TW200504862A - Substrate support apparatus and substrate extracting method - Google Patents
Substrate support apparatus and substrate extracting methodInfo
- Publication number
- TW200504862A TW200504862A TW092136015A TW92136015A TW200504862A TW 200504862 A TW200504862 A TW 200504862A TW 092136015 A TW092136015 A TW 092136015A TW 92136015 A TW92136015 A TW 92136015A TW 200504862 A TW200504862 A TW 200504862A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- nozzle
- support apparatus
- nozzle hole
- gas supply
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/11—Vacuum
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/17—Socket type
- Y10T279/17231—Pivoted jaws
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/18—Pivoted jaw
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003281206A JP4312001B2 (ja) | 2003-07-28 | 2003-07-28 | 基板支持装置および基板取り外し方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200504862A true TW200504862A (en) | 2005-02-01 |
TWI305939B TWI305939B (zh) | 2009-02-01 |
Family
ID=33487728
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092136015A TW200504862A (en) | 2003-07-28 | 2003-12-18 | Substrate support apparatus and substrate extracting method |
Country Status (8)
Country | Link |
---|---|
US (1) | US7275749B2 (zh) |
EP (1) | EP1503402A1 (zh) |
JP (1) | JP4312001B2 (zh) |
KR (1) | KR101099209B1 (zh) |
CN (1) | CN1577762A (zh) |
IL (1) | IL159757A0 (zh) |
SG (1) | SG118225A1 (zh) |
TW (1) | TW200504862A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI644390B (zh) * | 2014-05-16 | 2018-12-11 | 大陸商盛美半導體設備(上海)有限公司 | Substrate support device |
US10410906B2 (en) | 2012-11-27 | 2019-09-10 | Acm Research (Shanghai) Inc. | Substrate supporting apparatus |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7589297B2 (en) * | 2005-12-08 | 2009-09-15 | Boston Scientific Scimed, Inc. | Apparatus and method for cutting flat stent precursors |
KR100677994B1 (ko) * | 2005-12-27 | 2007-02-02 | 동부일렉트로닉스 주식회사 | 노광장비의 웨이퍼스테이지 센터핀 |
KR100862912B1 (ko) * | 2006-08-08 | 2008-10-13 | 무진전자 주식회사 | 기판 처리 장치 |
KR100809594B1 (ko) * | 2006-09-12 | 2008-03-04 | 세메스 주식회사 | 척킹부재 및 이를 포함하는 스핀헤드 |
JP5013400B2 (ja) * | 2006-09-29 | 2012-08-29 | 国立大学法人東北大学 | 塗布膜コーティング装置 |
WO2008065645A1 (en) * | 2006-11-27 | 2008-06-05 | Camtek Ltd. | A supporting system and a method for supporting an object |
US8042254B1 (en) * | 2006-12-22 | 2011-10-25 | Kla-Tencor Corporation | Method for improving edge handling chuck aerodynamics |
KR100900750B1 (ko) * | 2007-07-31 | 2009-06-05 | 세메스 주식회사 | 반도체 제조 설비의 무접촉 기판 지지 장치 및 그 방법 |
US20100147335A1 (en) * | 2008-02-14 | 2010-06-17 | Tokyo Electron Limited | Liquid processing apparatus, liquid processing method, and storage medium |
US8528886B2 (en) * | 2009-02-02 | 2013-09-10 | Corning Incorporated | Material sheet handling system and processing methods |
US8698099B2 (en) * | 2009-09-30 | 2014-04-15 | Kyocera Corporation | Attraction member, and attraction device and charged particle beam apparatus using the same |
JP5243491B2 (ja) * | 2010-06-18 | 2013-07-24 | 東京エレクトロン株式会社 | 位置決め装置、基板処理装置及び基準部材の固定方法 |
US20120189421A1 (en) * | 2011-01-21 | 2012-07-26 | Samsung Austin Semiconductor, L.P. | Parallel multi wafer axial spin clean processing using spin cassette inside movable process chamber |
DE102012100825A1 (de) * | 2011-12-01 | 2013-06-06 | solar-semi GmbH | Vorrichtung zum Bearbeiten eines Substrats und Verfahren hierzu |
US20140007905A1 (en) * | 2012-07-09 | 2014-01-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer cleaning system and method using electrolytic gas for back-end purge |
CN103151291B (zh) * | 2012-12-31 | 2016-06-01 | 上海新阳半导体材料股份有限公司 | 晶圆夹持旋转装置及晶圆清洗槽 |
