TW200833430A - Methods and apparatus for cleaning chamber components - Google Patents

Methods and apparatus for cleaning chamber components

Info

Publication number
TW200833430A
TW200833430A TW096141240A TW96141240A TW200833430A TW 200833430 A TW200833430 A TW 200833430A TW 096141240 A TW096141240 A TW 096141240A TW 96141240 A TW96141240 A TW 96141240A TW 200833430 A TW200833430 A TW 200833430A
Authority
TW
Taiwan
Prior art keywords
orifice
methods
cleaning solution
cleaning chamber
chamber components
Prior art date
Application number
TW096141240A
Other languages
Chinese (zh)
Other versions
TWI381888B (en
Inventor
Felix Rabinovich
Thomas Echols
Janet Maleshi
Ning Chen
Samantha S H Tan
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200833430A publication Critical patent/TW200833430A/en
Application granted granted Critical
Publication of TWI381888B publication Critical patent/TWI381888B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • B08B9/02—Cleaning pipes or tubes or systems of pipes or tubes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4407—Cleaning of reactor or reactor parts by using wet or mechanical methods

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

In a first aspect, a method for cleaning a semiconductor fabrication chamber component having an orifice is provided. The method includes (A) placing the component into a bath having a cleaning solution; (B) flowing a fluid into the orifice thereby maintaining at least a first portion of the orifice free from cleaning solution while the cleaning solution cleans the component; and (C) withdrawing the fluid from the orifice such that cleaning solution enters into the first portion of the orifice and cleans the first portion of the orifice. Numerous other aspects are also provided.
TW096141240A 2006-11-01 2007-11-01 Methods and apparatus for cleaning chamber components TWI381888B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86390606P 2006-11-01 2006-11-01

Publications (2)

Publication Number Publication Date
TW200833430A true TW200833430A (en) 2008-08-16
TWI381888B TWI381888B (en) 2013-01-11

Family

ID=39365035

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096141240A TWI381888B (en) 2006-11-01 2007-11-01 Methods and apparatus for cleaning chamber components

Country Status (5)

Country Link
US (1) US7789969B2 (en)
JP (1) JP5156752B2 (en)
KR (1) KR101432161B1 (en)
TW (1) TWI381888B (en)
WO (1) WO2008057351A2 (en)

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Also Published As

Publication number Publication date
JP2010508145A (en) 2010-03-18
US7789969B2 (en) 2010-09-07
KR101432161B1 (en) 2014-08-20
WO2008057351A2 (en) 2008-05-15
WO2008057351A3 (en) 2008-10-16
JP5156752B2 (en) 2013-03-06
TWI381888B (en) 2013-01-11
US20080099054A1 (en) 2008-05-01
KR20090091153A (en) 2009-08-26

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