06-26 2005-01-20 Matsushita Electric Ind Co Ltd レーザ加工装置
JP4231349B2 (ja) * 2003-07-02 2009-02-25 株式会社ディスコ レーザー加工方法およびレーザー加工装置
JP2005028423A (ja) * 2003-07-09 2005-02-03 Disco Abrasive Syst Ltd レーザー加工方法およびレーザー加工装置
JP2005230886A (ja) * 2004-02-20 2005-09-02 Hitachi Via Mechanics Ltd Ｎｃ制御のレーザ加工機
JP2005313204A (ja) * 2004-04-28 2005-11-10 Sunx Ltd レーザ孔形成装置、レーザ加工装置及びレーザ孔形成方法

Also Published As

Publication number Publication date
TWI362100B (en) 2012-04-11
DE102006010766A1 (de) 2006-09-14
JP2006247674A (ja) 2006-09-21
JP4664710B2 (ja) 2011-04-06
KR101214496B1 (ko) 2012-12-24
TW200701429A (en) 2007-01-01
KR20060097645A (ko) 2006-09-14
CN1853841A (zh) 2006-11-01
US20060201920A1 (en) 2006-09-14

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