TWI566327B (zh) * | 2015-12-01 | 2017-01-11 | 錫宬國際有限公司 | 晶圓承載裝置 |
CN106548971A (zh) * | 2016-10-11 | 2017-03-29 | 武汉新芯集成电路制造有限公司 | 一种湿法单片清洗机台的卡盘 |
JP6665760B2 (ja) * | 2016-11-16 | 2020-03-13 | 日本電気硝子株式会社 | ガラス基板の製造装置及び製造方法 |
JP6700605B2 (ja) * | 2016-11-16 | 2020-05-27 | 日本電気硝子株式会社 | ガラス基板の製造方法 |
JP6979935B2 (ja) * | 2018-10-24 | 2021-12-15 | 三菱電機株式会社 | 半導体製造装置および半導体製造方法 |
CN111223809A (zh) * | 2018-11-23 | 2020-06-02 | 东泰高科装备科技有限公司 | 一种承载半导体衬底的基座、衬底移动装置及其使用方法 |
CN113066752B (zh) * | 2021-03-26 | 2021-10-08 | 桂林芯飞光电子科技有限公司 | 一种多功能吸嘴及工作方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2542589B2 (ja) * | 1986-12-02 | 1996-10-09 | 株式会社東芝 | 露光装置 |
JP2649519B2 (ja) * | 1987-07-21 | 1997-09-03 | キヤノン株式会社 | 平板状物体移送位置決め装置 |
JP3173928B2 (ja) * | 1992-09-25 | 2001-06-04 | キヤノン株式会社 | 基板保持装置、基板保持方法および露光装置 |
JPH0758191A (ja) * | 1993-08-13 | 1995-03-03 | Toshiba Corp | ウェハステージ装置 |
JP3164960B2 (ja) * | 1994-02-18 | 2001-05-14 | キヤノン株式会社 | ステージ装置 |
US5421595A (en) * | 1994-03-28 | 1995-06-06 | Motorola, Inc. | Vacuum chuck with venturi jet for converting positive pressure to a vacuum |
US5692873A (en) * | 1995-03-31 | 1997-12-02 | Motorola, Inc. | Apparatus for holding a piece of semiconductor |
US5879576A (en) * | 1996-05-07 | 1999-03-09 | Hitachi Electronics Engineering Co., Ltd. | Method and apparatus for processing substrates |
AT407312B (de) * | 1996-11-20 | 2001-02-26 | Sez Semiconduct Equip Zubehoer | Rotierbarer träger für kreisrunde, scheibenförmige gegenstände, insbesondere halbleiterwafer oder -substrate |
US20010052392A1 (en) * | 1998-02-25 | 2001-12-20 | Masahiko Nakamura | Multichamber substrate processing apparatus |
US6095582A (en) * | 1998-03-11 | 2000-08-01 | Trusi Technologies, Llc | Article holders and holding methods |
CH695405A5 (de) * | 1999-12-14 | 2006-04-28 | Esec Trading Sa | Die Bonder und Wire Bonder mit einer Ansaugvorrichtung zum Flachziehen und Niederhalten eines gewölbten Substrats. |
JP2002239965A (ja) * | 2001-02-09 | 2002-08-28 | Hiroshi Akashi | 調節ガイド付き無接触保持装置 |
US6669808B2 (en) | 2001-03-22 | 2003-12-30 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus and substrate processing method |
JP2003031537A (ja) * | 2001-07-16 | 2003-01-31 | Tokyo Electron Ltd | 基板処理装置 |
US6887317B2 (en) * | 2002-09-10 | 2005-05-03 | Applied Materials, Inc. | Reduced friction lift pin |
-
2003
- 2003-07-28 JP JP2003281206A patent/JP4312001B2/ja not_active Expired - Lifetime
- 2003-12-18 TW TW092136015A patent/TW200504862A/zh not_active IP Right Cessation
- 2003-12-30 KR KR1020030099646A patent/KR101099209B1/ko not_active IP Right Cessation
-
2004
- 2004-01-06 US US10/751,478 patent/US7275749B2/en not_active Expired - Fee Related
- 2004-01-06 SG SG200400038A patent/SG118225A1/en unknown
- 2004-01-07 IL IL15975704A patent/IL159757A0/xx unknown
- 2004-01-12 CN CNA2004100016330A patent/CN1577762A/zh active Pending
- 2004-01-13 EP EP04000542A patent/EP1503402A1/en not_active Withdrawn
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10410906B2 (en) | 2012-11-27 | 2019-09-10 | Acm Research (Shanghai) Inc. | Substrate supporting apparatus |
TWI644390B (zh) * | 2014-05-16 | 2018-12-11 | 大陸商盛美半導體設備(上海)有限公司 | Substrate support device |
Also Published As
Publication number | Publication date |
---|---|
KR101099209B1 (ko) | 2011-12-27 |
US7275749B2 (en) | 2007-10-02 |
KR20050013484A (ko) | 2005-02-04 |
EP1503402A1 (en) | 2005-02-02 |
SG118225A1 (en) | 2006-01-27 |
TWI305939B (zh) | 2009-02-01 |
US20050023773A1 (en) | 2005-02-03 |
CN1577762A (zh) | 2005-02-09 |
IL159757A0 (en) | 2004-06-20 |
JP2005051028A (ja) | 2005-02-24 |
JP4312001B2 (ja) | 2009-08-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |