SG123736A1 - Coating for enhancing adhesion of molding compoundto semiconductor devices - Google Patents
Coating for enhancing adhesion of molding compoundto semiconductor devicesInfo
- Publication number
- SG123736A1 SG123736A1 SG200508171A SG200508171A SG123736A1 SG 123736 A1 SG123736 A1 SG 123736A1 SG 200508171 A SG200508171 A SG 200508171A SG 200508171 A SG200508171 A SG 200508171A SG 123736 A1 SG123736 A1 SG 123736A1
- Authority
- SG
- Singapore
- Prior art keywords
- coating
- molding
- compoundto
- semiconductor devices
- enhancing adhesion
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 6
- 239000011248 coating agent Substances 0.000 title abstract 3
- 238000000576 coating method Methods 0.000 title abstract 3
- 238000000465 moulding Methods 0.000 title abstract 3
- 230000002708 enhancing effect Effects 0.000 title abstract 2
- 229920000642 polymer Polymers 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 1
- 238000007598 dipping method Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000005507 spraying Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/019,421 US7329617B2 (en) | 2004-12-22 | 2004-12-22 | Coating for enhancing adhesion of molding compound to semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG123736A1 true SG123736A1 (en) | 2006-07-26 |
Family
ID=35965943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG200508171A SG123736A1 (en) | 2004-12-22 | 2005-12-16 | Coating for enhancing adhesion of molding compoundto semiconductor devices |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7329617B2 (ja) |
| EP (1) | EP1675172A1 (ja) |
| JP (1) | JP4402649B2 (ja) |
| KR (1) | KR100685160B1 (ja) |
| CN (1) | CN100383941C (ja) |
| MY (1) | MY151621A (ja) |
| SG (1) | SG123736A1 (ja) |
| TW (1) | TWI295091B (ja) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| PT1568071T (pt) * | 2002-11-29 | 2019-06-17 | Fraunhofer Ges Forschung | Pastilha com camada de separação e camada de suporte e seu processo de fabrico |
| DE102005010272A1 (de) * | 2005-03-03 | 2006-09-14 | Infineon Technologies Ag | Halbleiterbauelement sowie Verfahren zum Herstellen eines Halbleiterbauelements |
| JP5182915B2 (ja) * | 2007-09-18 | 2013-04-17 | 株式会社ブリヂストン | 導電性エンドレスベルト |
| WO2010085319A1 (en) | 2009-01-22 | 2010-07-29 | Aculon, Inc. | Lead frames with improved adhesion to plastic encapsulant |
| US9313897B2 (en) * | 2012-09-14 | 2016-04-12 | Infineon Technologies Ag | Method for electrophoretically depositing a film on an electronic assembly |
| US9303327B2 (en) | 2013-01-10 | 2016-04-05 | Infineon Technologies Ag | Electric component with an electrophoretically deposited film |
| US9214440B1 (en) * | 2014-12-17 | 2015-12-15 | Texas Instruments Incorporated | Method for preventing die pad delamination |
| EP3459124B1 (en) * | 2016-05-18 | 2020-02-05 | Lumileds Holding B.V. | Lighting assembly and method for manufacturing a lighting assembly |
| TWI623049B (zh) * | 2016-11-04 | 2018-05-01 | 英屬開曼群島商鳳凰先驅股份有限公司 | 封裝基板及其製作方法 |
| JP6787285B2 (ja) * | 2017-09-20 | 2020-11-18 | トヨタ自動車株式会社 | 半導体装置 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3911475A (en) | 1972-04-19 | 1975-10-07 | Westinghouse Electric Corp | Encapsulated solid state electronic devices having a sealed lead-encapsulant interface |
| US4428987A (en) | 1982-04-28 | 1984-01-31 | Shell Oil Company | Process for improving copper-epoxy adhesion |
| JPS59197154A (ja) * | 1983-04-22 | 1984-11-08 | Hitachi Ltd | 半導体装置およびその製造法 |
| US4862246A (en) | 1984-09-26 | 1989-08-29 | Hitachi, Ltd. | Semiconductor device lead frame with etched through holes |
| JP2594142B2 (ja) * | 1988-11-30 | 1997-03-26 | 東芝シリコーン株式会社 | 電子部品の製造方法 |
| US5164816A (en) * | 1988-12-29 | 1992-11-17 | Hitachi Chemical Co., Ltd. | Integrated circuit device produced with a resin layer produced from a heat-resistant resin paste |
| US4946518A (en) | 1989-03-14 | 1990-08-07 | Motorola, Inc. | Method for improving the adhesion of a plastic encapsulant to copper containing leadframes |
| US5122858A (en) | 1990-09-10 | 1992-06-16 | Olin Corporation | Lead frame having polymer coated surface portions |
| US5153385A (en) * | 1991-03-18 | 1992-10-06 | Motorola, Inc. | Transfer molded semiconductor package with improved adhesion |
| US5516874A (en) | 1994-06-30 | 1996-05-14 | Ibm Corporation | Poly(aryl ether benzimidazoles) |
| JP3876944B2 (ja) * | 1997-12-24 | 2007-02-07 | 北興化学工業株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
| US6369452B1 (en) | 1999-07-27 | 2002-04-09 | International Business Machines Corporation | Cap attach surface modification for improved adhesion |
| WO2001074962A1 (en) * | 2000-03-31 | 2001-10-11 | Hitachi Chemical Co., Ltd. | Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device |
| US6501158B1 (en) | 2000-06-22 | 2002-12-31 | Skyworks Solutions, Inc. | Structure and method for securing a molding compound to a leadframe paddle |
| US7057264B2 (en) * | 2002-10-18 | 2006-06-06 | National Starch And Chemical Investment Holding Corporation | Curable compounds containing reactive groups: triazine/isocyanurates, cyanate esters and blocked isocyanates |
-
2004
- 2004-12-22 US US11/019,421 patent/US7329617B2/en active Active
-
2005
- 2005-12-16 SG SG200508171A patent/SG123736A1/en unknown
- 2005-12-19 TW TW094144979A patent/TWI295091B/zh active
- 2005-12-20 EP EP05077942A patent/EP1675172A1/en not_active Withdrawn
- 2005-12-20 JP JP2005367030A patent/JP4402649B2/ja active Active
- 2005-12-21 KR KR1020050126947A patent/KR100685160B1/ko active IP Right Grant
- 2005-12-21 MY MYPI20056082 patent/MY151621A/en unknown
- 2005-12-22 CN CNB2005101319655A patent/CN100383941C/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| MY151621A (en) | 2014-06-30 |
| TWI295091B (en) | 2008-03-21 |
| KR20060072068A (ko) | 2006-06-27 |
| US20060131720A1 (en) | 2006-06-22 |
| KR100685160B1 (ko) | 2007-02-22 |
| CN100383941C (zh) | 2008-04-23 |
| CN1812064A (zh) | 2006-08-02 |
| US7329617B2 (en) | 2008-02-12 |
| TW200629494A (en) | 2006-08-16 |
| JP2006179918A (ja) | 2006-07-06 |
| JP4402649B2 (ja) | 2010-01-20 |
| EP1675172A1 (en) | 2006-06-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SG123736A1 (en) | Coating for enhancing adhesion of molding compoundto semiconductor devices | |
| WO2011137733A3 (zh) | 电源模块及其封装集成方法 | |
| TW200730583A (en) | Siloxane resin composition and the method for manufacturing the same | |
| EP1513198A4 (en) | METHODS OF MANUFACTURING A SUBSTRATE AND A SEMICONDUCTOR DEVICE, SUBSTRATE, AND SEMICONDUCTOR DEVICE PRODUCED USING THE SAME | |
| TW200712267A (en) | Tin electroplating solution and tin electroplating method | |
| TW200942594A (en) | Film for semiconductor, method for manufacturing semiconductor device and semiconductor device | |
| WO2007046846A3 (en) | Treatment of substrates for improving ink adhesion to the substrates | |
| WO2007062306A3 (en) | Methods for coating surfaces with antimicrobial agents | |
| RS20060525A (en) | Microcoating comprising siloxanes | |
| TW200741902A (en) | Semiconductor package and, chip carrier thereof and method for fabricating the same | |
| RU2013146546A (ru) | Способ обеспечения отражающего покрытия для подложки для светоизлучающего устройства | |
| EP2952886A8 (en) | Method for manufacturing a gas sensor package | |
| EP2178132A4 (en) | ORGANIC ELECTROLUMINESCENT DEVICE, PROCESS FOR PRODUCING THE SAME, AND COATING LIQUID | |
| EP2490259A3 (en) | Light-Emitting Device Package and Method of Manufacturing the Same | |
| WO2010086151A8 (de) | Zinkdiffusionsbeschichtungsverfahren | |
| SG122966A1 (en) | Integrated curcuit package system with leadframe substrate | |
| TW200607418A (en) | Method of manufacturing circuit device, method of manufacturing electronic device, and circuit board, electronic apparatus, and photoelectric device | |
| TW200630167A (en) | Spin-coating apparatus and coated substrates prepared using the same | |
| ATE464918T1 (de) | Herstellung von hydrophilen überzügen mit einer 1,3-dioxolan-verbindung | |
| EP4180416A4 (en) | NOVEL COMPOUND, COATING COMPOSITION COMPRISING SAME, ORGANIC ELECTROLUMINESCENT DEVICE USING SAME AND METHOD FOR MANUFACTURING SAME | |
| TW200501208A (en) | Adhesive sheet for manufacturing semiconductor device, semiconductor device and manufacturing method using the same | |
| EP2514853A3 (en) | Coating-forming liquid composition and coating-forming method therewith | |
| EP1699078A4 (en) | IC-CHIP APPLICATION PROCESSING AND MANUFACTURING DEVICE | |
| EP1654572A4 (en) | ENCAPSULE OPTICAL ENCLOSURE | |
| WO2004072156A3 (en) | Surface preparation of rubber for coatings or bonding |