SG118225A1 - Substrate supporting apparatus - Google Patents

Substrate supporting apparatus

Info

Publication number
SG118225A1
SG118225A1 SG200400038A SG200400038A SG118225A1 SG 118225 A1 SG118225 A1 SG 118225A1 SG 200400038 A SG200400038 A SG 200400038A SG 200400038 A SG200400038 A SG 200400038A SG 118225 A1 SG118225 A1 SG 118225A1
Authority
SG
Singapore
Prior art keywords
substrate supporting
supporting apparatus
substrate
supporting
Prior art date
Application number
SG200400038A
Other languages
English (en)
Inventor
Matsuzawa Minoru
Yoshida Tatsuro
Original Assignee
Sipec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sipec Corp filed Critical Sipec Corp
Publication of SG118225A1 publication Critical patent/SG118225A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/11—Vacuum
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/17—Socket type
    • Y10T279/17231—Pivoted jaws
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/18—Pivoted jaw

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG200400038A 2003-07-28 2004-01-06 Substrate supporting apparatus SG118225A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003281206A JP4312001B2 (ja) 2003-07-28 2003-07-28 基板支持装置および基板取り外し方法

Publications (1)

Publication Number Publication Date
SG118225A1 true SG118225A1 (en) 2006-01-27

Family

ID=33487728

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200400038A SG118225A1 (en) 2003-07-28 2004-01-06 Substrate supporting apparatus

Country Status (8)

Country Link
US (1) US7275749B2 (ja)
EP (1) EP1503402A1 (ja)
JP (1) JP4312001B2 (ja)
KR (1) KR101099209B1 (ja)
CN (1) CN1577762A (ja)
IL (1) IL159757A0 (ja)
SG (1) SG118225A1 (ja)
TW (1) TW200504862A (ja)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7589297B2 (en) * 2005-12-08 2009-09-15 Boston Scientific Scimed, Inc. Apparatus and method for cutting flat stent precursors
KR100677994B1 (ko) * 2005-12-27 2007-02-02 동부일렉트로닉스 주식회사 노광장비의 웨이퍼스테이지 센터핀
KR100862912B1 (ko) * 2006-08-08 2008-10-13 무진전자 주식회사 기판 처리 장치
KR100809594B1 (ko) * 2006-09-12 2008-03-04 세메스 주식회사 척킹부재 및 이를 포함하는 스핀헤드
JP5013400B2 (ja) * 2006-09-29 2012-08-29 国立大学法人東北大学 塗布膜コーティング装置
US20100117279A1 (en) * 2006-11-27 2010-05-13 Camtek Ltd. Supporting system and a method for supporting an object
US8042254B1 (en) * 2006-12-22 2011-10-25 Kla-Tencor Corporation Method for improving edge handling chuck aerodynamics
KR100900750B1 (ko) * 2007-07-31 2009-06-05 세메스 주식회사 반도체 제조 설비의 무접촉 기판 지지 장치 및 그 방법
JP4850952B2 (ja) * 2008-02-14 2012-01-11 東京エレクトロン株式会社 液処理装置、液処理方法および記憶媒体
US8528886B2 (en) * 2009-02-02 2013-09-10 Corning Incorporated Material sheet handling system and processing methods
US8698099B2 (en) * 2009-09-30 2014-04-15 Kyocera Corporation Attraction member, and attraction device and charged particle beam apparatus using the same
JP5243491B2 (ja) * 2010-06-18 2013-07-24 東京エレクトロン株式会社 位置決め装置、基板処理装置及び基準部材の固定方法
US20120189421A1 (en) * 2011-01-21 2012-07-26 Samsung Austin Semiconductor, L.P. Parallel multi wafer axial spin clean processing using spin cassette inside movable process chamber
DE202012013639U1 (de) * 2011-12-01 2018-12-06 solar-semi GmbH Vorrichtung zum Bearbeiten eines Substrats
US20140007905A1 (en) * 2012-07-09 2014-01-09 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer cleaning system and method using electrolytic gas for back-end purge
JP6198840B2 (ja) 2012-11-27 2017-09-20 エーシーエム リサーチ （シャンハイ） インコーポレーテッド 基板支持装置
CN103151291B (zh) * 2012-12-31 2016-06-01 上海新阳半导体材料股份有限公司 晶圆夹持旋转装置及晶圆清洗槽
TWI644390B (zh) * 2014-05-16 2018-12-11 大陸商盛美半導體設備（上海）有限公司 Substrate support device
TWI566327B (zh) * 2015-12-01 2017-01-11 錫宬國際有限公司 晶圓承載裝置
CN106548971A (zh) * 2016-10-11 2017-03-29 武汉新芯集成电路制造有限公司 一种湿法单片清洗机台的卡盘
JP6665760B2 (ja) * 2016-11-16 2020-03-13 日本電気硝子株式会社 ガラス基板の製造装置及び製造方法
JP6700605B2 (ja) * 2016-11-16 2020-05-27 日本電気硝子株式会社 ガラス基板の製造方法
JP6979935B2 (ja) * 2018-10-24 2021-12-15 三菱電機株式会社 半導体製造装置および半導体製造方法
CN111223809A (zh) * 2018-11-23 2020-06-02 东泰高科装备科技有限公司 一种承载半导体衬底的基座、衬底移动装置及其使用方法
CN113066752B (zh) * 2021-03-26 2021-10-08 桂林芯飞光电子科技有限公司 一种多功能吸嘴及工作方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2542589B2 (ja) * 1986-12-02 1996-10-09 株式会社東芝 露光装置
JP2649519B2 (ja) * 1987-07-21 1997-09-03 キヤノン株式会社 平板状物体移送位置決め装置
JP3173928B2 (ja) * 1992-09-25 2001-06-04 キヤノン株式会社 基板保持装置、基板保持方法および露光装置
JPH0758191A (ja) * 1993-08-13 1995-03-03 Toshiba Corp ウェハステージ装置
JP3164960B2 (ja) * 1994-02-18 2001-05-14 キヤノン株式会社 ステージ装置
US5421595A (en) * 1994-03-28 1995-06-06 Motorola, Inc. Vacuum chuck with venturi jet for converting positive pressure to a vacuum
US5692873A (en) * 1995-03-31 1997-12-02 Motorola, Inc. Apparatus for holding a piece of semiconductor
US5879576A (en) * 1996-05-07 1999-03-09 Hitachi Electronics Engineering Co., Ltd. Method and apparatus for processing substrates
AT407312B (de) * 1996-11-20 2001-02-26 Sez Semiconduct Equip Zubehoer Rotierbarer träger für kreisrunde, scheibenförmige gegenstände, insbesondere halbleiterwafer oder -substrate
US20010052392A1 (en) * 1998-02-25 2001-12-20 Masahiko Nakamura Multichamber substrate processing apparatus
US6095582A (en) * 1998-03-11 2000-08-01 Trusi Technologies, Llc Article holders and holding methods
CH695405A5 (de) * 1999-12-14 2006-04-28 Esec Trading Sa Die Bonder und Wire Bonder mit einer Ansaugvorrichtung zum Flachziehen und Niederhalten eines gewölbten Substrats.
JP2002239965A (ja) * 2001-02-09 2002-08-28 Hiroshi Akashi 調節ガイド付き無接触保持装置
US6669808B2 (en) * 2001-03-22 2003-12-30 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus and substrate processing method
JP2003031537A (ja) * 2001-07-16 2003-01-31 Tokyo Electron Ltd 基板処理装置
US6887317B2 (en) * 2002-09-10 2005-05-03 Applied Materials, Inc. Reduced friction lift pin

Also Published As

Publication number Publication date
KR101099209B1 (ko) 2011-12-27
KR20050013484A (ko) 2005-02-04
JP2005051028A (ja) 2005-02-24
US7275749B2 (en) 2007-10-02
TW200504862A (en) 2005-02-01
EP1503402A1 (en) 2005-02-02
CN1577762A (zh) 2005-02-09
TWI305939B (ja) 2009-02-01
US20050023773A1 (en) 2005-02-03
IL159757A0 (en) 2004-06-20
JP4312001B2 (ja) 2009-08-12

Similar Documents

Publication Publication Date Title
IL159757A0 (en) Substrate supporting apparatus
GB0304033D0 (en) Apparatus
SG107148A1 (en) Substrates assembly apparatus
GB0301607D0 (en) Apparatus
GB0307123D0 (en) Apparatus
GB2414457B (en) Support apparatus
AU2003275563A1 (en) Substrate washing apparatus
GB0307125D0 (en) Apparatus
GB0408643D0 (en) Support apparatus
TWI346258B (en) Substrate development apparatus
EP1628792A4 (en) SAND MOLD APPARATUS
GB2402116B (en) Support apparatus
GB0323537D0 (en) Support apparatus
GB2414456B (en) Support apparatus
GB2401809B (en) Substrate support apparatus
GB0306652D0 (en) Support apparatus
GB2393382B (en) Supporting device
GB2402327B (en) Support apparatus
GB0230296D0 (en) Support apparatus
GB0312225D0 (en) Support apparatus
GB0225559D0 (en) Support apparatus
GB0201246D0 (en) Support apparatus
GB0420698D0 (en) Support apparatus
GB2413540B (en) Support apparatus
GB2410932B (en) Support apparatus